WAFER SCANNING
    2.
    发明申请
    WAFER SCANNING 审中-公开
    WAFER扫描

    公开(公告)号:WO2006132998A2

    公开(公告)日:2006-12-14

    申请号:PCT/US2006021531

    申请日:2006-06-02

    CPC classification number: G01N21/9501 H01L21/67288

    Abstract: A semiconductor wafer measuring device including a wafer mover adapted to move a semiconductor wafer; a measurement head adapted to scan a surface of the semiconductor wafer as the semiconductor wafer is moved by the wafer mover; and a controller. The controller is adapted to control movement of the wafer mover to provide a first scanning segment of a first portion of the surface of the semiconductor wafer without rotating the semiconductor wafer during the first scanning segment, a second scanning segment of a second different portion of the surface of the semiconductor wafer without rotating the semiconductor wafer during the second scanning segment; and rotating the semiconductor wafer between the first and second scanning segments.

    Abstract translation: 一种半导体晶片测量装置,包括适于移动半导体晶片的晶片移动器; 测量头,其适于在晶片移动器移动半导体晶片时扫描半导体晶片的表面; 和控制器。 控制器适于控制晶片移动器的运动,以在半导体晶片的表面的第一部分提供第一扫描段,而不在第一扫描段期间旋转半导体晶片,第二扫描段的第二不同部分 在第二扫描段期间不使半导体晶片旋转的半导体晶片的表面; 以及在第一和第二扫描段之间旋转半导体晶片。

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