公开(公告)号：US20240190702A1

公开(公告)日：2024-06-13

申请号：US18534658

申请日：2023-12-10

Applicant: Robert Bosch GmbH

Inventor： Gregor Schuermann ,  Pascal Gieschke

IPC: B81C1/00

CPC classification number: B81C1/00833 ,  B81C2201/0171 ,  B81C2201/0177

Abstract: A semiconductor component. The semiconductor component has a semiconductor substrate, an insulation layer, and a first monocrystalline silicon layer. The insulation layer is arranged on the semiconductor substrate, and the first monocrystalline silicon layer is arranged on the insulation layer and at least one first region that extends starting from the first monocrystalline silicon layer up to a surface of the semiconductor substrate. The at least one first region includes second monocrystalline silicon.

公开(公告)号：US11952263B2

公开(公告)日：2024-04-09

申请号：US17419511

申请日：2020-02-05

Applicant: Robert Bosch GmbH

Inventor： Mike Schwarz ,  Pascal Gieschke ,  Valentina Kramer-Sinzinger

IPC: B81B3/00

CPC classification number: B81B3/0018 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/033

Abstract: A micromechanical sensor device and manufacturing method. The micromechanical sensor device is provided with a cap substrate, which has a first front side and a first back side, and which has a through-opening as a media entry region; and with a sensor substrate, which has a second front side and a second back side, and which has, on the second front side, a sensor region that is embedded in an island-like region suspended on the remaining sensor substrate. The island-like region is mechanically decoupled from the remaining sensor substrate by a lateral stress-relief trench and by a cavity situated in the sensor substrate, underneath the island-like region. The first back side is bonded to the second front side so that the through opening is situated above the sensor region. The sensor region is covered by a gel, which fills the through-opening and the stress-relief trench at least partially.

公开(公告)号：US20220081281A1

公开(公告)日：2022-03-17

申请号：US17419511

申请日：2020-02-05

Applicant: Robert Bosch GmbH

Inventor： Mike Schwarz ,  Pascal Gieschke ,  Valentina Kramer-Sinzinger

IPC: B81B3/00

Abstract: A micromechanical sensor device and manufacturing method. The micromechanical sensor device is provided with a cap substrate, which has a first front side and a first back side, and which has a through-opening as a media entry region; and with a sensor substrate, which has a second front side and a second back side, and which has, on the second front side, a sensor region that is embedded in an island-like region suspended on the remaining sensor substrate. The island-like region is mechanically decoupled from the remaining sensor substrate by a lateral stress-relief trench and by a cavity situated in the sensor substrate, underneath the island-like region. The first back side is bonded to the second front side so that the through opening is situated above the sensor region. The sensor region is covered by a gel, which fills the through-opening and the stress-relief trench at least partially.