公开(公告)号：JPS5567407A

公开(公告)日：1980-05-21

申请号：JP13920279

申请日：1979-10-26

Applicant: ROGERS CORP

Inventor： DABITSUTO EMU HAUE ,  JIEFURII BII OTSUTOO ,  RICHIYAADO TEI TORASUKOSU

IPC: B29B9/06 ,  B29B9/08 ,  B29B13/02 ,  B29B13/10 ,  B29K79/00 ,  C08J3/12

公开(公告)号：JPS59184587A

公开(公告)日：1984-10-19

申请号：JP6506584

申请日：1984-03-31

Applicant: Rogers Corp

Inventor： FURANSHISU ESU GAAREI ,  RICHIYAADO TEI TORASUKOSU ,  POORU ERU ANDAASON

IPC: H05K1/02 ,  H05K1/00 ,  H05K1/03 ,  H05K3/00

CPC classification number: H05K1/0366 ,  H05K1/0313 ,  H05K1/0393 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/057

公开(公告)号：JPH0629667A

公开(公告)日：1994-02-04

申请号：JP13827991

申请日：1991-05-13

Applicant: ROGERS CORP

Inventor： SAMIYUERU GAJITSUTO ,  RICHIYAADO TEI TORASUKOSU ,  RENAADO ESU KARABURIIZU ,  MAIKERU JIEI TEIRAA

IPC: H05K3/00 ,  H05K1/02 ,  H05K3/46

Abstract: PURPOSE: To make bending of a flexible circuit easier by making a bending part have rigidity lower than a flexible circuit part. CONSTITUTION: A flexible circuit 10 comprises, along most of its entire length, the first layer or a bottom part layer 12 of an insulation material, preferably polyimide material, the first layer or a bottom part layer 14 of a bonding agent, a layer of a circuit wire material 16 of copper, and the second or an upper part layer 20 of a bonding agent 18. The flexible circuit 10 is designed so that an interval 22 is equal to a specified bending part, while the specified bending part has a different structure from a remaining part of the flexible circuit 10. Polyimide layers 12 and 20 are especially removed or omitted from the specified bending part, while in that case, the bending part comprises only the bottom part bonding agent layer 14, a circuit wire material 16, and the upper part bonding agent layer 18. Even with the polyimide layers 12 and 20 omitted, the bonding agent layers 14 and 18 remain to work as electric insulation and protection of the circuit wire material 16.