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    CHEMICAL MECHANICAL PLANARIZATION USING NANODIAMOND
    1.
    发明申请
    CHEMICAL MECHANICAL PLANARIZATION USING NANODIAMOND 审中-公开
    使用NANODIAMOND的化学机械平面化

    公开(公告)号：WO2010105240A2

    公开(公告)日：2010-09-16

    申请号：PCT/US2010027250

    申请日：2010-03-12

    Applicant: SAINT GOBAIN CERAMICS

    Inventor： WANG JUN ,  LACONTO RONALD ,  HAERLE ANDREW

    IPC: C09K3/14

    CPC classification number: H01L21/30625 ,  B24B37/00 ,  C09G1/02 ,  C09K3/1409 ,  C09K3/1463 ,  H01L21/02024 ,  H01L29/1608

    Abstract: A method for chemical mechanical polishing of a substrate includes polishing the substrate at a stock removal rate of greater than about 2.5 Å/min to achieve a Ra of not greater than about 5.0 Å. The substrate can be a III-V substrate or a SiC substrate. The polishing utilizes a chemical mechanical polishing slurry comprising ultra-dispersed diamonds and at least 80 wt% water.

    Abstract translation: 用于基材的化学机械抛光的方法包括以大于约2.5 /分钟的原料去除速率抛光基材以达到Ra不大于约。 衬底可以是III-V衬底或SiC衬底。 抛光使用包含超分散金刚石和至少80重量％水的化学机械抛光浆料。

    POLISHING SLURRY INCLUDING ZIRCONIA PARTICLES AND A METHOD OF USING THE POLISHING SLURRY
    3.
    发明申请
    POLISHING SLURRY INCLUDING ZIRCONIA PARTICLES AND A METHOD OF USING THE POLISHING SLURRY 审中-公开
    包括ZIRCONIA颗粒的抛光浆料和使用抛光浆料的方法

    公开(公告)号：WO2012092361A3

    公开(公告)日：2013-03-28

    申请号：PCT/US2011067565

    申请日：2011-12-28

    Applicant: SAINT GOBAIN CERAMICS

    Inventor： HAERLE ANDREW G ,  WANG JUN ,  WISS FREDERIC

    IPC: C09K3/14 ,  B24B1/00

    CPC classification number: C09K3/1409 ,  B24B37/044 ,  C01G25/02 ,  C01P2002/52 ,  C01P2002/76 ,  C01P2004/50 ,  C01P2004/51 ,  C01P2004/62 ,  C01P2004/64 ,  C01P2006/10 ,  C01P2006/12 ,  C01P2006/16 ,  C01P2006/22 ,  C01P2006/40 ,  C09G1/02 ,  H01L21/304 ,  Y10T428/2982

    Abstract: A polishing slurry can include zirconia particles. The polishing slurry can be used to polish conductive and insulating materials, and is particularly well suited for polishing oxide materials as well as metals. The characteristics of the zirconia particles can affect the polishing of workpieces. By selecting the proper characteristics, the polishing slurry can have a good material removal rate while still providing an acceptable surface finish. The zirconia particles can be used as a replacement for, or in conjunction with, ceria or other abrasive particles. The content of zirconia particles in the polishing slurry may be less than a comparable polishing slurry having silica or alumina particles.

    Abstract translation: 抛光浆料可以包括氧化锆颗粒。 抛光浆料可用于抛光导电和绝缘材料，并且特别适用于抛光氧化物材料以及金属。 氧化锆颗粒的特性可影响工件的抛光。 通过选择适当的特性，抛光浆料可以具有良好的材料去除率，同时仍然提供可接受的表面光洁度。 氧化锆颗粒可用作二氧化铈或其他磨料颗粒的替代物或与其结合使用。 抛光浆料中的氧化锆颗粒的含量可以小于具有二氧化硅或氧化铝颗粒的可比较的抛光浆料。

    Abrasive alumina particulate material, and method of planarizing a workpiece using the abrasive
    9.
    发明专利
    Abrasive alumina particulate material, and method of planarizing a workpiece using the abrasive 未知

    公开(公告)号：NZ567318A

    公开(公告)日：2011-06-30

    申请号：NZ56731806

    申请日：2006-10-13

    Applicant: SAINT GOBAIN CERAMICS

    Inventor： HAERLE ANDREW G ,  WANG JUN

    IPC: C09K3/14 ,  C01F7/02 ,  C09G1/02

    Abstract: Disclosed is an abrasive particulate material comprising: alumina particles comprising transition alumina and at least 5.0wt% and not greater than about 40 wt% of an amorphous phase, the alumina particles having a density not greater than about 3.00g/cm3, a primary particle size not greater than about 85 nm, and a specific surface area of not less than about 100 m2/g. Also disclosed is a method of forming the above material comprising: providing feedstock particles containing principally transition alumina; and milling the feedstock particles to form the above material, wherein milling comprises wet-milling in an acidic solution having a pH of less than 5.0.

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