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1.发明申请POLISHING SLURRY INCLUDING ZIRCONIA PARTICLES AND A METHOD OF USING THE POLISHING SLURRY 审中-公开包括ZIRCONIA颗粒的抛光浆料和使用抛光浆料的方法
公开(公告)号：WO2012092361A3
公开(公告)日：2013-03-28
申请号：PCT/US2011067565
申请日：2011-12-28
Applicant: SAINT GOBAIN CERAMICS
Inventor： HAERLE ANDREW G , WANG JUN , WISS FREDERIC
CPC classification number: C09K3/1409 , B24B37/044 , C01G25/02 , C01P2002/52 , C01P2002/76 , C01P2004/50 , C01P2004/51 , C01P2004/62 , C01P2004/64 , C01P2006/10 , C01P2006/12 , C01P2006/16 , C01P2006/22 , C01P2006/40 , C09G1/02 , H01L21/304 , Y10T428/2982
Abstract: A polishing slurry can include zirconia particles. The polishing slurry can be used to polish conductive and insulating materials, and is particularly well suited for polishing oxide materials as well as metals. The characteristics of the zirconia particles can affect the polishing of workpieces. By selecting the proper characteristics, the polishing slurry can have a good material removal rate while still providing an acceptable surface finish. The zirconia particles can be used as a replacement for, or in conjunction with, ceria or other abrasive particles. The content of zirconia particles in the polishing slurry may be less than a comparable polishing slurry having silica or alumina particles.
Abstract translation: 抛光浆料可以包括氧化锆颗粒。 抛光浆料可用于抛光导电和绝缘材料，并且特别适用于抛光氧化物材料以及金属。 氧化锆颗粒的特性可影响工件的抛光。 通过选择适当的特性，抛光浆料可以具有良好的材料去除率，同时仍然提供可接受的表面光洁度。 氧化锆颗粒可用作二氧化铈或其他磨料颗粒的替代物或与其结合使用。 抛光浆料中的氧化锆颗粒的含量可以小于具有二氧化硅或氧化铝颗粒的可比较的抛光浆料。
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2.发明公开POLISHING SLURRY INCLUDING ZIRCONIA PARTICLES AND A METHOD OF USING THE POLISHING SLURRY 审中-公开抛光用氧化锆颗粒和使用该抛光方法
公开(公告)号：EP2658943A4
公开(公告)日：2015-09-30
申请号：EP11853515
申请日：2011-12-28
Applicant: SAINT GOBAIN CERAMICS
Inventor： HAERLE ANDREW G , WANG JUN , WISS FREDERIC
IPC: C01G25/02 , B24B37/04 , C09G1/02 , H01L21/304
CPC classification number: C09K3/1409 , B24B37/044 , C01G25/02 , C01P2002/52 , C01P2002/76 , C01P2004/50 , C01P2004/51 , C01P2004/62 , C01P2004/64 , C01P2006/10 , C01P2006/12 , C01P2006/16 , C01P2006/22 , C01P2006/40 , C09G1/02 , H01L21/304 , Y10T428/2982
Abstract: A polishing slurry can include zirconia particles. The polishing slurry can be used to polish conductive and insulating materials, and is particularly well suited for polishing oxide materials as well as metals. The characteristics of the zirconia particles can affect the polishing of workpieces. By selecting the proper characteristics, the polishing slurry can have a good material removal rate while still providing an acceptable surface finish. The zirconia particles can be used as a replacement for, or in conjunction with, ceria or other abrasive particles. The content of zirconia particles in the polishing slurry may be less than a comparable polishing slurry having silica or alumina particles.
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