公开(公告)号：WO2007061429A3

公开(公告)日：2007-10-04

申请号：PCT/US2006000753

申请日：2006-01-09

Applicant: SANMINA SCI CORP

Inventor： GISIN FRANZ ,  SCHROEDER GREG

IPC: H05K1/11

CPC classification number: H05K1/116 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0245 ,  H05K1/0251 ,  H05K3/429 ,  H05K2201/09236 ,  H05K2201/09718 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A printed circuit board with improved signal integrity for one or more differential signal pairs incorporates one or more conductive regions. In an exemplary embodiment, via structures for the differential pair that interconnect signal traces are isolated from the conductive region by an antipad area around the via structures and a conductive bridge. In alternate embodiment, an antipad area around the via structures includes a bridge between the via structures. The antipad area may comprise, by way of non-limiting example, a clipped circular aperture or a modified rectangular aperture. The bridge may, by non-limiting examples, comprise a portion of the conductive region to permit impedance tailoring of the differential pair with respect to the conductive region.

Abstract translation: 对于一个或多个差分信号对具有改进的信号完整性的印刷电路板包括一个或多个导电区域。 在示例性实施例中，将信号迹线互连的差分对的通孔结构通过通孔结构和导电桥周围的止动区与导电区隔离。 在替代实施例中，通孔结构周围的止血区域包括通孔结构之间的桥。 作为非限制性示例，止血区域可以包括夹紧的圆形孔或修改的矩形孔。 通过非限制性示例，桥可以包括导电区域的一部分，以允许差分对相对于导电区域的阻抗调整。