公开(公告)号：WO2011087820A3

公开(公告)日：2011-11-10

申请号：PCT/US2010061682

申请日：2010-12-21

Applicant: SANMINA SCI CORP ,  HINKLE JONATHAN R ,  SWEERE PAUL

Inventor： HINKLE JONATHAN R ,  SWEERE PAUL

IPC: G06F13/14 ,  G06F13/38

CPC classification number: G06F13/20 ,  G06F12/0246 ,  G06F13/1668 ,  G06F13/1684 ,  G06F13/1694 ,  G06F2212/205 ,  G11C5/04

Abstract: A memory/storage module is provided that implements a solid state drive compatible with Serial Advanced Technology Attachment (SATA) or Serial Attached SCSI (SAS) signaling on a double-data-rate compatible socket. A detachable daughter card may be coupled to the memory module for converting a memory bus voltage to a second voltage for memory devices on the memory module. Additionally, a hybrid memory bus on a host system is provided that supports either DDR-compatible memory modules and/or SATA/SAS- compatible memory modules. In one example, the memory/storage module couples to a first bus (DDR3 compatible socket) to obtain voltage and/or other signals, but uses a second bus for data transfers. In another example, the memory module may repurpose/reuse electrical paths that typically carry non-data signals for data traffic to/from the memory/storage module. Such data traffic for the memory/storage module permits concurrent data traffic for other memory modules on the same memory bus.

Abstract translation: 提供的存储器/存储模块实现了与双数据速率兼容插座上的串行高级技术附件（SATA）或串行连接SCSI（SAS）信令兼容的固态驱动器。 可拆卸的子卡可以耦合到存储器模块，用于将存储器总线电压转换成用于存储器模块上的存储器设备的第二电压。 此外，还提供主机系统上的混合存储器总线，支持DDR兼容存储器模块和/或SATA / SAS兼容存储器模块。 在一个示例中，存储器/存储模块耦合到第一总线（DDR3兼容插座）以获得电压和/或其它信号，但使用第二总线进行数据传输。 在另一个示例中，存储器模块可以重新设置/重新使用通常携带非数据信号的电通路用于去往/来自存储器/存储模块的数据通信量。 存储器/存储模块的这种数据通信允许同一存储器总线上的其他存储器模块的并发数据通信。

公开(公告)号：WO2007084966A3

公开(公告)日：2008-04-10

申请号：PCT/US2007060727

申请日：2007-01-18

Applicant: SANMINA SCI CORP ,  RONY SHACHAR

Inventor： RONY SHACHAR

IPC: G06F7/00

CPC classification number: H05K1/0266 ,  G05B19/128 ,  G05B19/4183 ,  G05B2219/33199 ,  G05B2219/45031 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/10098 ,  Y02P90/10

Abstract: A radio frequency identification (RFID) tag is coupled to a circuit board to track the specific operating and environmental conditions of each manufacturing stage as the circuit board passes through the manufacturing stages. An RFID reader and data collector are used at each stage to read the RFID tag and store its identifying information along with processing information, operating conditions, and results for each stage. This permits to quickly and accurately collect manufacturing information for each circuit board at various manufacturing stages as well as the operating conditions for each stage at a particular time. Such manufacturing metrics can then be retrieved on a stage-by-stage basis for a particular circuit board by an identifier printed on the circuit board.

Abstract translation: 射频识别（RFID）标签被耦合到电路板以跟踪电路板通过制造阶段的每个制造阶段的特定操作和环境条件。 在每个阶段都使用RFID阅读器和数据采集器来读取RFID标签，并将其识别信息与每个阶段的处理信息，操作条件和结果一起存储。 这允许在各个制造阶段快速准确地收集每个电路板的制造信息以及在特定时间的每个阶段的操作条件。 然后可以通过印刷在电路板上的标识符逐级地为特定电路板检索这样的制造度量。

公开(公告)号：WO2006058341A2

公开(公告)日：2006-06-01

申请号：PCT/US2005043253

申请日：2005-11-29

Applicant: SANMINA SCI CORP ,  STERNER ANDERS

Inventor： STERNER ANDERS

IPC: H05K7/20

CPC classification number: H05K7/20145 ,  H05K7/20572

Abstract: A base station system and method for base station heat dissipation using chimneys where the base station system comprises a first structure, an enclosure, and a chimney. The first structure supports base station circuitry that generates heat. The enclosure encloses the first structure and the base station circuitry and forms an internal space. The chimney comprises a second structure forming dedicated space for heat dissipation. The chimney transfers the heat generated by the base station circuitry from the internal space to an external space outside the enclosure.

Abstract translation: 一种使用烟囱的基站散热的基站系统和方法，其中基站系统包括第一结构，外壳和烟囱。 第一个结构支持产生热量的基站电路。 外壳包围第一个结构和基站电路，并形成一个内部空间。 烟囱包括形成用于散热的专用空间的第二结构。 烟囱将基站电路产生的热量从内部空间传递到外壳外部的外部空间。

公开(公告)号：WO2011087820A8

公开(公告)日：2012-03-22

申请号：PCT/US2010061682

申请日：2010-12-21

Applicant: SANMINA SCI CORP ,  HINKLE JONATHAN R ,  SWEERE PAUL

Inventor： HINKLE JONATHAN R ,  SWEERE PAUL

IPC: G06F13/14 ,  G06F13/38

CPC classification number: G06F13/20 ,  G06F12/0246 ,  G06F13/1668 ,  G06F13/1684 ,  G06F13/1694 ,  G06F2212/205 ,  G11C5/04

Abstract: A memory/storage module is provided that implements a solid state drive compatible with Serial Advanced Technology Attachment (SATA) or Serial Attached SCSI (SAS) signaling on a double-data-rate compatible socket. A detachable daughter card may be coupled to the memory module for converting a memory bus voltage to a second voltage for memory devices on the memory module. Additionally, a hybrid memory bus on a host system is provided that supports either DDR-compatible memory modules and/or SATA/SAS- compatible memory modules. In one example, the memory/storage module couples to a first bus (DDR3 compatible socket) to obtain voltage and/or other signals, but uses a second bus for data transfers. In another example, the memory module may repurpose/reuse electrical paths that typically carry non-data signals for data traffic to/from the memory/storage module. Such data traffic for the memory/storage module permits concurrent data traffic for other memory modules on the same memory bus.

Abstract translation: 提供了一个存储器/存储模块，它实现与双数据速率兼容插座上的串行高级技术附件（SATA）或串行连接SCSI（SAS）信号兼容的固态驱动器。 可拆卸子卡可以耦合到存储器模块，用于将存储器总线电压转换为存储器模块上的存储器件的第二电压。 此外，提供了主机系统上的混合存储器总线，其支持DDR兼容存储器模块和/或SATA / SAS兼容存储器模块。 在一个示例中，存储/存储模块耦合到第一总线（DDR3兼容插座）以获得电压和/或其他信号，但是使用第二总线进行数据传输。 在另一示例中，存储器模块可以重新调整/重新使用通常携带用于/从存储/存储模块的数据业务的非数据信号的电路径。 用于存储/存储模块的这种数据业务允许同一存储器总线上的其他存储器模块的并发数据业务。

公开(公告)号：WO2006115993A2

公开(公告)日：2006-11-02

申请号：PCT/US2006014914

申请日：2006-04-19

Applicant: SANMINA SCI CORP

Inventor： AAPRO EINO ,  SHARP ANTHONY ,  HUDZ ANDREW

IPC: F25B41/00

CPC classification number: F28D1/0477 ,  F28D2001/0266 ,  F28D2021/0031 ,  F28F1/32 ,  F28F13/06 ,  H05K7/20645

Abstract: A technique for cooling an air flow through a heat exchanger device involves a controlled change of direction from an air input direction to cooling fins in the heat exchanger device. The heat exchanger device is angled relative to the air stream input direction. The heat exchanger device may include a fluid-carrying conduit, a plurality of sets of cooling fins coupled along the fluid-carrying conduit, and a plurality of air stream deflectors, coupled to the fluid- carrying conduit, that form dividers between the sets of cooling fins. In operation, the air stream deflectors may change in a controlled manner air stream direction from the air stream input direction into a direction approximately parallel with the cooling fins and, after passing out of the cooling fins, change in a controlled manner air stream direction to an air stream output direction.

Abstract translation: 用于冷却通过热交换器装置的空气流的技术包括从空气输入方向到热交换器装置中的冷却翅片的方向的受控变化。 热交换器装置相对于空气流输入方向成角度。 热交换器装置可以包括流体承载导管，沿流体承载导管连接的多组冷却片，以及耦合到流体承载导管的多个气流导流器，它们在两组 散热片 在操作中，空气流偏转器可以以受控的方式从空气流输入方向改变为与冷却翅片大致平行的方向，并且在冷却翅片通过之后，以受控的方式将气流方向改变为 气流输出方向。

公开(公告)号：WO2006094307A2

公开(公告)日：2006-09-08

申请号：PCT/US2006008334

申请日：2006-03-06

Applicant: SANMINA SCI CORP

Inventor： DUDNIKOV GEORGE JR ,  GISIN FRANZ

CPC classification number: H05K3/429 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/116 ,  H05K1/167 ,  H05K3/184 ,  H05K3/422 ,  H05K2201/0187 ,  H05K2201/0738 ,  H05K2201/096 ,  H05K2201/09645 ,  H05K2201/09718 ,  H05K2201/09881 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Systems and methods for simultaneously partitioning a plurality of via structures into electrically isolated portions by using plating resist within a PCB stackup are disclosed. Such via structures are made by selectively depositing plating resist in one or more locations in a sub-composite structure. A plurality of sub-composite structures with plating resist deposited in varying locations are laminated to form a PCB stackup of a desired PCB design. Through-holes are drilled through the PCB stackup through conductive layers, dielelectric layers and through the plating resist. Thus, the PCB panel has multiple through-holes that can then be plated simultaneously by placing the PCB panel into a seed bath, followed by immersion in an electroless copper bath. Such partitioned vias increase wiring density and limit stub formation in via structures. Such partitioned vias allow a plurality of electrical signals to traverse each electrically isolated portion without interference from each other.

Abstract translation: 公开了通过在PCB堆叠中使用电镀抗蚀剂将多个通孔结构同时分隔成电隔离部分的系统和方法。 通过在子复合结构中的一个或多个位置选择性地沉积电镀抗蚀剂来制造这种通孔结构。 具有在不同位置沉积的电镀抗蚀剂的多个亚复合结构层压以形成期望的PCB设计的PCB堆叠。 通过导电层，电介质层和电镀抗蚀剂在PCB堆叠中钻出通孔。 因此，PCB面板具有多个通孔，然后可以通过将PCB面板放置在种子池中，然后浸入无电解铜浴中而同时进行电镀。 这种分隔的通孔增加布线密度并限制通孔结构中的短截线形成。 这种分隔的通孔允许多个电信号穿过每个电隔离部分而没有彼此的干扰。

公开(公告)号：WO2004066110A3

公开(公告)日：2005-06-23

申请号：PCT/US2004000697

申请日：2004-01-12

Applicant: SANMINA SCI CORP ,  THOMPSON GREGORY K ,  GARDNER TERRY W ,  SMITH JIMMY ,  MILLS RON

Inventor： THOMPSON GREGORY K ,  GARDNER TERRY W ,  SMITH JIMMY ,  MILLS RON

IPC: G06F20060101 ,  G07C9/00 ,  G07F7/02 ,  G07F19/00 ,  G07G1/00 ,  G09G5/00 ,  G06F17/60

CPC classification number: G07F7/02 ,  G06Q20/206 ,  G06Q20/382 ,  G06Q30/018 ,  G06Q30/0201 ,  G06Q30/0225 ,  G06Q40/00 ,  G06Q40/128 ,  G07C9/00158 ,  G07F19/20 ,  G07F19/207 ,  G07G1/0027

Abstract: System terminal integrated with biometric sensor, such as a fingerprint sensor. Transaction terminal such as a point of sale system, automated teller machine (ATM) or other system. The system may include a touch screen display. Also, logic to process sales transactions may be included. The transaction terminal may include a cash drawer. The system authenticates users based on data from the sensor, and can regulate access, for example to a cash drawer, based on the authentication. Also described is a sensor module, security system, and method of operating a transaction terminal.

Abstract translation: 与生物识别传感器集成的系统终端，如指纹传感器。 交易终端，如销售点系统，自动取款机（ATM）或其他系统。 该系统可以包括触摸屏显示器。 此外，可以包括处理销售交易的逻辑。 交易终端可以包括现金抽屉。 该系统基于来自传感器的数据对用户进行认证，并且可以基于身份验证来规范对现金抽屉的访问。 还描述了一种操作交易终端的传感器模块，安全系统和方法。

公开(公告)号：WO2004049401A3

公开(公告)日：2005-02-17

申请号：PCT/US0337439

申请日：2003-11-20

Applicant: SANMINA SCI CORP ,  BIUNNO NICHOLAS ,  PATEL ATUL ,  OGLE KEN ,  DUDNIKOV GEORGE

Inventor： BIUNNO NICHOLAS ,  PATEL ATUL ,  OGLE KEN ,  DUDNIKOV GEORGE

IPC: H01C17/242 ,  H05K1/11 ,  H05K1/16 ,  H05K3/02 ,  B23K26/38

CPC classification number: H05K1/167 ,  B23K26/351 ,  H01C17/242 ,  H05K1/116 ,  H05K3/027 ,  H05K2203/171

Abstract: Improved systems and methods for laser trimming resistors printed on a substrate layer are provided. An exemplary embodiment measures a resistance value for each annular resistor and sorts the annular resistors into one or more bins based on the measured resistance values and target resistance values associated with each resistor. A laser trim file may then be assigned to each bin based on a predictive trim formulation, where each laser trim file defines a set of configuration parameters for a laser drill to conform each resistor with their respective target value. The laser drill uses the laser trim files to trim the resistors within each bin in accordance with the laser trim file assigned to that bin.

Abstract translation: 提供了改进的印刷在基底层上的激光微调电阻的系统和方法。 示例性实施例测量每个环形电阻器的电阻值，并且基于所测量的电阻值和与每个电阻器相关联的目标电阻值，将环形电阻器排列成一个或多个箱体。 然后可以基于预测装饰配方将激光修剪文件分配给每个仓，其中每个激光修剪文件定义一组激光钻孔的配置参数，以使每个电阻器与其各自的目标值一致。 激光钻孔机使用激光修剪文件根据分配给该纸盒的激光修剪文件来修整每个纸槽内的电阻器。

公开(公告)号：WO2004040724A3

公开(公告)日：2004-11-11

申请号：PCT/US0333621

申请日：2003-10-24

Applicant: SANMINA SCI CORP

Inventor： SHARP ANTHONY C ,  CLARKE MICHAEL J

IPC: H05K7/20

CPC classification number: H05K7/20754 ,  A62C3/16 ,  A62C99/0018 ,  H05K7/20609

Abstract: An integrated cabinet or a group of cabinets for supporting electronic equipment includes racks or other means for supporting the electronic equipment, hear management by liquid cooling, fire suppression systems, uninterruptible power supplies, power quality management, remote monitoring and control of cabinet parameters, such as temperature, humidity, intrusion, etc., a command center unit for connecting with and providing remoter control and management of the electronic equipment contained within the cabinet(s), EMC/RFI/EMI containment and filters, seismic construction to comply with earthquake resistance standards, and acoustic noise control system.

Abstract translation: 用于支持电子设备的集成机柜或一组机柜包括机架或其他支持电子设备的手段，通过液体冷却管理，消防系统，不间断电源，电源质量管理，机柜参数的远程监控和控制等 作为温度，湿度，入侵等的指挥中心单元，用于连接并提供包含在机柜内的电子设备的远程控制和管理，EMC / RFI / EMI抑制和过滤器，地震构造以符合地震 电阻标准和声学噪声控制系统。

公开(公告)号：WO2011139866A3

公开(公告)日：2012-02-16

申请号：PCT/US2011034406

申请日：2011-04-29

Applicant: SANMINA SCI CORP ,  WILKE JEFFREY DAVID

Inventor： WILKE JEFFREY DAVID

IPC: G11B33/02

CPC classification number: G06F1/187

Abstract: A built-in dual purpose interposer device for a data storage device carrier mechanism is provided. The interposer device may fill empty or voided space in the carrier mechanism created when a data storage device is changed between a "direct plug" position, or first configuration, and an "interposer" position, or second configuration. The interposer device may be changed back and forth between the first and second configuration multiple times. When in the first configuration, the interposer device may provide structural support to a front end of the carrier mechanism and when in the second configuration, the interposer device may provide an internal mounting base for the data storage device at the base or bottom end of the carrier mechanism. The ability to interchange the interposer device may provide for a built-in base for attaching the interposer device without having to add in additional parts or costs.

Abstract translation: 提供了一种用于数据存储设备载体机构的内置双用途插入器设备。 当数据存储装置在“直接插头”位置或第一配置和“插入器”位置或第二配置之间改变时，插入器装置可以填充在空间或空隙空间中。 插入器装置可以在第一和第二配置多次之间来回变化。 当在第一构造中时，插入器装置可以向承载机构的前端提供结构支撑，并且当处于第二构造时，插入器装置可以在数据存储装置的基端或底端提供用于数据存储装置的内部安装基座 载体机制。 交换插入器装置的能力可以提供用于附接插入器装置的内置基座，而不必增加额外的部件或成本。