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公开(公告)号：WO0143167A3
公开(公告)日：2002-01-24
申请号：PCT/US0042805
申请日：2000-12-13
Applicant: SARNOFF CORP
Inventor： PALANISAMY PONNUSWAMY , SREERAM ATTIGANAL NARAYANASWAM , TORMEY ELLEN SCHWARTZ , THALER BARRY JAY , CONNOLLY JOHN CHARLES , MARTINELLI RAMON UBALDO , PRABHU ASHOK NARAYAN , HAMMOND MARK STUART
CPC classification number: H01S5/02248 , H01L2224/16225 , H01L2224/48091 , H01S5/02284 , H01S5/02415 , H01S5/02484 , H01L2924/00014
Abstract: Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.
Abstract translation: 包含安装在金属支撑基板上的多层陶瓷电路板的集成封装可用于金属支撑基板的温度控制。 可以将各种电子部件以及附加的温度控制装置连接到电路板和金属支撑基板，以控制或调节部件的操作温度。 集成包装可以用盖子气密密封。
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公开(公告)号：WO0072414A3
公开(公告)日：2002-11-07
申请号：PCT/US0012135
申请日：2000-05-04
Applicant: SARNOFF CORP
Inventor： MARTINELLI RAMON UBALDO , SUGG ALAN RICHARD , MENNA RAYMOND JOSEPH
CPC classification number: H01S5/50 , H01S5/026 , H01S5/0622 , H01S5/10 , H01S5/1243
Abstract: A semiconductor laser device includes a substrate having on a surface thereof a semiconductor diode laser portion and a linear amplifier portion. Each of the laser portion and amplifier portion has a waveguide layer with the waveguide layers being in alignment. The laser portion is of a structure which permits it to generate radiation and emit the radiation from one end. The amplifier has an end that receives the radiation from the laser portion, and another end which emits the radiation after the radiation is amplified. The device emits FM radiation but not IM radiation.
Abstract translation: 半导体激光器件包括在其表面上具有半导体二极管激光器部分和线性放大器部分的衬底。 激光部分和放大器部分中的每一个具有波导层，波导层对准。 激光部分具有允许其从一端产生辐射并发射辐射的结构。 放大器具有接收来自激光器部分的辐射的端部，以及在辐射被放大之后发射辐射的另一端。 该装置发射FM辐射但不发射IM辐射。
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公开(公告)号：AU4523701A
公开(公告)日：2001-06-18
申请号：AU4523701
申请日：2000-12-13
Applicant: SARNOFF CORP
Inventor： PALANISAMY PONNUSWAMY , SREERAM ATTIGANAL NARAYANASWAM , TORMEY ELLEN SCHWARTZ , THALER BARRY JAY , CONNOLLY JOHN CHARLES , MARTINELLI RAMON UBALDO , PRABHU ASHOK NARAYAN , HAMMOND MARK STUART
Abstract: Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.
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