公开(公告)号：WO0143167A3

公开(公告)日：2002-01-24

申请号：PCT/US0042805

申请日：2000-12-13

Applicant: SARNOFF CORP

Inventor： PALANISAMY PONNUSWAMY ,  SREERAM ATTIGANAL NARAYANASWAM ,  TORMEY ELLEN SCHWARTZ ,  THALER BARRY JAY ,  CONNOLLY JOHN CHARLES ,  MARTINELLI RAMON UBALDO ,  PRABHU ASHOK NARAYAN ,  HAMMOND MARK STUART

IPC: H01S5/022 ,  H01S5/024 ,  H01L23/14 ,  H01L23/15

CPC classification number: H01S5/02248 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/02484 ,  H01L2924/00014

Abstract: Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.

Abstract translation: 包含安装在金属支撑基板上的多层陶瓷电路板的集成封装可用于金属支撑基板的温度控制。 可以将各种电子部件以及附加的温度控制装置连接到电路板和金属支撑基板，以控制或调节部件的操作温度。 集成包装可以用盖子气密密封。

公开(公告)号：CA2268797C

公开(公告)日：2007-07-10

申请号：CA2268797

申请日：1997-10-10

Applicant: SARNOFF CORP

Inventor： SREERAM ATTIGANAL NARAYANASWAM ,  THALER BARRY JAY ,  PRABHU ASHOK N

IPC: H05K1/03 ,  H05K3/46 ,  B32B37/02 ,  B32B37/06 ,  H01L21/48 ,  H01L23/13 ,  H05K3/28

Abstract: Patterned laminated green tape multilayer stacks (130) can be fired while maintaining the dimensions of the pattern (120) by applying, as by screen printing or spraying, a ceramic ink (108) over surface portions of the green tape stack. Complex patterns can be formed in the green tapes by punching openings (120) in one or more of the green tape stacks (100) before laminating them together.

公开(公告)号：CA2268797A1

公开(公告)日：1998-04-23

申请号：CA2268797

申请日：1997-10-10

Applicant: SARNOFF CORP

Inventor： THALER BARRY JAY ,  SREERAM ATTIGANAL NARAYANASWAM ,  PRABHU ASHOK N

IPC: H05K1/03 ,  B32B37/02 ,  B32B37/06 ,  H01L21/48 ,  H01L23/13 ,  H05K3/46 ,  B32B31/12 ,  B32B31/18 ,  B32B31/26

Abstract: Patterned laminated green tape multilayer stacks (130) can be fired while maintaining the dimensions of the pattern (120) by applying, as by screen printing or spraying, a ceramic ink (108) over surface portions of the green tape stack. Complex patterns can be formed in the green tapes by punching openings (120) in one or more of the green tape stacks (100) before laminating them together.

公开(公告)号：EP0932500A4

公开(公告)日：2002-11-27

申请号：EP97910864

申请日：1997-10-10

Applicant: SARNOFF CORP

Inventor： SREERAM ATTINGANAL NARAYANASWA ,  THALER BARRY JAY ,  PRABHU ASHOK N

IPC: H05K1/03 ,  B32B37/02 ,  B32B37/06 ,  H01L21/48 ,  H01L23/13 ,  H05K3/46 ,  B32B31/12 ,  B32B31/18 ,  B32B31/26

CPC classification number: B32B37/0023 ,  B32B2315/02 ,  H01L21/4807 ,  H01L23/13 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/15157 ,  H01L2924/15787 ,  Y10S428/901 ,  Y10T29/49163 ,  Y10T156/1056 ,  Y10T156/1057 ,  Y10T428/24926 ,  H01L2924/00

Abstract: Patterned laminated green tape multilayer stacks (130) can be fired while maintaining the dimensions of the pattern (120) by applying, as by screen printing or spraying, a ceramic ink (108) over surface portions of the green tape stack. Complex patterns can be formed in the green tapes by punching openings (120) in one or more of the green tape stacks (100) before laminating them together.

公开(公告)号：EP0843621A4

公开(公告)日：1998-12-23

申请号：EP96910293

申请日：1996-01-29

Applicant: SARNOFF CORP

Inventor： KUMAR ANANDA HOSAKERE ,  THALER BARRY JAY ,  PRABHU ASHOK NARAYAN ,  TORMEY ELLEN SCHWARTZ

IPC: H05K1/09 ,  B32B18/00 ,  C09D5/24 ,  C09D11/00 ,  C09D11/02 ,  H01B1/16 ,  H01L23/498 ,  H05K3/46 ,  B32B9/00

CPC classification number: C09D11/52 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00

Abstract: Conductive via fill inks for green tapes to be stacked and bonded to a support substrate, the glass used for the green tape having a firing temperature from 850-950 °C, wherein the glass used for the via fill ink has a glass transition temperature that is higher than that of the glass used to make the green tape, preferably does not crystallize at the maximum firing temperature of the green tape and comprises from 30-75 percent by volume of the glass-conductive metal powder mixture of the via fill ink. These conductive via fill inks will not shrink until the green tape shrinkage has commenced during firing of the composite circuit board and they will flow slightly during firing, forming good bonds to the glass in the walls of the vias, thereby ensuring good integrity of the vias and good connections to the circuitry on the fired ceramic multilayer circuit board.

Abstract translation: 通孔填充油墨绿色带导电被堆叠和键合到支撑衬底，用于具有从850℃-950℃的烧成温度的生带材的玻璃，worin用于通孔填充墨水的玻璃的玻璃化转变 温度的确比用于制造生带的玻璃的较高的，优选地在生带材的最高烧成温度不结晶和由通孔填充的玻璃导电性金属粉末混合物的体积包含30〜75％的 墨。 通孔填充油墨这些导电不会收缩，直至绿色带已收缩的复合电路板的烧制过程中展开，并在烧制过程中theywill稍有流动，形成良好的键合在通孔的壁的玻璃，从而保证了通孔的良好的整体性 并就烧成陶瓷多层电路板中的电路的良好连接。

公开(公告)号：EP0812258A4

公开(公告)日：1999-03-10

申请号：EP96903415

申请日：1996-01-29

Applicant: SARNOFF CORP

Inventor： AZZARO THOMAS PETER ,  THALER BARRY JAY ,  CONLON EDWARD JAMES ,  KUMAR ANANDA HOSAKERE

IPC: H01L21/48 ,  H01L23/10 ,  H01L23/498 ,  H01L23/538 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  B32B3/00 ,  B32B18/00

CPC classification number: H05K3/445 ,  C03C3/085 ,  C03C3/097 ,  C03C8/04 ,  C03C8/08 ,  H01L21/486 ,  H01L23/10 ,  H01L23/49827 ,  H01L23/5384 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/053 ,  H05K3/4053 ,  H05K3/4061 ,  H05K3/426 ,  H05K2201/09581 ,  H05K2201/09809 ,  H05K2203/0315 ,  H05K2203/1147 ,  H05K2203/1438 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T156/1056 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00

Abstract: Electrical feedthroughs in printed circuit board support substrates (24) for use in making double sided ceramic multilayer printed circuit boards are made by insulating the feedthrough openings with a first layer of nickel oxide (22) and one or more layers of glass (26, 28), and then filling the remainder of the feedthroughs with a conductive metal via fill ink (30). After firing, the resultant structure provides insulated electrical feedthroughs through the support substrate (24).

Abstract translation: 用于制造双面陶瓷多层印刷电路板的印刷电路板支撑基板中的电馈通通过用第一层氧化镍和一层或多层玻璃绝缘馈通开口而制成，然后用剩余的馈通填充剩余的馈通 导电金属通过填充墨水。 在烧结之后，所得到的结构提供穿过支撑衬底的绝缘电馈通。

公开(公告)号：AU4523701A

公开(公告)日：2001-06-18

申请号：AU4523701

申请日：2000-12-13

Applicant: SARNOFF CORP

Inventor： PALANISAMY PONNUSWAMY ,  SREERAM ATTIGANAL NARAYANASWAM ,  TORMEY ELLEN SCHWARTZ ,  THALER BARRY JAY ,  CONNOLLY JOHN CHARLES ,  MARTINELLI RAMON UBALDO ,  PRABHU ASHOK NARAYAN ,  HAMMOND MARK STUART

IPC: H01S5/022 ,  H01S5/024

Abstract: Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.