公开(公告)号：WO0143167A3

公开(公告)日：2002-01-24

申请号：PCT/US0042805

申请日：2000-12-13

Applicant: SARNOFF CORP

Inventor： PALANISAMY PONNUSWAMY ,  SREERAM ATTIGANAL NARAYANASWAM ,  TORMEY ELLEN SCHWARTZ ,  THALER BARRY JAY ,  CONNOLLY JOHN CHARLES ,  MARTINELLI RAMON UBALDO ,  PRABHU ASHOK NARAYAN ,  HAMMOND MARK STUART

IPC: H01S5/022 ,  H01S5/024 ,  H01L23/14 ,  H01L23/15

CPC classification number: H01S5/02248 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/02484 ,  H01L2924/00014

Abstract: Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.

Abstract translation: 包含安装在金属支撑基板上的多层陶瓷电路板的集成封装可用于金属支撑基板的温度控制。 可以将各种电子部件以及附加的温度控制装置连接到电路板和金属支撑基板，以控制或调节部件的操作温度。 集成包装可以用盖子气密密封。

公开(公告)号：AU4523701A

公开(公告)日：2001-06-18

申请号：AU4523701

申请日：2000-12-13

Applicant: SARNOFF CORP

Inventor： PALANISAMY PONNUSWAMY ,  SREERAM ATTIGANAL NARAYANASWAM ,  TORMEY ELLEN SCHWARTZ ,  THALER BARRY JAY ,  CONNOLLY JOHN CHARLES ,  MARTINELLI RAMON UBALDO ,  PRABHU ASHOK NARAYAN ,  HAMMOND MARK STUART

IPC: H01S5/022 ,  H01S5/024

Abstract: Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.