公开(公告)号：CA2477071A1

公开(公告)日：2003-09-04

申请号：CA2477071

申请日：2003-02-21

Applicant: SATCON TECHNOLOGY CORP

Inventor： HARTZELL DENNIS E ,  OBNIBENE EDWARDS J ,  BREAUX LYLE ,  OLEKSY JOHN

IPC: F28F1/04 ,  F28F3/04 ,  F28F3/12 ,  H01L23/367 ,  H01L23/473 ,  H05K7/20

Abstract: The heat exchange system for conducting heat away heat-producing electronic components (22) comprising a metal tube (10) defining a flow channel for a cooling fluid, wherein the tube (10) has an inner surface (17) that comprise s a plurality of integral fins (12), and an outer surface (11, 13, 15) that is in direct contact with the heat producing components (22). The invention further provides a self-cooling, self-supporting electronic assembly that comprises one or more high-power electronic devices (22), the heat exchange system (10) and an attaching system (23, 25, 46) for attaching high-power electronic devices (22) to the heat exchange system (10). The invention further provides a method of cooling a heat producing means.

公开(公告)号：AU2003213228A1

公开(公告)日：2003-09-09

申请号：AU2003213228

申请日：2003-02-21

Applicant: SATCON TECHNOLOGY CORP

Inventor： OBNIBENE EDWARDS J ,  BREAUX LYLE ,  HARTZELL DENNIS E ,  OLEKSY JOHN

IPC: F28F1/04 ,  F28F3/04 ,  F28F3/12 ,  H01L23/367 ,  H01L23/473 ,  H05K7/20

Abstract: The present invention provides a heat exchange system for conducting heat away from high-power, heat-producing electronic components by conduction and convection. The heat exchange system comprises a metal tube that has been forged and drawn so as to define a flow channel for a cooling fluid, wherein the tube has an inner surface that comprises a plurality of integral fins that are structured and arranged to increase the available surface area of the inner surface of the metal tube exposed to the fluid and an outer surface that is in direct communication with the heat producing components. Coolant fluids are circulated through the flow channel, preferably, at turbulent flow conditions to minimize thermal resistance. The invention further provides a self-cooling, self-supporting electronic assembly that comprising one or more high-power electronic devices, the heat exchange systems, and an attaching system for attaching high-power electronic devices to the heat exchange system. The invention further provides a method of cooling a heat producing means comprising the steps of: providing a heat exchange system that is in direct communication with the heat-producing electronic components and circulating a fluid through the heat exchange system to conduct heat away from said heat exchange system and the heat producing electronic components.