公开(公告)号：WO0003436A3

公开(公告)日：2000-06-02

申请号：PCT/US9915595

申请日：1999-07-08

Applicant: SATCON TECHNOLOGY CORP

Inventor： COLELLO GARY M ,  HARTZELL DENNIS E

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/34 ,  H05K3/40 ,  H01L23/24 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/04 ,  H01L23/043 ,  H01L23/12 ,  H01L23/34

CPC classification number: H05K1/0209 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K3/3447 ,  H05K3/4015 ,  H05K3/4046 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10295 ,  H05K2201/10333 ,  H05K2201/10401 ,  H05K2201/10962 ,  H01L2924/00

Abstract: A method for providing pre-placed, pre-brazed feed throughs in the substrate (4) of a hermetic package corresponding to the terminal leads (6b) of the encased circuit COTS components (6). The substrate (4) may include directly bonded copper (DBC) regions forming circular shapes (10) where the holes for the special connectors of the present invention will be located. These holes will correspond to the leads of the circuit component (6) that will be mounted to it. Holes are laser or mechanically drilled into the substrate (4) inside the circular shapes (10) formed in the DBC. To form the feed through, a bushing (12), such as a blind copper rivet, is brazed in the hole, with the open end thereof oriented toward the component-side of the substrate. These open ends can accept the leads of the circuit component (6), like the holes of a conventional PC circuit board.

Abstract translation: 一种用于在对应于被封装的电路COTS部件（6）的端子引线（6b）的密封封装的基板（4）中提供预置的预钎焊进料通道的方法。 基板（4）可以包括形成圆形（10）的直接接合的铜（DBC）区域，其中本发明的特殊连接器的孔将被定位。 这些孔对应于将被安装到其上的电路部件（6）的引线。 在DBC中形成的圆形（10）内部，孔被激光或机械地钻入基板（4）中。 为了形成进料通过，诸如盲铜铆钉的衬套（12）钎焊在孔中，其开口端朝向基板的部件侧。 这些开口端可以像常规PC电路板的孔那样接受电路部件（6）的引线。

公开(公告)号：WO02056660A3

公开(公告)日：2002-08-29

申请号：PCT/US0200662

申请日：2002-01-11

Applicant: SATCON TECHNOLOGY CORP

Inventor： HARTZELL DENNIS E ,  OGNIBENE EDWARD J

IPC: H05K7/20 ,  H01L23/467

CPC classification number: H01L23/473 ,  H01L23/3677 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Heat exchange devices (1) and methods of using and making them are disclosed. The heat exchange devices (1) have an elongate core (2) with a helical member (3) coiling along the outer surface of the core and extending along the longitudinal axis of the core. The heat exchange devices can be used alone or in groups, wherein a plurality of heat exchange devices can be connected independently to a substrate (10) and be disconnected from adjacent heat exchange devices. Fluids can be forced between the heat exchange devices to facilitate heat transfer.

Abstract translation: 公开了热交换装置（1）及其使用和制造方法。 热交换装置（1）具有细长型芯（2），其具有沿着型芯的外表面盘绕并沿着型芯的纵向轴线延伸的螺旋构件（3）。 热交换装置可以单独或成组地使用，其中多个热交换装置可以独立地连接到基板（10）并且与相邻的热交换装置断开连接。 可以在热交换设备之间强制流体以促进传热。

公开(公告)号：CA2477071A1

公开(公告)日：2003-09-04

申请号：CA2477071

申请日：2003-02-21

Applicant: SATCON TECHNOLOGY CORP

Inventor： HARTZELL DENNIS E ,  OBNIBENE EDWARDS J ,  BREAUX LYLE ,  OLEKSY JOHN

IPC: F28F1/04 ,  F28F3/04 ,  F28F3/12 ,  H01L23/367 ,  H01L23/473 ,  H05K7/20

Abstract: The heat exchange system for conducting heat away heat-producing electronic components (22) comprising a metal tube (10) defining a flow channel for a cooling fluid, wherein the tube (10) has an inner surface (17) that comprise s a plurality of integral fins (12), and an outer surface (11, 13, 15) that is in direct contact with the heat producing components (22). The invention further provides a self-cooling, self-supporting electronic assembly that comprises one or more high-power electronic devices (22), the heat exchange system (10) and an attaching system (23, 25, 46) for attaching high-power electronic devices (22) to the heat exchange system (10). The invention further provides a method of cooling a heat producing means.

公开(公告)号：AU2003213228A1

公开(公告)日：2003-09-09

申请号：AU2003213228

申请日：2003-02-21

Applicant: SATCON TECHNOLOGY CORP

Inventor： OBNIBENE EDWARDS J ,  BREAUX LYLE ,  HARTZELL DENNIS E ,  OLEKSY JOHN

IPC: F28F1/04 ,  F28F3/04 ,  F28F3/12 ,  H01L23/367 ,  H01L23/473 ,  H05K7/20

Abstract: The present invention provides a heat exchange system for conducting heat away from high-power, heat-producing electronic components by conduction and convection. The heat exchange system comprises a metal tube that has been forged and drawn so as to define a flow channel for a cooling fluid, wherein the tube has an inner surface that comprises a plurality of integral fins that are structured and arranged to increase the available surface area of the inner surface of the metal tube exposed to the fluid and an outer surface that is in direct communication with the heat producing components. Coolant fluids are circulated through the flow channel, preferably, at turbulent flow conditions to minimize thermal resistance. The invention further provides a self-cooling, self-supporting electronic assembly that comprising one or more high-power electronic devices, the heat exchange systems, and an attaching system for attaching high-power electronic devices to the heat exchange system. The invention further provides a method of cooling a heat producing means comprising the steps of: providing a heat exchange system that is in direct communication with the heat-producing electronic components and circulating a fluid through the heat exchange system to conduct heat away from said heat exchange system and the heat producing electronic components.