公开(公告)号：WO0003436A3

公开(公告)日：2000-06-02

申请号：PCT/US9915595

申请日：1999-07-08

Applicant: SATCON TECHNOLOGY CORP

Inventor： COLELLO GARY M ,  HARTZELL DENNIS E

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/34 ,  H05K3/40 ,  H01L23/24 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/04 ,  H01L23/043 ,  H01L23/12 ,  H01L23/34

CPC classification number: H05K1/0209 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K3/3447 ,  H05K3/4015 ,  H05K3/4046 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10295 ,  H05K2201/10333 ,  H05K2201/10401 ,  H05K2201/10962 ,  H01L2924/00

Abstract: A method for providing pre-placed, pre-brazed feed throughs in the substrate (4) of a hermetic package corresponding to the terminal leads (6b) of the encased circuit COTS components (6). The substrate (4) may include directly bonded copper (DBC) regions forming circular shapes (10) where the holes for the special connectors of the present invention will be located. These holes will correspond to the leads of the circuit component (6) that will be mounted to it. Holes are laser or mechanically drilled into the substrate (4) inside the circular shapes (10) formed in the DBC. To form the feed through, a bushing (12), such as a blind copper rivet, is brazed in the hole, with the open end thereof oriented toward the component-side of the substrate. These open ends can accept the leads of the circuit component (6), like the holes of a conventional PC circuit board.

Abstract translation: 一种用于在对应于被封装的电路COTS部件（6）的端子引线（6b）的密封封装的基板（4）中提供预置的预钎焊进料通道的方法。 基板（4）可以包括形成圆形（10）的直接接合的铜（DBC）区域，其中本发明的特殊连接器的孔将被定位。 这些孔对应于将被安装到其上的电路部件（6）的引线。 在DBC中形成的圆形（10）内部，孔被激光或机械地钻入基板（4）中。 为了形成进料通过，诸如盲铜铆钉的衬套（12）钎焊在孔中，其开口端朝向基板的部件侧。 这些开口端可以像常规PC电路板的孔那样接受电路部件（6）的引线。

公开(公告)号：WO2006127844A3

公开(公告)日：2007-12-13

申请号：PCT/US2006020140

申请日：2006-05-24

Applicant: SATCON TECHNOLOGY CORP ,  RAJDA JANOS ,  GALBRAITH ANTHONY WILLIAM ,  SCHAUDER COLIN DAVID

Inventor： RAJDA JANOS ,  GALBRAITH ANTHONY WILLIAM ,  SCHAUDER COLIN DAVID

IPC: G05F1/70 ,  G05F3/00 ,  G05F5/00 ,  G05F5/06

CPC classification number: G05F1/70 ,  F03D9/257 ,  H02P9/102 ,  H02P2101/15 ,  Y02E10/72

Abstract: A device, a system, and a method for preventing power- producing wind turbine generators(22) from tripping due to the detection of a low-voltage condition on a power grid (27) are disclosed.The disclosed device includes a resistor bank(35c) that absorbs real power and a control system that maintains the collector bus voltage (26) above a threshold voltage level during the duration of low-voltage condition on the power grid. Collector bus voltage (26) is maintained using gating signals that include phase delay angles to adjust the opening/closing of the switching devices.

Abstract translation: 公开了一种用于防止由于电网（27）上的低电压状况的检测而产生电力的风力涡轮发电机（22）跳闸的装置，系统和方法。所公开的装置包括电阻器组 35c），其在电力网的低电压状态期间将集电极母线电压（26）维持在阈值电压电平以上的控制系统。 使用包括相位延迟角度的门控信号来维持集电极母线电压（26），以调节开关装置的开/关。

公开(公告)号：WO2007011366A3

公开(公告)日：2007-05-18

申请号：PCT/US2005029282

申请日：2005-08-16

Applicant: SATCON TECHNOLOGY CORP

Inventor： FOSHAGE GERALD K ,  LOVELACE EDWARD C

IPC: H02K5/16 ,  F16C32/06 ,  H02K7/09

CPC classification number: F16C32/044 ,  F16C17/024 ,  F16C32/0402 ,  F16C41/02 ,  F16C2360/23 ,  H02K7/08 ,  H02K7/09

Abstract: An integrated bearing system (10) for supporting a rotatable shaft journal (58). The system (10) comprises a foil bearing (40) in combination with a magnetic field generating device (50) that produces a magnetic bearing capability to the rotatable shaft journal (58). The foil bearing (40) is integrated into the magnetic field generating device (50), leaving an air gap between the shaft journal (58) and the foil bearing (10). Under normal operating conditions, the magnetic field generating device (50) and the foil bearing (10) each provide a portion of the support to the shaft journal (58).

Abstract translation: 一种用于支撑可旋转轴颈（58）的集成轴承系统（10）。 系统（10）包括与产生对可旋转轴颈（58）的磁性承载能力的磁场产生装置（50）结合的箔片轴承（40）。 箔片轴承（40）被集成到磁场产生装置（50）中，在轴颈（58）和箔片轴承（10）之间留下气隙。 在正常操作条件下，磁场产生装置（50）和箔片轴承（10）各自将一部分支撑件提供给轴颈（58）。

公开(公告)号：WO2007016649A9

公开(公告)日：2007-03-22

申请号：PCT/US2006030217

申请日：2006-08-02

Applicant: SATCON TECHNOLOGY CORP

Inventor： CASEY LEO FRANCIS

IPC: H01L27/00

CPC classification number: H01L23/3675 ,  H01L23/373 ,  H01L23/3733 ,  H01L23/3735 ,  H01L23/49833 ,  H01L23/5385 ,  H01L24/83 ,  H01L25/115 ,  H01L25/18 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/16225 ,  H01L2224/2518 ,  H01L2224/29076 ,  H01L2224/29144 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/00014

Abstract: An electronic semiconductor package is described. The package has a wide band gap electronic semiconductor device requiring heat removal. On one side of the electronic semiconductor device is a first, thermally-conductive, electrically- insulative substrate having a predetermined electrically-conductive wire pattern affixed thereto. On the other side of the electronic semiconductor device is a second, thermally- conductive, electrically-insulative substrate. A heat removal device is mechanically-coupled to the second substrate. The heat removal device is made of a graphite-metal or metal-matrix composite material and a fin array structure of the same material. The coefficients of thermal expansion of the heat removal device and the first and second substrates are matched to minimize internal and external stresses.

Abstract translation: 描述电子半导体封装。 该封装具有需要除热的宽带隙电子半导体器件。 在电子半导体器件的一侧是具有固定到其上的预定导电丝图案的第一导热电绝缘基板。 在电子半导体器件的另一侧是第二导热的电绝缘衬底。 散热装置机械耦合到第二基板。 除热装置由石墨金属或金属基复合材料和相同材料的翅片阵列结构制成。 排热装置与第一和第二基板的热膨胀系数相匹配，以使内部和外部应力最小化。

公开(公告)号：WO02056660A3

公开(公告)日：2002-08-29

申请号：PCT/US0200662

申请日：2002-01-11

Applicant: SATCON TECHNOLOGY CORP

Inventor： HARTZELL DENNIS E ,  OGNIBENE EDWARD J

IPC: H05K7/20 ,  H01L23/467

CPC classification number: H01L23/473 ,  H01L23/3677 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Heat exchange devices (1) and methods of using and making them are disclosed. The heat exchange devices (1) have an elongate core (2) with a helical member (3) coiling along the outer surface of the core and extending along the longitudinal axis of the core. The heat exchange devices can be used alone or in groups, wherein a plurality of heat exchange devices can be connected independently to a substrate (10) and be disconnected from adjacent heat exchange devices. Fluids can be forced between the heat exchange devices to facilitate heat transfer.

Abstract translation: 公开了热交换装置（1）及其使用和制造方法。 热交换装置（1）具有细长型芯（2），其具有沿着型芯的外表面盘绕并沿着型芯的纵向轴线延伸的螺旋构件（3）。 热交换装置可以单独或成组地使用，其中多个热交换装置可以独立地连接到基板（10）并且与相邻的热交换装置断开连接。 可以在热交换设备之间强制流体以促进传热。

公开(公告)号：WO2007016649A3

公开(公告)日：2009-04-16

申请号：PCT/US2006030217

申请日：2006-08-02

Applicant: SATCON TECHNOLOGY CORP

Inventor： CASEY LEO FRANCIS

IPC: H01L31/111

CPC classification number: H01L23/3675 ,  H01L23/373 ,  H01L23/3733 ,  H01L23/3735 ,  H01L23/49833 ,  H01L23/5385 ,  H01L24/83 ,  H01L25/115 ,  H01L25/18 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/16225 ,  H01L2224/2518 ,  H01L2224/29076 ,  H01L2224/29144 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/00014

Abstract: An electronic semiconductor package is described. The package has a wide band gap electronic semiconductor device requiring heat removal. On one side of the electronic semiconductor device is a first, thermally-conductive, electrically- insulative substrate having a predetermined electrically-conductive wire pattern affixed thereto. On the other side of the electronic semiconductor device is a second, thermally- conductive, electrically-insulative substrate. A heat removal device is mechanically-coupled to the second substrate. The heat removal device is made of a graphite-metal or metal-matrix composite material and a fin array structure of the same material. The coefficients of thermal expansion of the heat removal device and the first and second substrates are matched to minimize internal and external stresses.

Abstract translation: 描述电子半导体封装。 该封装具有需要除热的宽带隙电子半导体器件。 在电子半导体器件的一侧是具有固定到其上的预定导电丝图案的第一导热电绝缘基板。 在电子半导体器件的另一侧是第二导热的电绝缘衬底。 散热装置机械耦合到第二基板。 除热装置由石墨金属或金属基复合材料和相同材料的翅片阵列结构制成。 散热装置与第一和第二基板的热膨胀系数相匹配，以使内部和外部应力最小化。

公开(公告)号：WO2007035411A3

公开(公告)日：2007-09-27

申请号：PCT/US2006035841

申请日：2006-09-14

Applicant: SATCON TECHNOLOGY CORP

Inventor： SCHAUDER COLIN DAVID

IPC: H02P9/00 ,  H02P9/10 ,  H02P15/00

CPC classification number: H02P9/42 ,  H02P9/46 ,  H02P23/08 ,  H02P2101/15

Abstract: A system and method for providing constant -frequency electrical power from variable- speed mechanical power are disclosed. The system includes a wound- rotor induction machine generator (WRIMG), a first power converter, e.g., an inverter or a bridge rectifier, that provides power from the stator assembly of the WRIMG to the load, and a second power converter, e.g., an inverter or a bridge rectifier, that provides power from the rotor assembly of the WRIMG to the load. A controller controls the output stator- current based on comparisons between measured DC load bus data and a reference DC load bus voltage value, measured machine shaft angular position and reference rotor frequency data, and measured stator- current data that is fed-back to the stator -current controller by the power converter device (s) .

Abstract translation: 公开了一种用于从可变速度机械功率提供恒定频率电力的系统和方法。 该系统包括绕组转子感应电机发电机（WRIMG），第一功率转换器，例如逆变器或桥式整流器，其从WRIMG的定子组件向负载供电，以及第二功率转换器， 逆变器或桥式整流器，其从WRIMG的转子组件向负载提供电力。 控制器基于测量的直流负载总线数据与参考直流负载总线电压值，测量的机器轴角位置和参考转子频率数据之间的比较以及反馈到 定子 - 电流控制器。

公开(公告)号：WO0171775A9

公开(公告)日：2002-12-19

申请号：PCT/US0108751

申请日：2001-03-16

Applicant: SATCON TECHNOLOGY CORP ,  SANGER PHILLIP A ,  MANDELCOM LYON ,  LESSTER LEBAN E ,  LINDBERG FRANK A

Inventor： SANGER PHILLIP A ,  MANDELCOM LYON ,  LESSTER LEBAN E ,  LINDBERG FRANK A

IPC: H01G4/232 ,  H02M1/34 ,  H03K17/0814 ,  H03K17/16 ,  H01F27/42 ,  H01G4/228

CPC classification number: H01G4/232 ,  H02M1/34 ,  H02M2001/346 ,  H03K17/0814 ,  H03K17/16 ,  Y02B70/1491

Abstract: A low-voltage, low-inductance device for storing electrical charge in a snubber circuit is disclosed as well as a method of minimizing inductance in the snubber circuit using the device. The device, a capacitor (10), comprises a plurality of extended electrodes, in parallel or series, that are joined to a positive conductor terminal at one end spray and at a negative conductor terminal at the other end spray so that end sprays of adjacent extended electrodes are alternately joined to the positive and negative conductor terminals. Accordingly, current flowing though adjacent extended electrodes is of substantially equal intensity but different in direction. As a result, inductance produced effectively cancels out that of adjacent extended electrodes. The method includes sandwiching an insulating film (21) between the positive and negative conductor terminals and alternately joining the conductor terminals to the end sprays of extended electrodes so that current flows in opposite directions between end sprays (22a, 22b) of adjacent extended electrodes, thereby canceling out inductance.

Abstract translation: 公开了一种用于在缓冲电路中存储电荷的低电压，低电感装置以及一种使用该装置使缓冲电路中的电感最小化的方法。 该装置，电容器（10）包括并联或串联的多个延伸电极，其在一端喷雾处连接到正导体端子并在另一端喷雾在负导体端子处，使得相邻的端喷雾 延伸电极交替地连接到正和负导体端子。 因此，流过相邻延伸电极的电流强度基本相等，但方向不同。 结果，所产生的电感有效地消除了相邻的延伸电极的电感。 该方法包括在正和负导体端子之间夹入绝缘膜（21），并交替地将导体端子连接到延伸电极的端部喷雾，使得电流在相邻延​​伸电极的端部喷雾（22a，22b）之间以相反方向流动， 从而消除电感。

公开(公告)号：WO02061910A3

公开(公告)日：2002-10-10

申请号：PCT/US0203155

申请日：2002-01-31

Applicant: SATCON TECHNOLOGY CORP

Inventor： EISENHAURE DAVID B ,  KIRTLEY JAMES L JR ,  LESSTER LABAN EDWARD

IPC: H02J9/06 ,  H02K17/22 ,  H02P9/42 ,  H02P9/48 ,  H02J9/08

CPC classification number: H02J9/061

Abstract: Uninterruptible power supply system (200) uses a slip-ring induction machine (10) and a flywheel combination. The UPS system (200) comprises a back-up power source connected in parallel to a primary power source such as utility grid. During normal operation of the UPS system (200), the primary power source (130) supplies power to the load and the UPS compensates for voltage drop. Moreover, the primary power source keeps the slip-ring induction machine and the flywheel in an excited state above normal synchronous speed. When the primary power source fails, the flywheel, which is rotating at super-synchronous speed and storing kinetic energy, drives the rotor of the slip-ring induction machine to generate power. Accordingly, the slip-ring induction machine and flywheel combination provides instantaneous, short term power to the load until the back-up power source has powered up and been brought online.

Abstract translation: 不间断电源系统（200）使用滑环感应电机（10）和飞轮组合。 UPS系统（200）包括与诸如公用电网的主电源并联连接的备用电源。 在UPS系统（200）的正常操作期间，主电源（130）向负载供电，并且UPS补偿电压降。 此外，主电源将滑环感应电机和飞轮保持在高于正常同步速度的激励状态。 当主电源出现故障时，以超同步速度旋转并存储动能的飞轮驱动滑环感应电机的转子发电。 因此，滑环感应电机和飞轮组合为负载提供即时的短期电力，直到备用电源通电并被联机。

公开(公告)号：CA2477071A1

公开(公告)日：2003-09-04

申请号：CA2477071

申请日：2003-02-21

Applicant: SATCON TECHNOLOGY CORP

Inventor： HARTZELL DENNIS E ,  OBNIBENE EDWARDS J ,  BREAUX LYLE ,  OLEKSY JOHN

IPC: F28F1/04 ,  F28F3/04 ,  F28F3/12 ,  H01L23/367 ,  H01L23/473 ,  H05K7/20

Abstract: The heat exchange system for conducting heat away heat-producing electronic components (22) comprising a metal tube (10) defining a flow channel for a cooling fluid, wherein the tube (10) has an inner surface (17) that comprise s a plurality of integral fins (12), and an outer surface (11, 13, 15) that is in direct contact with the heat producing components (22). The invention further provides a self-cooling, self-supporting electronic assembly that comprises one or more high-power electronic devices (22), the heat exchange system (10) and an attaching system (23, 25, 46) for attaching high-power electronic devices (22) to the heat exchange system (10). The invention further provides a method of cooling a heat producing means.