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1.发明申请
公开(公告)号：WO2007102062A3
公开(公告)日：2008-01-17
申请号：PCT/IB2007000489
申请日：2007-03-02
Applicant: SCHLUMBERGER TECHNOLOGY BV , SCHLUMBERGER SERVICES PETROL , PRAD RES & DEV NV , SCHLUMBERGER CA LTD , SCHLUMBERGER HOLDINGS , SATO SHIGERU , TAKEDA JIRO , KAYAMA ATSUSHI , SUZUKI SO , BENETEAU LIONEL
Inventor： SATO SHIGERU , TAKEDA JIRO , KAYAMA ATSUSHI , SUZUKI SO , BENETEAU LIONEL
IPC: H05K3/34 , H01L23/495
CPC classification number: H05K3/3426 , C23C18/31 , C23C18/32 , H01L23/49582 , H01L2924/0002 , H05K3/26 , H05K2201/10909 , Y02P70/613 , H01L2924/00
Abstract: The principles described herein relate to methods for soldering electrode terminals, pins or lead-frames of commercial electric components for high temperature reliability. In one embodiment, prior to soldering the electric components, a pre-plated solder layer is removed from the lead frame or pins, and nickel and/or gold films are formed with electroless plating. The removal of the pre-plated solder layer avoids excess pre-plated Sn with high-Pb solder that lowers the melting point to between 180°C and 220°C and weakens solder joints. The nickel layer formed with an electroless plating acts as a barrier to the interdiffusion of tin from solder with copper of the lead frame material, which may otherwise occur at high temperatures. Interdiffusion forms an intermetallic compound layer of copper and tin and degrades solder joint strength. The novel soldering processes improve high temperature reliability of solder joints and extend electronics life-time.
Abstract translation: 本文描述的原理涉及用于焊接商业电气部件的电极端子，引脚或引线框架以实现高温可靠性的方法。 在一个实施例中，在焊接电气部件之前，从引线框或引脚去除预镀焊料层，并且用无电镀形成镍和/或金膜。 预镀焊料层的去除避免了高铅焊料的过量预镀Sn，将熔点降至180°C至220°C，并削弱焊点。 用无电电镀形成的镍层作为阻挡锡从焊料与铜框架材料的铜的相互扩散，否则可能会在高温下发生。 相互扩散形成铜和锡的金属间化合物层，并降低焊点强度。 新颖的焊接工艺提高了焊点的高温可靠性，延长了电子设备的使用寿命。
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公开(公告)号：WO2008107768A3
公开(公告)日：2008-10-30
申请号：PCT/IB2008000473
申请日：2008-03-05
Applicant: SCHLUMBERGER TECHNOLOGY BV , SCHLUMBERGER SERVICES PETROL , SCHLUMBERGER CA LTD , SCHLUMBERGER HOLDINGS , PRAD RES & DEV NV , UNDERHILL WILLIAM , KAMATA MASAHIRO , TAKEDA JIRO , WILSON COLIN
Inventor： UNDERHILL WILLIAM , KAMATA MASAHIRO , TAKEDA JIRO , WILSON COLIN
IPC: G01V1/42
CPC classification number: G01V1/42
Abstract: Methods and apparatus for creating a velocity profile of a formation surrounding a borehole by checkshot measurements while moving the tool (202) along the borehole. A conveyance and a sensor section (202, 205) are configured to move the sensor section (205) in the borehole. At least one receiver (205) is configured to detect signals generated at or near the surface while the sensor section is moving in the borehole.
Abstract translation: 用于在沿钻孔移动工具（202）的情况下通过检查测量来创建围绕钻孔的地层的速度分布的方法和装置。 传送器和传感器部分（202,205）被配置为使传感器部分（205）在钻孔中移动。 至少一个接收器（205）被配置为在传感器部分在钻孔中移动的同时检测在表面处或附近产生的信号。
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公开(公告)号：WO2008050191A3
公开(公告)日：2008-06-19
申请号：PCT/IB2007002998
申请日：2007-10-10
Applicant: SCHLUMBERGER TECHNOLOGY BV , SCHLUMBERGER SERVICES PETROL , SCHLUMBERGER CA LTD , SCHLUMBERGER HOLDINGS , PRAD RES & DEV NV , GOTO YASUNORI , TAKEDA JIRO , MASAKI TSUTOMU
Inventor： GOTO YASUNORI , TAKEDA JIRO , MASAKI TSUTOMU
IPC: H05K3/34
CPC classification number: H05K3/3489 , H05K3/305 , H05K3/3421 , H05K3/3494 , H05K2201/10689 , H05K2201/10977 , H05K2203/0195 , H05K2203/086 , H05K2203/107 , Y02P70/613
Abstract: Methods of manufacturing printed circuit board assemblies include placing a semiconductor chip having a plurality of lead terminals on a board formed with a plurality of solder lands at its surface such that each of the plurality of lead terminals is in touch with a corresponding one of the solder lands; supplying a solder material on the plurality of lead terminals and the plurality of solder lands; supplying a flux including mono salt of adipic acid and alkyl secondary amine; and locally heating the plurality of lead terminals such that the solder material and the flux are melted to join together the lead terminals and the solder lands.
Abstract translation: 制造印刷电路板组件的方法包括将具有多个引线端子的半导体芯片放置在其表面上形成有多个焊接区域的板上，使得多个引线端子中的每一个与相应的一个焊料接触 土地; 在所述多个引线端子和所述多个焊盘上提供焊料材料; 提供包含己二酸单烷基酯和烷基仲胺的助熔剂; 并且对多个引线端子进行局部加热，使得焊料材料和焊剂熔化，以将引线端子和焊盘接合在一起。
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公开(公告)号：NO20090650L
公开(公告)日：2009-05-22
申请号：NO20090650
申请日：2009-02-11
Applicant: SCHLUMBERGER TECHNOLOGY BV
Inventor： YAMATE TSUTOMU , TAKEDA JIRO , INOUE HIROSHI , SUDO YUKIO , DESROQUES EMMANUEL , UMEMOTO SATORU
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公开(公告)号：NO20090650A
公开(公告)日：2009-05-22
申请号：NO20090650
申请日：2009-02-11
Applicant: SCHLUMBERGER TECHNOLOGY BV
Inventor： YAMATE TSUTOMU , TAKEDA JIRO , INOUE HIROSHI , SUDO YUKIO , DESROQUES EMMANUEL , UMEMOTO SATORU
CPC classification number: E21B47/00
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Patent Agency Ranking
公开(公告)号：AU2008222435A1
公开(公告)日：2008-09-12
申请号：AU2008222435
申请日：2008-03-05
Applicant: SCHLUMBERGER TECHNOLOGY BV
Inventor： WILSON COLIN , UNDERHILL WILLIAM , KAMATA MASAHIRO , TAKEDA JIRO
IPC: G01V1/42
Abstract: Methods and apparatus for creating a velocity profile of a formation surrounding a borehole by checkshot measurements while moving the tool along the borehole. A conveyance and a sensor section are configured to move the sensor section in the borehole. At least one receiver is configured to detect signals generated at or near the surface while the sensor section is moving in the borehole.
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公开(公告)号：NO20031315L
公开(公告)日：2003-05-21
申请号：NO20031315
申请日：2003-03-21
Applicant: SCHLUMBERGER TECHNOLOGY BV
Inventor： ENDO TATSUKI , MATHISON DAVID , TAKEDA JIRO
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公开(公告)号：AU2008222435B2
公开(公告)日：2013-03-14
申请号：AU2008222435
申请日：2008-03-05
Applicant: SCHLUMBERGER TECHNOLOGY BV
Inventor： UNDERHILL WILLIAM , TAKEDA JIRO , WILSON COLIN , KAMATA MASAHIRO
IPC: G01V1/42
Abstract: Methods and apparatus for creating a velocity profile of a formation surrounding a borehole by checkshot measurements while moving the tool (202) along the borehole. A conveyance and a sensor section (202, 205) are configured to move the sensor section (205) in the borehole. At least one receiver (205) is configured to detect signals generated at or near the surface while the sensor section is moving in the borehole.
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公开(公告)号：NO326672B1
公开(公告)日：2009-01-26
申请号：NO20031315
申请日：2003-03-21
Applicant: SCHLUMBERGER TECHNOLOGY BV
Inventor： MATHISON DAVID , ENDO TATSUKI , TAKEDA JIRO
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公开(公告)号：NO20083847L
公开(公告)日：2008-10-06
申请号：NO20083847
申请日：2008-09-05
Applicant: SCHLUMBERGER TECHNOLOGY BV
Inventor： SATO SHIGERU , TAKEDA JIRO , KAYAMA ATSUSHI , SUZUKI SO , BENETEAU LIONEL
IPC: H01L23/495 , H05K3/34
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