公开(公告)号：JPH07142524A

公开(公告)日：1995-06-02

申请号：JP14487094

申请日：1994-06-27

Applicant: SGS THOMSON MICROELECTRONICS ,  CONS RIC MICROELETTRONICA

Inventor： ANTONIO GURATSUSO ,  ANNTONIO PINTO

IPC: H01L21/60 ,  B23K20/00 ,  H01L21/607

Abstract: PURPOSE: To improve the quality of connecting part between a semiconductor circuit chip and the pin of its supporting frame by forming a pair of grooves at least at the working terminal of bonding top end and making the lengths of grooves different. CONSTITUTION: In order to improve the quality and validity of connecting part to be bonded, working is started from the assumption that a bonding zone is to be expanded. A tool 9 for bonding having a working terminal 12 formed from a pair of grooves 13 and 14 at least with different lengths is prepared. Besides, one terminal of wire 7 on a terminal connector 5 is held in the 1st groove 13 and bonded to the terminal connector 5. Further, the other terminal of wire 7 on a semiconductor chip 1 is held in the 2nd groove 14 and bonded to the semiconductor circuit chip 1. Thus, even at the time when the wire 7 is to be cut by sharp pulling so as to be ordinarily applied to a thin wire, it is bonded and no damage is applied to the joint.

公开(公告)号：JPH07142525A

公开(公告)日：1995-06-02

申请号：JP14487194

申请日：1994-06-27

Applicant: SGS THOMSON MICROELECTRONICS ,  CONS RIC MICROELETTRONICA

Inventor： ANTONIO GURATSUSO ,  ANNTONIO PINTO

IPC: H01L21/60 ,  H01L21/48 ,  H01L21/607 ,  H01L23/495

Abstract: PURPOSE: To attain improvement in quality and reliability by improving a connecting part between a semiconductor chip and the pin of supporting frame by making a wire lead into continuous wire having 1st and 2nd contact bonds arranged on a connecting pin. CONSTITUTION: A semiconductor chip 1 is tied in the central zone of sheet metal 4 while using a solder 3, and the sheet metal 4 is coupled to a connecting pin 7 on the metallic supporting frame by a metal link 5. Besides, a wire lead 8 is connected by bonding the respective connecting pins 7 with correspondent pads 2 on the semiconductor chip 1. Especially, the wire lead 8 is twice bonded 10 and 11 to post leads 6 of respective connecting pins 7 by cascade connection. Such double bonding is extremely effective for reinforcing the quality and reliability of semiconductor device by canceling various limits or defects in conventional techniques.