Abstract:
A method for recovering flash-EEPROM memory cells (MC) with low threshold voltage is described. The method provide for the simultaneous application of a first voltage with a first prescribed value (V D ) and of a second voltage with a second prescribed value (V G ) to drain regions (D) of each of said memory cells (MC) and to gate regions (G) of the memory cell (MC) for a prescribed time interval suitable for submitting said memory cells (MC) to a prescribed threshold voltage shift. A reference ground voltage (GND) is concurrently applied to source regions (S) of said memory cells (MC).
Abstract:
A method for erasing an electrically programmable and erasable non-volatile memory cell having a control electrode, an electrically-insulated electrode and a first electrode, provides for coupling the control electrode to a first voltage supply, coupling the first electrode to a second voltage supply, the first voltage supply and the second voltage supply being suitable to cause tunneling of electric charges between the electrically-insulated electrode and the first electrode. The method provides for a constant current to flow between the second voltage supply and the first electrode of the memory cell for at least part of an erasing time of the memory cell, the constant current having a prescribed value.
Abstract:
The invention relates to a high-capacitance capacitor (1) which is monolithically integratable on a semiconductor substrate (3) doped with a first type (P) of dopant and accomodating a diffusion well (4) which is doped with a second type (N) of dopant and has a first active region (5) formed therein. A layer (6) of gate oxide is deposited over the diffusion well (4) which is covered with a first layer (POLY1) of polycrystalline silicon and separated from a second layer (POLY2) of polycrystalline silicon by an interpoly dielectric layer (7). Advantageously, the high-capacitance capacitor (1) of the invention comprises a first capacitor element (C1) having the first (POLY1) and second (POLY2) layers of polycrystalline silicon as its conductive plates, and the interpoly dielectric layer (7) as the isolation dielectric, and a second capacitor element (C2) having the first layer (POLY1) of polycrystalline silicon and the diffusion well (4) as its conductive plates and the gate oxide layer (6) as the isolation dielectric.