Abstract:
A method for sensing multiple-levels non-volatile memory cells which can take one programming level among a plurality of m=2 n (n > = 2) different programming levels, provides for biasing a memory cell (MC) to be sensed in a predetermined condition, so that the memory cell (MC) sinks a cell current (IC) with a value belonging to a discrete set of m distinct cell current values (IC0-IC15), each cell current value (IC0-IC15) corresponding to one of said programming levels. The sensing method also provides for: simultaneously comparing the cell current (IC) with a prescribed number of reference currents (IR1,IR2,IR3) having values comprised between a minimum value and a maximum value of said discrete set of m cell current values (IC0-IC15) and dividing said discrete set of m cell current values (IC0-IC15) in a plurality of sub-sets of cell current values, for determining the sub-set of cell current values to which the cell current (IC) belongs; repeating step a) for the sub-set of cell current values to which the cell current (IC) belongs, until the sub-set of cell current values to which the cell current (IC) belongs comprises only one cell current value, which is the value of the current (IC) of the memory cell (MC) to be sensed.
Abstract:
An integrated word line decoding circuit utilizes a voltage transferring inverter whose driver transistor may be biased independently of the other transistors of the same type of conductivity of the integrated circuit by forming it in a first region having the same type of conductivity of the semiconducting substrate of the integrated circuit and which is entirely contained within a second region having an opposite type of conductivity into which the complementary load transistor of the inverter is formed. The circuit is capable of transferring positive voltages (e.g. during reading and programming) and a negative voltage (e.g. during erasing) to the word lines, while being readily integratable and requiring a small area.
Abstract:
The EPROM memory comprising a semiconductor substrate (1) with source (3) drain (2) and channel (4) areas, a control gate (5) and a floating gate (6) uses for programming a drain voltage no higher than the low power supply voltage (Vcc) employed for normal operation of the memory and a control gate voltage taken from said power supply voltage (Vcc) through a voltage booster (8).
Abstract:
A circuit for generating positive and negative boosted voltages, comprising first (El-pos) and second (El-neg) voltage booster circuits, respectively for positive and negative voltages, which have output terminals interconnected at a common node (N). It comprises two tristate logic gate circuits for coupling said voltage booster circuits to a positive supply voltage generator (Vdd,GND) and additional tristate logic gate circuits for driving the phases of charge pump circuits incorporated to the booster circuits. This voltage generating circuit may be integrated in single-well CMOS technology.
Abstract:
A page-mode semiconductor memory device comprises a matrix (1) of memory cells (MC') arranged in rows (R) and columns (C), each row (R) forming a memory page (MP1-MPn) of the memory device and comprising at least one group (MW1,MW2-MW2m-1,MW2m) of memory cells (MC'), memory page selection means (2) for selecting a row (R) of the matrix (1), and a plurality of sensing circuits (3') each one associated to a respective column (C) of the matrix. The memory cells (MC') are multiple-level memory cells which can be programmed in a plurality of c=2 b (b>1) programming states to store b information bits, and the sensing circuits (3') are serial-dichotomic sensing circuits capable of determining, in a number b of consecutive approximation steps, the b information bits stored in the memory cells (MC'), at each step one of said b information bits being determined, said at least one group (MW1,MW2-MW2m-1,MW2m) of memory cells (MC') of a row (R) forming a number b of memory words of a memory page (MP1-MPn).
Abstract:
A device incorporating electrically programmable non-volatile memory cells for a small number of programming cycles, in which an individual cell is impressed, both during the write step and the erase step, a bias condition such that a charge flow can only occur between the drain region and the gate dielectric, and vice versa.
Abstract:
Reading circuit for multilevel non-volatile memory cell devices comprising for each cell to be read a selection line with which is associated a load (ML) and a decoupling and control stage (MF) with a feedback loop (INV) which stabilizes the voltage on a circuit node (F) of the selection line. To this node are connected the current replica circuit means which are controlled by the feedback loop (INV). These include loads (M1,M2,M3) and circuit elements (MC1,MC2,MC3) homologous to those associated with the selection line of the memory cell and have output interface circuit means (A,B,C) for connection to current comparator circuit means.
Abstract:
A sensing circuit for serial dichotomic sensing of multiple-levels memory cells (MC) which can take one programming level among a plurality of m=2 n (n >= 2) different programming levels, comprises biasing means for biasing a memory cell (MC) to be sensed in a predetermined condition, so that the memory cell (MC) sinks a cell current (IC) with a value belonging to a plurality of m distinct cell current values (IC0-IC3), each cell current value (IC0-IC3) corresponding to one of the programming levels, a current comparator (1) for comparing the cell current (IC) with a reference current (IR) generated by a variable reference current generator (G), and a successive approximation register (2) supplied with an output signal (CMP) of the current comparator (1) and controlling the variable reference current generator (G). The variable reference current generator comprises an offset current generator (Ioff) permanently coupled to the current comparator (1), and m-2 distinct current generators (IR0,IR1), independently activatable by the successive approximation register (2), each one generating a current (IC1,IC2) equal to a respective one of the plurality of cell current values (IC0-IC3).
Abstract:
A successive approximation method for sensing multiple-level non-volatile memory cells which can take one of m=2 n (n >=2) different programming levels, provides for biasing a memory cell (MC) to be sensed in a predetermined condition, so that the memory cell (MC) sinks a cell current (IC) with a value belonging to a plurality of m distinct cell current values (IC0-IC3;IC0-IC15), and for : a) comparing the cell current (IC) with a reference current (IR) which has a value comprised between a minimum value and a maximum value of said plurality of m cell current values (IC0-IC3;IC0-IC15), thus dividing said plurality of cell current values (IC0-IC3;IC0-IC15) into two sub-pluralities of cell current values, and determining the sub-plurality of cell current values to which the cell current (IC) belongs; b) repeating the step a) until the sub-plurality of cell current values to which the cell current (IC) belongs comprises only one cell current value, which is the value for the current (IC) of the memory cell (MC) to be sensed.
Abstract translation:用于感测多级非易失性存储器单元逐次逼近方法,其可以采取m个= 2 (N> = 2)不同的编程的水平,提供了一种用于偏置的存储单元(MC)将被在预定的感测到的 条件,所以没有存储器单元(MC)汇的单元电流(IC)与值属于m个不同的单元电流值的多个(IC 0-IC3; IC 0-IC15),以及用于:1)将所述的单元电流( IC)与参考电流(IR),其具有最小值和米单元电流值的所述多个(IC 0-IC3的最大值之间包含的值; IC 0-IC15),从而划分单元电流值的所述多个(IC 0 -IC3; IC 0-IC15)成细胞电流值的两个子多个,和确定性采矿到的电池电流(IC)所属的单元电流值的次多个; B)重复所述步骤a),直至至哪个单元电流(IC)属于仅包括一个单元电流值的单元电流值的次多个,所有这些是存储单元(MC),以用于当前(IC值) 进行检测。
Abstract:
A read circuit for semiconductor memory cells, comprising first and second active elements (M sr ,M sm ) coupled to a supply line (Vdd) via at least a first switch (M1), wherein said first and second active elements are respectively connected, at first (outref) and second (outsel) circuit nodes, respectively, to a first (M LN ), whereby the active elements are coupled to a ground (gnd). These first and second circuit nodes are also connected to said ground through first (CR) and second (CM) capacitive elements, respectively, each having a switch (MPR, MPM) connected in parallel to the capacitive element.