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公开(公告)号：EP0287870A3
公开(公告)日：1989-08-30
申请号：EP88105164.3
申请日：1988-03-30
Applicant: SGS-THOMSON MICROELECTRONICS S.r.l.
Inventor： Massironi, Angelo
IPC: H05K3/30
CPC classification number: H01L23/49548 , H01L2924/0002 , H05K3/308 , H05K3/3447 , H05K2201/09709 , H05K2201/10696 , H05K2201/10757 , H05K2201/10871 , H01L2924/00
Abstract: This package for integrated devices, to be fixed on supporting plates, in particular on printed circuits, comprises contact pins (5a,5b) to be inserted in holes (2) of the supporting plates (1) and to be soldered thereto. To prevent overturning of the package, which may lead to short circuits among the components, at least some (5a) of the contact pins are provided with protruding portions (10) defining abutments cooperating with the supporting plate to limit the inclination of the package with respect to the plate.
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2.发明公开Protection device for integrated circuit associated with relative supports 失效Mit相对于Trägern韵母Schutzanordnungfürintegrierte Schaltung。
公开(公告)号：EP0546435A2
公开(公告)日：1993-06-16
申请号：EP92120546.4
申请日：1992-12-02
Applicant: SGS-THOMSON MICROELECTRONICS S.r.l.
Inventor： Cazzaniga, Claudio , Massironi, Angelo
IPC: H01L23/495
CPC classification number: H01L23/49503 , H01L23/49551 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2224/45099 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
Abstract: A protection device for an integrated circuit (2) associated with a corresponding support (1), said circuit (2) and that part (3) of the support (1) to which it is connected being surrounded by a usual insulating resin (10), the circuit (2) comprising a plurality of lugs (4), electrical connections (7) being provided connecting said circuit (2) to the support (1). On this latter, delimiting means (13, 14) are provided laterally to the integrated circuit (2) to protect its sides (16, 17) at least from moisture, said delimiting means (13, 14) at least partly defining in the support (1) a seat (15) in which the integrated circuit (2) is inserted.
Abstract translation: 用于与相应的支撑件（1），所述电路（2）及其连接的支撑件（1）的部分（3）相关联的集成电路（2）的保护装置被通常的绝缘树脂（10 ），所述电路（2）包括多个凸耳（4），将所述电路（2）连接到所述支撑件（1）上的电连接（7）。 在后者上，限制装置（13,14）横向设置在集成电路（2）上，以保护其侧面（16,17）至少不受潮湿，所述限定装置（13,14）至少部分地限定在支撑件 （1）插入集成电路（2）的座（15）。
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3.发明公开Metal heat sink baseplate for a resin-encapsulated semiconductor device, having raised portions for welding ground connection wires thereon 失效金属基底板的散热片覆盖有一个接地故障连接线的焊接凸部的半导体器件的塑料。
公开(公告)号：EP0497744A1
公开(公告)日：1992-08-05
申请号：EP92830029.2
申请日：1992-01-24
Applicant: SGS-THOMSON MICROELECTRONICS S.r.l.
Inventor： Della Bosca, Pietro , Massironi, Angelo
IPC: H01L23/495 , H01L23/433
CPC classification number: H01L24/49 , H01L23/4334 , H01L23/49568 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/05553 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01322 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/00015
Abstract: A metal heat sink baseplate (3) of a resin-encapsulated semiconductor power device, onto which the semiconductor dice (1) is bonded, is provided with one or more raised portions (12) hear the perimeter of the bond area of the semiconductor dice, onto which ground wires (11) may be welded in order to increase the reliability of wire connections realized between ground connection pads (15) and the metallic heat sink baseplate itself. The raised portions are preferably obtained by deep drawing the metal of the baseplate. A Single-In-Line device is shown wherein the deep drawing of the metal heat sink baseplate for realizing a ridge on the assembly face, to be used for realizing wire ground connections, is formed in a separation zone between a portion (4) of the metallic baseplate which extends beyond the perimeter of the encapsulating resin body and onto which the fastening means of an external heat sink are arranged, and the remaining part of the baseplate onto which the semiconductor dice is bonded. The deep drawing performed in this zone is also instrumental in providing a mechanical decoupling between the two portions of the metallic baseplate for reducing transmission of flection stresses.
Abstract translation: 的树脂密封型半导体功率器件，在其上的半导体管芯（1）键合的金属热沉基板（3），设置有一个或多个凸起部分（12）听到半导体管芯的键合区域的周边 ，在其上的接地线（11）可以以增加接地焊盘（15）和金属制的散热基板本身之间实现线连接的可靠性进行焊接。 凸起部分优选地通过深冲压底板的金属而得到。 单直列设备被示worin金属散热片基板，用于实现在组件表面上的脊部的拉深，将用于实现电线的接地连接时，一个部分之间形成在分离区（4）的 所述金属的底座板，其延伸超出所述包封树脂体的周边和在其上的外部热沉的装置被设置在紧固，和底板在其上的半导体管芯键合的其余部分。 在该区域中进行的深冲因此在减少挠曲应力的传输提供所述金属基体板的两个部分之间的机械去耦工具。
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4.发明授权Integrated device with improved connections between the pins and the semiconductor material chip 失效一种集成电路器件具有改进的销和所述半导体材料芯片之间的连接。
公开(公告)号：EP0418749B1
公开(公告)日：1995-11-29
申请号：EP90117744.4
申请日：1990-09-14
Applicant: SGS-THOMSON MICROELECTRONICS s.r.l.
Inventor： Cini, Carlo , Massironi, Angelo , Sisti, Luigi
IPC: H01L21/607 , H01L23/49
CPC classification number: H01L24/85 , H01L23/49541 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05599 , H01L2224/0603 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48247 , H01L2224/48472 , H01L2224/48599 , H01L2224/48639 , H01L2224/48644 , H01L2224/48699 , H01L2224/48739 , H01L2224/48744 , H01L2224/48799 , H01L2224/48839 , H01L2224/48844 , H01L2224/4903 , H01L2224/49051 , H01L2224/49171 , H01L2224/49175 , H01L2224/49505 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2924/00014 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2224/78 , H01L2924/00 , H01L2224/45147 , H01L2924/00012 , H01L2924/2076 , H01L2924/00015 , H01L2224/85399
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5.发明公开Integrated device with improved connections between the pins and the semiconductor material chip 失效引脚与半导体材料芯片之间的改进连接的集成器件
公开(公告)号：EP0418749A3
公开(公告)日：1991-05-29
申请号：EP90117744.4
申请日：1990-09-14
Applicant: SGS-THOMSON MICROELECTRONICS S.r.l.
Inventor： Cini, Carlo , Massironi, Angelo , Sisti, Luigi
IPC: H01L21/607 , H01L23/49
CPC classification number: H01L24/85 , H01L23/49541 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05599 , H01L2224/0603 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48247 , H01L2224/48472 , H01L2224/48599 , H01L2224/48639 , H01L2224/48644 , H01L2224/48699 , H01L2224/48739 , H01L2224/48744 , H01L2224/48799 , H01L2224/48839 , H01L2224/48844 , H01L2224/4903 , H01L2224/49051 , H01L2224/49171 , H01L2224/49175 , H01L2224/49505 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2924/00014 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2224/78 , H01L2924/00 , H01L2224/45147 , H01L2924/00012 , H01L2924/2076 , H01L2924/00015 , H01L2224/85399
Abstract: An integrated device with improved connections between the pins (5) and the semiconductor material chip (2) which integrates electronic components. In order to allow the integration of signal components and power components in a same device with a reduced use of area for the soldering pads (10,11) and with high reliability of the connections, the connecting wires (8,9) are made of different materials. Advantageously, the wires (9) for the power connections are based on aluminum and have large diameters, and the wires (8) for the signal connections are gold-based and have a small diameter. In order to ensure good soldering, the ends (7) of the pins (5) on which the connecting wires (8,9) are to be soldered are gold-plated.
Abstract translation: 一种具有改进的引脚（5）和半导体材料芯片（2）之间的连接的集成器件，其集成了电子元件。 为了允许将信号部件和功率部件集成在相同的装置中，减少了对焊盘（10,11）的面积的使用并且具有高可靠性的连接，连接线（8,9）由 不同的材料。 有利地，用于电力连接的电线（9）基于铝并且具有大的直径，并且用于信号连接的电线（8）是金基的并且具有小直径。 为了确保焊接良好，要焊接连接线（8,9）的销（5）的端部（7）镀金。
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Patent Agency Ranking
公开(公告)号：EP0287870B1
公开(公告)日：1997-06-25
申请号：EP88105164.3
申请日：1988-03-30
Applicant: SGS-THOMSON MICROELECTRONICS s.r.l.
Inventor： Massironi, Angelo
IPC: H05K3/30
CPC classification number: H01L23/49548 , H01L2924/0002 , H05K3/308 , H05K3/3447 , H05K2201/09709 , H05K2201/10696 , H05K2201/10757 , H05K2201/10871 , H01L2924/00
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7.发明公开
公开(公告)号：EP0546435A3
公开(公告)日：1994-03-16
申请号：EP92120546.4
申请日：1992-12-02
Applicant: SGS-THOMSON MICROELECTRONICS S.r.l.
Inventor： Cazzaniga, Claudio , Massironi, Angelo
IPC: H01L23/495
CPC classification number: H01L23/49503 , H01L23/49551 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2224/45099 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
Abstract: A protection device for an integrated circuit (2) associated with a corresponding support (1), said circuit (2) and that part (3) of the support (1) to which it is connected being surrounded by a usual insulating resin (10), the circuit (2) comprising a plurality of lugs (4), electrical connections (7) being provided connecting said circuit (2) to the support (1). On this latter, delimiting means (13, 14) are provided laterally to the integrated circuit (2) to protect its sides (16, 17) at least from moisture, said delimiting means (13, 14) at least partly defining in the support (1) a seat (15) in which the integrated circuit (2) is inserted.
Abstract translation: 一种用于与相应的支撑件（1）相关联的集成电路（2）的保护装置，所述电路（2）和与其连接的支撑件（1）的部分（3）被通常的绝缘树脂（10 ），所述电路（2）包括多个凸耳（4），提供了将所述电路（2）连接到所述支撑件（1）的电连接（7）。 在后者上，限定装置（13,14）被设置在集成电路（2）的侧面以至少保护其侧面（16,17）不受湿气影响，所述限定装置（13,14）至少部分地限定在支撑件 （1）集成电路（2）插入其中的座位（15）。
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公开(公告)号：EP0414647A3
公开(公告)日：1991-06-05
申请号：EP90830313.4
申请日：1990-07-06
Applicant: SGS-THOMSON MICROELECTRONICS S.r.l.
Inventor： Massironi, Angelo
IPC: H01L23/495 , H01L21/48
CPC classification number: H01L23/49548 , H01L21/4842 , H01L2924/0002 , Y10T29/49204 , Y10T29/49218 , Y10T29/5193 , H01L2924/00
Abstract: The outer portion of a die stamped metal frame encompassing the outer ends of the electrical connecting pins is subjected to press striking for re-establishing planarity and parallelism of the opposite places of the patterned pins which have become deformed during the die stamping, before proceeding to the assembly operations. The eventual bending of the pins of the finished product between a bending punch and a contrasting punch is performed on pins having planar and parallel faces thus preventing twisting and slanting of the bent pins.
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9.发明授权Metal heat sink baseplate for a resin-encapsulated semiconductor device, having raised portions for welding ground connection wires thereon 失效金属基底板的散热片覆盖有凸起部分，用于接地故障的连接线焊接的半导体器件的塑料
公开(公告)号：EP0497744B1
公开(公告)日：1996-09-04
申请号：EP92830029.2
申请日：1992-01-24
Applicant: SGS-THOMSON MICROELECTRONICS S.r.l.
Inventor： Della Bosca, Pietro , Massironi, Angelo
IPC: H01L23/495 , H01L23/433
CPC classification number: H01L24/49 , H01L23/4334 , H01L23/49568 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/05553 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01322 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/00015
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10.发明公开Integrated device with improved connections between the pins and the semiconductor material chip 失效一种集成电路器件具有改进的销和所述半导体材料芯片之间的连接。
公开(公告)号：EP0418749A2
公开(公告)日：1991-03-27
申请号：EP90117744.4
申请日：1990-09-14
Applicant: SGS-THOMSON MICROELECTRONICS S.r.l.
Inventor： Cini, Carlo , Massironi, Angelo , Sisti, Luigi
IPC: H01L21/607 , H01L23/49
CPC classification number: H01L24/85 , H01L23/49541 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05599 , H01L2224/0603 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48247 , H01L2224/48472 , H01L2224/48599 , H01L2224/48639 , H01L2224/48644 , H01L2224/48699 , H01L2224/48739 , H01L2224/48744 , H01L2224/48799 , H01L2224/48839 , H01L2224/48844 , H01L2224/4903 , H01L2224/49051 , H01L2224/49171 , H01L2224/49175 , H01L2224/49505 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2924/00014 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2224/78 , H01L2924/00 , H01L2224/45147 , H01L2924/00012 , H01L2924/2076 , H01L2924/00015 , H01L2224/85399
Abstract: An integrated device with improved connections between the pins (5) and the semiconductor material chip (2) which integrates electronic components. In order to allow the integration of signal components and power components in a same device with a reduced use of area for the soldering pads (10,11) and with high reliability of the connections, the connecting wires (8,9) are made of different materials. Advantageously, the wires (9) for the power connections are based on aluminum and have large diameters, and the wires (8) for the signal connections are gold-based and have a small diameter. In order to ensure good soldering, the ends (7) of the pins (5) on which the connecting wires (8,9) are to be soldered are gold-plated.
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