公开(公告)号：DE69126951T2

公开(公告)日：1998-02-05

申请号：DE69126951

申请日：1991-11-19

Applicant: SHARP KK

Inventor： TANI ZENPEI ,  EBINA KIYOSHI ,  ODA YUKIHISA ,  ONO NOBUMASA ,  MORITA MASAHIRO ,  KOBACHI MITSUO ,  NAGURA KAZUHITO ,  KASHIDA HAJIME ,  SINDO HIROHUMI ,  HOSOKI MITSURU ,  KUMATA KIYOSHI ,  MURAYAMA ATSUSHI ,  KIHARA SEIICHIRO

IPC: G05B19/042

Abstract: An optoelectronic device for sensing an object without any contact, the optoelectronic device being adapted to be connected to a control device which is capable of sending an identification code to the optoelectronic device, the optoelectronic device includes an optoelectronic element (110, 111) for receiving an input signal and for converting the received signal into an electrical, an address memory (121) for storing a self identification code, a determining unit (126) connected to the address memory (121) for determining a coincidence between the self identification code stored in the address memory (121) and the identification code sent from the control device, and an activating unit (127) connected to the determining unit (126) for driving the optoelectronic element (110, 111) at a time when the self identification code coincides with the identification code in accordance with a determined result of the determining unit (126).

公开(公告)号：DE69126951D1

公开(公告)日：1997-08-28

申请号：DE69126951

申请日：1991-11-19

Applicant: SHARP KK

Inventor： TANI ZENPEI ,  EBINA KIYOSHI ,  ODA YUKIHISA ,  ONO NOBUMASA ,  MORITA MASAHIRO ,  KOBACHI MITSUO ,  NAGURA KAZUHITO ,  KASHIDA HAJIME ,  SINDO HIROHUMI ,  HOSOKI MITSURU ,  KUMATA KIYOSHI ,  MURAYAMA ATSUSHI ,  KIHARA SEIICHIRO

IPC: G05B19/042

Abstract: An optoelectronic device for sensing an object without any contact, the optoelectronic device being adapted to be connected to a control device which is capable of sending an identification code to the optoelectronic device, the optoelectronic device includes an optoelectronic element (110, 111) for receiving an input signal and for converting the received signal into an electrical, an address memory (121) for storing a self identification code, a determining unit (126) connected to the address memory (121) for determining a coincidence between the self identification code stored in the address memory (121) and the identification code sent from the control device, and an activating unit (127) connected to the determining unit (126) for driving the optoelectronic element (110, 111) at a time when the self identification code coincides with the identification code in accordance with a determined result of the determining unit (126).

公开(公告)号：JPH0224388B2

公开(公告)日：1990-05-29

申请号：JP21558484

申请日：1984-10-15

Applicant: SHARP KK

Inventor： KASHIDA HAJIME ,  UEDA SHIGENORI

IPC: H01L31/12 ,  H01L31/0232 ,  H01L31/16

公开(公告)号：JPS62143485A

公开(公告)日：1987-06-26

申请号：JP28623785

申请日：1985-12-17

Applicant: SHARP KK

Inventor： KASHIDA HAJIME ,  OKAMOTO HISAKAZU

IPC: H01L31/12

Abstract: PURPOSE:To improve dielectric strength, optical transmission efficiency and common mode signal rejection ratio, by molding the light-receiving side of a light receiving element with a first transparent resin, and molding the light- emitting side of a luminous element with a second flexible resin of high transparency, the two elements of which are arranged on the same plane. CONSTITUTION:Each of a luminous element 2 and a light receiving element 3 is fixed to a lead-frame 1, 1' and arranged on the same plane. As to resin to be filled in the light transmission part between the luminous element 2 and the light receiving element 3, a first transparent resin 10 and a second flexible resin 11 of high transparency are used for a light-receiving side and a light- emitting side respectively, to form a light waveguide. The outer periphery of the light transmission part formed with the above both resins is molded with the same kind of a light-shielding resin as said first transparent resin 10. Common mode signal rejection ratio, optical transmission efficiency and, further, dielectric strength are improved, thereby.

公开(公告)号：JPS60113480A

公开(公告)日：1985-06-19

申请号：JP22238883

申请日：1983-11-24

Applicant: SHARP KK

Inventor： KASHIDA HAJIME ,  SHINDOU HIROFUMI ,  UEDA SHIGENORI

IPC: H01L31/12

Abstract: PURPOSE:To produce miniature photo-interrupter requiring no holder cases by a method wherein the creeping of photo shielding resin to light emitting and receiving windows is prevented by pushing forth devices at the time of molding with the photo shielding resin. CONSTITUTION:A chip 1 is mounted on a lead frame 2, wire-connected 3 to the other lead frame 2, and primarily molded with the photo transmitting resin 4. A light emitting element device 5 and a light receiving element device 5' after primary molding are made opposed and inserted to another cutting die case, and then integral molding is carried out by casting photo shielding resin. Grooves 10 provided respectively in the backs of the devices correspond to the projection provided in the cutting die case at the time of the secondary molding. The primary molded parts of the devices are pushed forth by this projection, and then the part 11 serving as the light emitting and receiving window is pressed on the mold and prevents the creeping of the resin 9 to the window part.

公开(公告)号：JPS6024080A

公开(公告)日：1985-02-06

申请号：JP8292383

申请日：1983-05-11

Applicant: SHARP KK

Inventor： KASHIDA HAJIME ,  KUSUDA KAZUO

IPC: H01L31/12

Abstract: PURPOSE:To protect a light-emitting element by a proper quantity of a precoat, to ensure a distance with a gold wire with the secondary side and to obtain a high withstanding-voltage photo coupler having high reliability by mounting a chip the light-emitting element into a recessed section formed to a lead frame. CONSTITUTION:A recessed section 10 in an area wider than a chip as a light- emitting element 2 is formed to a header in a lead frame 1, and the half or half or more (extending over the whole) of the height of the chip is buried and the chip is mounted and pre-coated 9. Lead frames 1', 3' are arranged in height higher than heads in lead frames 1, 3 to which the light-emitting element 2 and a light-receiving element 4 are fitted, and gold wires 7, 8 are connected. Since the light-emitting element 2 is received in the recessed section and the element 2 can be precoated stably by the dropping of a small quantity of the resin 9, a radiant power output does not deteriorate, and the height of the coating 9 is also inhibited to a low value. Accordingly, withstanding voltage between primary and secondary sides is also kept sufficiently, and a photo coupler having high quality is obtained.

公开(公告)号：JPH0846133A

公开(公告)日：1996-02-16

申请号：JP17830294

申请日：1994-07-29

Applicant: SHARP KK

Inventor： KUBO MASARU ,  KASHIDA HAJIME

IPC: H01L25/00

Abstract: PURPOSE:To obtain a semiconductor device incorporating a capacitor in which short circuit between the electrodes of the capacitor is prevented while reducing the size and cost. CONSTITUTION:The semiconductor device incorporating a capacitor comprises a semiconductor chip 33, a capacitor 32 disposed on the rear side of the semiconductor chip 33, and a part 31a for mounting the capacitor 32 on the rear side thereof, wherein the mounting part 31a is set back from the end part of the capacitor 32 and made smaller than the capacitor 32.

公开(公告)号：JPS62279680A

公开(公告)日：1987-12-04

申请号：JP12520586

申请日：1986-05-28

Applicant: SHARP KK

Inventor： ITO HIROSHI ,  KASHIDA HAJIME

IPC: H01L31/0232 ,  H01L31/12

Abstract: PURPOSE:To improve the bonding strength between resins in an optical coupling element by forming a groovelike recess on a light transmission resin in a direction perpendicular to the removing direction of leads for placing a light emitting element and a photodetector to increase the exposing distance, thereby improving the dielectric strength to stabilize the resin flow. CONSTITUTION:Groovelike recesses 9, 9' crossing perpendicularly to a removing direction of leads for placing a light emitting element 1 and a photodetector 2 are formed to cross perpendicularly to a direction of an electric field applied to between leads 3 and 4 to lengthen exposing distances A, A', thereby improving dielectric strength between an input and an output. when molding a sheath, the resin flow of the molded sheath is stabilized by the recesses on the primary molded item to mechanically improve the bonding strength between resins 7 and 8.

公开(公告)号：JPS62251616A

公开(公告)日：1987-11-02

申请号：JP9574786

申请日：1986-04-24

Applicant: SHARP KK

Inventor： KASHIDA HAJIME ,  KITANISHI SHIGENORI

IPC: G01D5/34 ,  G01D5/347 ,  H01L31/02 ,  H01L31/0232

Abstract: PURPOSE:To reduce the size of a photointerrupter and to improve resolution by forming a light emitting element and a light receiving element of light- transmissive synthetic resin separately by primary molding. CONSTITUTION:The photointerrupter consists of a light-emission side primary molding part 5, a light-reception side primary molding part 10, and a holder part 14 which stores and holds them in one body. The optical path between the light emitting element 1 and light receiving element 3 is determined by the sizes of a light transmission window 6a on the side of the light-emission side primary molding part 5 and a light transmission window 11a on the side of the light-emission side primary molding part 10. For example, when a shield body moves between the molding parts 5 and 10 as shown by an arrow P or R, the output of the light receiving element 3 varies as shown in a figure and position detection accuracy or resolution L1 corresponding to the width l1 of the light transmission windows 6a and 11a is obtained. For the purpose, the width of the light transmission windows 6a and 11a is reduced to obtain the interrupter with high position accuracy and high resolution.

公开(公告)号：JPS62247575A

公开(公告)日：1987-10-28

申请号：JP9053086

申请日：1986-04-18

Applicant: SHARP KK

Inventor： KASHIDA HAJIME ,  ITO HIROSHI ,  KUSUDA KAZUO

IPC: H01L31/12 ,  H01L31/16

Abstract: PURPOSE:To contrive miniaturization, particularly, in size in the thickness direction by providing a structure in which an extremely thin light-transmitting resin layer is formed in the part of rear side of a header part of each internal lead on which an element is mounted or a light-transmitting resin layer is not formed at all. CONSTITUTION:In an optical coupling element of double transfer mold structure in which a light emitting element 1 and a photodetector 2 are opposed and these elements are coupled by forming an optical path composed of a light- transmitting resin 7 and furthermore an outer periphery is molded with a lightscreening resin 8, the light-transmitting resin 7 is formed so as to expose only a rear side part of each of internal leads 3 and 4 on which the light emit ting element 1 and the photodetector element 2 are mounted respectively or that is formed into an extremely thin layer. Thus, miniaturization in size, more particularly, thinning can be contrived.