公开(公告)号：AU2010347928A1

公开(公告)日：2012-09-06

申请号：AU2010347928

申请日：2010-11-02

Applicant: SHARP KK

Inventor： NAGAOKA GEN ,  HIDA YASUHIRO ,  MIYAZAKI HIROKI

IPC: H05K1/02 ,  H05K1/14

Abstract: Disclosed is a circuit board that improves visibility of an alignment mark. An FPC (50) alignment mark is formed by an opaque metallic film when manufacturing a board module that electrically connects a touch-panel (20) and the FPC (50), so visibility is high. With that, if the touch-panel (20) alignment mark (25) is also formed by an opaque metallic film, the alignment mark (25) visibility also becomes higher. Positioning with the touch-panel (20) and FPC (50) is easier and can be implemented with high precision by positioning using these high-visibility alignment marks. This results in increased yield of a board module, and eliminates a need for modification of an alignment apparatus that is used for positioning, so a board module manufacturing cost is reduced.

公开(公告)号：BRPI0920736A2

公开(公告)日：2015-12-29

申请号：BRPI0920736

申请日：2009-06-02

Applicant: SHARP KK

Inventor： NAGAOKA GEN ,  UMEKAWA ICHIRO ,  SHIOTA MOTOJI ,  HIDA YASUHIRO ,  SHIMIZU YUKIO

IPC: H01L21/60 ,  G02F1/1345 ,  H05K1/14 ,  H05K3/32 ,  H05K3/36

公开(公告)号：SG183319A1

公开(公告)日：2012-09-27

申请号：SG2012060240

申请日：2010-11-02

Applicant: SHARP KK

Inventor： NAGAOKA GEN ,  HIDA YASUHIRO ,  MIYAZAKI HIROKI

Abstract: CIRCUIT BOARD, SUBSTRATE MODULE, AND DISPLAY DEVICEProvided is a circuit board in which visibility of an alignment mark is improved.In a case of manufacturing a substrate module in which a touch panel (20) and an FPC (50) are electrically connected, an alignment mark in the FPC (50) is formed by an opaque metal film, so that visibility is high. Consequently, when analignment mark (25) in the touch panel (20) is also formed by an opaque metal film, the visibility of the alignment mark (25) also becomes high. By performing alignment using the alignment marks having high visibility, alignment between the touch panel (20) and the ETC (50) can be performed easily with high precision.As a result, the yield of the substrate module increases and modification of an alignment apparatus used for alignment becomes unnecessary, so that the manufacturing cost of the substrate module can be decreased.Figure 3

公开(公告)号：RU2454843C1

公开(公告)日：2012-06-27

申请号：RU2011117156

申请日：2009-06-02

Applicant: SHARP KK

Inventor： SIOTA MOTODZI ,  NAGAOKA GEN ,  UMEKAVA ITIRO ,  KHIDA JASUKHIRO ,  SIMIZU JUKIO

IPC: H05K3/32

Abstract: Модульплатыотноситсяк жидкокристаллическомудисплейномуустройству (100), котороевключаетв себяплату (140), обладающуюмножествомэлектронныхкомпонентов, такихкакстабилизирующиеконденсаторы (150), смонтированныенаподложке (110) припомощианизотропныхпроводящихадгезивныхматериалов (ACF), покрывающихнетолькообласть, вкотороймонтируютдискретныеэлектронныекомпоненты, нотакжеи верхниеповерхностичипа (130) иплаты, которыемонтируютв первуюочередь. Используяпозиционноеограничениепоприклеиваниюкомпонентовк подложке (110), уменьшаютплощадьобласти, вкотороймонтируютдискретныеэлектронныекомпоненты. Техническийрезультат - миниатюризациямодуляплаты. 3 н. и 17 з.п. ф-лы, 25 ил.

公开(公告)号：EP2472497A4

公开(公告)日：2013-04-24

申请号：EP10811556

申请日：2010-04-06

Applicant: SHARP KK

Inventor： HIDA YASUHIRO ,  NAGAOKA GEN

IPC: G09F9/30 ,  G02F1/1345 ,  G02F1/1368

CPC classification number: G02F1/1345 ,  G02F2201/42

公开(公告)号：EP2326155A4

公开(公告)日：2012-01-11

申请号：EP09815968

申请日：2009-06-02

Applicant: SHARP KK

Inventor： SHIOTA MOTOJI ,  NAGAOKA GEN ,  UMEKAWA ICHIRO ,  HIDA YASUHIRO ,  SHIMIZU YUKIO

IPC: H05K3/32 ,  G02F1/1345 ,  H01L21/60 ,  H05K1/14 ,  H05K3/36

CPC classification number: H05K3/323 ,  G02F1/13452 ,  H01L2224/73204 ,  H01L2924/07811 ,  H05K1/0231 ,  H05K3/284 ,  H05K3/361 ,  H05K2201/0379 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00