Abstract:
기판 장치는 접지를 제공하는 층(240) 또는 전도성 소자 위에 있는 VSD 물질(230)이 내장된 층을 포함한다. 보호될 회로 소자에 연결된 전극(210)은 기판의 두께 내로 연장되어서 VSD층과 접촉하게 한다. 회로 소자가 정상 전압하에서 작동되면, VSD층은 유전체이지만 접지에 연결되지 않는다. 회로 소자 상에 일시적 전기 현상이 일어나면, VSD층은 즉시 전도성 상태로 절환하여 제 1 전극이 접지에 연결된다.
Abstract:
A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.
Abstract:
Embodiments disclosed herein generally relate to structures, methods and devices employing a voltage switchable dielectric material to achieve vertical and/or dual switching protection against ESD and other overvoltage events.
Abstract:
Printed circuit boards including voltage switchable dielectric materials (VSDM) are disclosed. The VSDMs are used to protect electronic components, arranged on or embedded in printed circuit boards, against electric discharges, such as electrostatic discharges or electric overstresses. During an overvoltage event, a VSDM layer shunts excess currents to ground, thereby preventing electronic components from destruction or damage.