公开(公告)号：KR20180008766A

公开(公告)日：2018-01-24

申请号：KR20177036494

申请日：2016-05-18

Applicant: SHOWA DENKO KK

Inventor： MINORIKAWA NAOKI ,  HIRANO MIZUKI ,  YAMADA TOMIHARU

IPC: C08L83/04 ,  C08K3/013 ,  C08K3/38 ,  C08K5/54 ,  C08L33/04

CPC classification number: C08K3/38 ,  C08L33/04 ,  C08L83/04

Abstract: 본발명은 (1) 열경화성실리콘수지, 무기물및 분산제를포함하는수지조성물로서, 상기분산제가적어도 1개의폴리디메틸실록산구조를갖는 (메타)아크릴산에스테르및 (메타)아크릴산알킬에스테르의공중합체이며, 상기무기물이질화붕소, 또는질화붕소와질화붕소이외의무기물의혼합물인실리콘수지조성물, (2) 상기공중합체로이루어지는질화붕소함유실리콘수지조성물용분산제, 및 (3) 상기분산제와, 질화붕소, 또는질화붕소와질화붕소이외의무기물의혼합물로이루어지는무기필러를제공한다. 본발명의실리콘수지조성물은점도가낮으며, 또한메케노미컬처리에대한안정성을갖는다.

Abstract translation: 包含（1）含有热固性硅树脂，无机材料和分散剂，（甲基）丙烯酸酯和（甲基）丙烯酸烷基酯的共聚物的树脂组合物，其中具有至少一个聚二甲基硅氧烷结构的分散剂，该 无机yijilhwa硼，或氮化硼和非氮化硼的硅树脂组合物的无机材料的混合物，（2）的分散剂含有氮化硼形成体，其中，共聚物组合物，和（3）分散剂，氮化硼，或氮化硼的硅树脂 除氮化硼以外的无机填料。 本发明的有机硅树脂组合物具有低粘度并且还具有机械化稳定性。

公开(公告)号：CA2782199A1

公开(公告)日：2011-06-03

申请号：CA2782199

申请日：2010-11-29

Applicant: SHOWA DENKO KK

Inventor： MINORIKAWA NAOKI ,  TAKENOSHITA YOUICHIRO ,  SUZUKI ERIKA

IPC: C08L11/02 ,  C08K5/10 ,  C08K5/41 ,  C08L33/04 ,  C09J11/00 ,  C09J111/02 ,  C09J133/04

Abstract: Disclosed is a chloroprene polymer latex composition for water-based one-pack type adhesives having well-balanced initial adhesive force, contact properties, storage stability and spray coating properties, characterized by comprising 60-95 mass% (in terms of solid content) of a chloroprene polymer latex (A), 5-40 mass% (in terms of solid content) of an acrylic resin latex (B) containing an acrylic polymer having a glass transition temperature of -50 to 0oC, and 0.02-5 parts by mass (in terms of solid content), per 100 parts by mass (containing water) of the sum of said chloroprene polymer latex (A) and said acrylic resin latex (B), of a surfactant (C) represented by general formula (1): RO-(CH2CH2O)n-SO3M (1) wherein R represents an aliphatic alkyl group having 5 to 20 carbon atoms on average; M represents sodium or ammonium; and n (average) is from 2 to 60.

公开(公告)号：AU4408989A

公开(公告)日：1990-05-14

申请号：AU4408989

申请日：1989-10-20

Applicant: SHOWA DENKO KK

Inventor： MARUYAMA SATOSHI ,  MINORIKAWA NAOKI ,  ARAKAWA TSUTOMU ,  YOSHIDA HARUO ,  TAGOSHI HIROTAKA ,  ABE KAZUTO

IPC: C07C327/22 ,  C08F28/02 ,  C08F220/38 ,  C08F299/02 ,  C08G75/04 ,  C08L81/02 ,  C09D4/00 ,  C09J4/00 ,  G02B1/04

Abstract: sulphide of formula (I) is new. Also new are curable compsns. (1) contg. (I) together with (a) a vinyl monomer copolymerisable with (I); (b) a polythiol of formula R(SH)n (where R is a polyvalent organic gp. n is at least 2, pref. 2-5 pref. in the ratio (b):(I) (molar) 0.02-1.01 and the ratio (I):((a)+(b)) 10-90% wt.; (2) contg. (a) a prepolymer obtd. by reaction of (I) with polythiol R(SH)n; (b) a vinyl monomer copolymerisable with (I).

公开(公告)号：DK2508560T3

公开(公告)日：2017-02-20

申请号：DK10833368

申请日：2010-11-29

Applicant: SHOWA DENKO KK

Inventor： MINORIKAWA NAOKI ,  TAKENOSHITA YOUICHIRO ,  SUZUKI ERIKA

IPC: C08L11/02 ,  C08K5/10 ,  C08K5/41 ,  C08L33/04 ,  C09J11/00 ,  C09J111/02 ,  C09J133/04

公开(公告)号：DE69514902T2

公开(公告)日：2000-10-05

申请号：DE69514902

申请日：1995-09-26

Applicant: SHOWA DENKO KK

Inventor： ITO KOICHI ,  KASAHARA HIROSHI ,  MARUYAMA SATOSHI ,  UENO MASAHIRO ,  MINORIKAWA NAOKI

IPC: C08L23/06 ,  C08L23/08 ,  C08L23/12 ,  C08L51/06 ,  C08L63/00 ,  C08L91/00 ,  C08L101/00 ,  C09J123/02 ,  C09J123/06 ,  C09J123/08 ,  C09J123/10 ,  C09J123/12

Abstract: An adhesive resin composition comprising: (A) At least one component selected from the group consisting of (i) polyolefins having a melt flow rate of 0.1 to 30 g/10 min and (ii) olefinic polymers having at least one functional group capable of reacting with an epoxy group; and (B) an epoxy compound having at least two epoxy groups in the molecule and having a number average molecular weight of 3000 or less, wherein the ratio of the component (B) to the total weight of the components (A) and (B) is 0.01 to 5% by weight, and a laminate of (a) a layer composed of the above-mentioned adhesive resin composition and a substrate contacted therewith.

公开(公告)号：CA2782199C

公开(公告)日：2018-04-17

申请号：CA2782199

申请日：2010-11-29

Applicant: SHOWA DENKO KK

Inventor： MINORIKAWA NAOKI ,  TAKENOSHITA YOUICHIRO ,  SUZUKI ERIKA

IPC: C08L11/02 ,  C08K5/10 ,  C08K5/41 ,  C08L33/04 ,  C09J11/00 ,  C09J111/02 ,  C09J133/04

Abstract: Disclosed is a chloroprene polymer latex composition for water-based one-pack type adhesives having well-balanced initial adhesive force, contact properties, storage stability and spray coating properties, characterized by comprising 60-95 mass% (in terms of solid content) of a chloroprene polymer latex (A), 5-40 mass% (in terms of solid content) of an acrylic resin latex (B) containing an acrylic polymer having a glass transition temperature of -50 to 0oC, and 0.02-5 parts by mass (in terms of solid content), per 100 parts by mass (containing water) of the sum of said chloroprene polymer latex (A) and said acrylic resin latex (B), of a surfactant (C) represented by general formula (1): RO-(CH2CH2O)n-SO3M (1) wherein R represents an aliphatic alkyl group having 5 to 20 carbon atoms on average; M represents sodium or ammonium; and n (average) is from 2 to 60.

公开(公告)号：DE69514902D1

公开(公告)日：2000-03-09

申请号：DE69514902

申请日：1995-09-26

Applicant: SHOWA DENKO KK

Inventor： ITO KOICHI ,  KASAHARA HIROSHI ,  MARUYAMA SATOSHI ,  UENO MASAHIRO ,  MINORIKAWA NAOKI

IPC: C08L23/06 ,  C08L23/08 ,  C08L23/12 ,  C08L51/06 ,  C08L63/00 ,  C08L91/00 ,  C08L101/00 ,  C09J123/02 ,  C09J123/06 ,  C09J123/08 ,  C09J123/10 ,  C09J123/12

Abstract: An adhesive resin composition comprising: (A) At least one component selected from the group consisting of (i) polyolefins having a melt flow rate of 0.1 to 30 g/10 min and (ii) olefinic polymers having at least one functional group capable of reacting with an epoxy group; and (B) an epoxy compound having at least two epoxy groups in the molecule and having a number average molecular weight of 3000 or less, wherein the ratio of the component (B) to the total weight of the components (A) and (B) is 0.01 to 5% by weight, and a laminate of (a) a layer composed of the above-mentioned adhesive resin composition and a substrate contacted therewith.

公开(公告)号：AU616064B2

公开(公告)日：1991-10-17

申请号：AU4408989

申请日：1989-10-20

Applicant: SHOWA DENKO KK

Inventor： MARUYAMA SATOSHI ,  MINORIKAWA NAOKI ,  ARAKAWA TSUTOMU ,  YOSHIDA HARUO ,  TAGOSHI HIROTAKA ,  ABE KAZUTO

IPC: C07C327/22 ,  C08F28/02 ,  C08F220/38 ,  C08G75/04 ,  G02B1/04 ,  C08F283/00

Abstract: sulphide of formula (I) is new. Also new are curable compsns. (1) contg. (I) together with (a) a vinyl monomer copolymerisable with (I); (b) a polythiol of formula R(SH)n (where R is a polyvalent organic gp. n is at least 2, pref. 2-5 pref. in the ratio (b):(I) (molar) 0.02-1.01 and the ratio (I):((a)+(b)) 10-90% wt.; (2) contg. (a) a prepolymer obtd. by reaction of (I) with polythiol R(SH)n; (b) a vinyl monomer copolymerisable with (I).

公开(公告)号：EP2508560A4

公开(公告)日：2015-05-27

申请号：EP10833368

申请日：2010-11-29

Applicant: SHOWA DENKO KK

Inventor： MINORIKAWA NAOKI ,  TAKENOSHITA YOUICHIRO ,  SUZUKI ERIKA

IPC: C08L11/02 ,  C08K5/10 ,  C08K5/41 ,  C08L33/04 ,  C09J11/00 ,  C09J111/02 ,  C09J133/04

CPC classification number: C08L11/02 ,  C08K5/41 ,  C09J111/02 ,  C08L33/08 ,  C08L33/10

公开(公告)号：JP2764450B2

公开(公告)日：1998-06-11

申请号：JP34033989

申请日：1989-12-27

Applicant: SHOWA DENKO KK

Inventor： MINORIKAWA NAOKI ,  MARUYAMA SATOSHI ,  UCHIDA HIROSHI

IPC: C08F299/00 ,  C08F290/00 ,  C08F290/06 ,  C08G63/21 ,  C08G63/47 ,  G02B1/04