公开(公告)号：AU4408989A

公开(公告)日：1990-05-14

申请号：AU4408989

申请日：1989-10-20

Applicant: SHOWA DENKO KK

Inventor： MARUYAMA SATOSHI ,  MINORIKAWA NAOKI ,  ARAKAWA TSUTOMU ,  YOSHIDA HARUO ,  TAGOSHI HIROTAKA ,  ABE KAZUTO

IPC: C07C327/22 ,  C08F28/02 ,  C08F220/38 ,  C08F299/02 ,  C08G75/04 ,  C08L81/02 ,  C09D4/00 ,  C09J4/00 ,  G02B1/04

Abstract: sulphide of formula (I) is new. Also new are curable compsns. (1) contg. (I) together with (a) a vinyl monomer copolymerisable with (I); (b) a polythiol of formula R(SH)n (where R is a polyvalent organic gp. n is at least 2, pref. 2-5 pref. in the ratio (b):(I) (molar) 0.02-1.01 and the ratio (I):((a)+(b)) 10-90% wt.; (2) contg. (a) a prepolymer obtd. by reaction of (I) with polythiol R(SH)n; (b) a vinyl monomer copolymerisable with (I).

公开(公告)号：DE3575563D1

公开(公告)日：1990-03-01

申请号：DE3575563

申请日：1985-07-19

Applicant: SHOWA DENKO KK

Inventor： MARUYAMA SATOSHI ,  YOKOTA YOSHIHISA ,  GOTO MASATAKA

IPC: C08F2/44 ,  C08F2/48 ,  C08F2/50 ,  C08G75/04

公开(公告)号：DE69514902T2

公开(公告)日：2000-10-05

申请号：DE69514902

申请日：1995-09-26

Applicant: SHOWA DENKO KK

Inventor： ITO KOICHI ,  KASAHARA HIROSHI ,  MARUYAMA SATOSHI ,  UENO MASAHIRO ,  MINORIKAWA NAOKI

IPC: C08L23/06 ,  C08L23/08 ,  C08L23/12 ,  C08L51/06 ,  C08L63/00 ,  C08L91/00 ,  C08L101/00 ,  C09J123/02 ,  C09J123/06 ,  C09J123/08 ,  C09J123/10 ,  C09J123/12

Abstract: An adhesive resin composition comprising: (A) At least one component selected from the group consisting of (i) polyolefins having a melt flow rate of 0.1 to 30 g/10 min and (ii) olefinic polymers having at least one functional group capable of reacting with an epoxy group; and (B) an epoxy compound having at least two epoxy groups in the molecule and having a number average molecular weight of 3000 or less, wherein the ratio of the component (B) to the total weight of the components (A) and (B) is 0.01 to 5% by weight, and a laminate of (a) a layer composed of the above-mentioned adhesive resin composition and a substrate contacted therewith.

公开(公告)号：DE69514902D1

公开(公告)日：2000-03-09

申请号：DE69514902

申请日：1995-09-26

Applicant: SHOWA DENKO KK

Inventor： ITO KOICHI ,  KASAHARA HIROSHI ,  MARUYAMA SATOSHI ,  UENO MASAHIRO ,  MINORIKAWA NAOKI

IPC: C08L23/06 ,  C08L23/08 ,  C08L23/12 ,  C08L51/06 ,  C08L63/00 ,  C08L91/00 ,  C08L101/00 ,  C09J123/02 ,  C09J123/06 ,  C09J123/08 ,  C09J123/10 ,  C09J123/12

Abstract: An adhesive resin composition comprising: (A) At least one component selected from the group consisting of (i) polyolefins having a melt flow rate of 0.1 to 30 g/10 min and (ii) olefinic polymers having at least one functional group capable of reacting with an epoxy group; and (B) an epoxy compound having at least two epoxy groups in the molecule and having a number average molecular weight of 3000 or less, wherein the ratio of the component (B) to the total weight of the components (A) and (B) is 0.01 to 5% by weight, and a laminate of (a) a layer composed of the above-mentioned adhesive resin composition and a substrate contacted therewith.

公开(公告)号：AU616064B2

公开(公告)日：1991-10-17

申请号：AU4408989

申请日：1989-10-20

Applicant: SHOWA DENKO KK

Inventor： MARUYAMA SATOSHI ,  MINORIKAWA NAOKI ,  ARAKAWA TSUTOMU ,  YOSHIDA HARUO ,  TAGOSHI HIROTAKA ,  ABE KAZUTO

IPC: C07C327/22 ,  C08F28/02 ,  C08F220/38 ,  C08G75/04 ,  G02B1/04 ,  C08F283/00

Abstract: sulphide of formula (I) is new. Also new are curable compsns. (1) contg. (I) together with (a) a vinyl monomer copolymerisable with (I); (b) a polythiol of formula R(SH)n (where R is a polyvalent organic gp. n is at least 2, pref. 2-5 pref. in the ratio (b):(I) (molar) 0.02-1.01 and the ratio (I):((a)+(b)) 10-90% wt.; (2) contg. (a) a prepolymer obtd. by reaction of (I) with polythiol R(SH)n; (b) a vinyl monomer copolymerisable with (I).

公开(公告)号：EP0231375A4

公开(公告)日：1987-11-12

申请号：EP85903696

申请日：1985-07-19

Applicant: SHOWA DENKO KK

Inventor： MARUYAMA SATOSHI ,  YOKOTA YOSHIHISA ,  GOTO MASATAKA

IPC: C08F2/44 ,  C08F2/48 ,  C08F2/50 ,  C08G75/04

CPC classification number: C08F2/48

Abstract: A photo-setting composition prepared by compounding a polymerizable monomer and/or oligomer with (1) an UV absorber having extinction coefficients of 2,000/M.cm or more at 300 to 350 nm and 1,000/M.cm or less at 360 nm and (2) a photopolymerization initiator having an extinction coefficient of 10/M.cm or less at 390 nm. A colorless, transparent, thick setting product uniformly set to the core can be obtained by irradiating the composition with UV rays from a light source emitting light of 360 to 380 nm.

公开(公告)号：JP2764450B2

公开(公告)日：1998-06-11

申请号：JP34033989

申请日：1989-12-27

Applicant: SHOWA DENKO KK

Inventor： MINORIKAWA NAOKI ,  MARUYAMA SATOSHI ,  UCHIDA HIROSHI

IPC: C08F299/00 ,  C08F290/00 ,  C08F290/06 ,  C08G63/21 ,  C08G63/47 ,  G02B1/04

公开(公告)号：JPH08193148A

公开(公告)日：1996-07-30

申请号：JP658995

申请日：1995-01-19

Applicant: SHOWA DENKO KK

Inventor： ITO KOICHI ,  KASAHARA HIROSHI ,  MARUYAMA SATOSHI ,  UENO MASAHIRO ,  MINORIKAWA NAOKI

IPC: B32B27/00 ,  B32B27/08 ,  C08K5/15 ,  C08K5/1515 ,  C08L23/00 ,  C08L23/26 ,  C08L63/00 ,  C09J123/26

Abstract: PURPOSE: To provide a resin compsn. having excellent adhesion to a polyester and a laminate thereof. CONSTITUTION: This resin compsn. comprises: (A) a polyolefin resin having at least one functional group selected from an acid anhydride group, a carboxyl group, and a metal salt of a carboxylic acid; and (B) an epoxy compd. having two or more epoxy groups and a molecular weight of not more than 3000. The content of the component (B) in the compsn. is 0.01 to 5wt.% based on 100 pts.wt. component (A).

公开(公告)号：JPH07304911A

公开(公告)日：1995-11-21

申请号：JP11223094

申请日：1994-04-27

Applicant: SHOWA DENKO KK

Inventor： WASHIYAMA JUNICHIRO ,  TAKENOUCHI HIROSHI ,  MARUYAMA SATOSHI ,  ITO KOICHI ,  KASAHARA HIROSHI ,  MOGI YOSHIHIRO

IPC: C08L23/16 ,  C09J123/16 ,  C09J153/00

Abstract: PURPOSE:To obtain an adhesive resin compsn. capable of exhibiting a strong adhesion between a polypropylene polymer and a polyethylene polymer even without a corona discharge treatment or a pretreatment with a coupling agent. CONSTITUTION:An adhesive resin compsn. comprises (A) EPR having melting peak temp. of 30 to 70 deg.C and a critical energy release rate (Gc) of at least 100 (J/m ) between the same and a reference polypropylene; and (B) a polystyrene-ethylene/butene-polyethylene triblock copolymer having melting peak temp. of 50 to 105 deg.C and a Gc of at least 100 (J/m ), or a polyethylene- ethylene/butene-polyethylene triblock copolymer having a melting peak temp. of 50 to 105 deg.C and a Gc of at least 100 (J/m ), and the amt. of the copolymer (B) is 5 to 95 pts.wt. per 100 pts.wt. in total of the component A and B.

公开(公告)号：JPH06145510A

公开(公告)日：1994-05-24

申请号：JP30123692

申请日：1992-11-11

Applicant: SHOWA DENKO KK

Inventor： MATSUOKA KUMIKO ,  TAKEDA TADASHI ,  MARUYAMA SATOSHI ,  TOMITA HIROYUKI

IPC: C08K9/06 ,  C08L77/00

Abstract: PURPOSE:To obtain the title composition excellent in mechanical strength and resistance to heat, water, and solvents by mixing a polyamide resin with a specific inorganic filler in a given proportion. CONSTITUTION:The composition comprises 20-98wt.% polyamide resin (e.g. nylon 66) and 80-2wt.% inorganic filler (e.g. glass fibers) surface-treated with a succinic acid (anhydride) derivative represented by formula I or II wherein R1 to R3 each is a 1-10C alkyl, R4 and R5 each is H or CH3, and n is 1-15.