-
公开(公告)号：DE69228302T2
公开(公告)日：1999-06-17
申请号：DE69228302
申请日：1992-11-02
Applicant: SHOWA DENKO KK
-
公开(公告)号：CA2098565A1
公开(公告)日：1993-05-06
申请号：CA2098565
申请日：1992-11-02
Applicant: SHOWA DENKO KK
Inventor： TAGOSHI HIROTAKA , MIKAWA YASUHIRO , UENO MASAHIRO , INAZAWA SHINTARO , TSUTSUMI KATSUAKI , HAGI HIROYUKI , OKAMOTO YUKIO
Abstract: A thermally reversible crosslinked resin composition comprising a specific ethylenic copolymer, a specific polyhydric alcohol and a specific reaction promoter and a molded article produced by utilizing the resin composition are disclosed. Because the resin composition and the molded article have a high reaction rate of dissociation of the crosslinking during heating and a high reaction rate of formation of the crosslinking during cooling, they can be utilized for various applications, such as melt molding and the like, as the the thermally reversible crosslinked resin composition and the thermally reversible crosslinked molded article which are substantially valuable for commercial application. 57
-
公开(公告)号：DE69514902D1
公开(公告)日：2000-03-09
申请号：DE69514902
申请日：1995-09-26
Applicant: SHOWA DENKO KK
Inventor： ITO KOICHI , KASAHARA HIROSHI , MARUYAMA SATOSHI , UENO MASAHIRO , MINORIKAWA NAOKI
IPC: C08L23/06 , C08L23/08 , C08L23/12 , C08L51/06 , C08L63/00 , C08L91/00 , C08L101/00 , C09J123/02 , C09J123/06 , C09J123/08 , C09J123/10 , C09J123/12
Abstract: An adhesive resin composition comprising: (A) At least one component selected from the group consisting of (i) polyolefins having a melt flow rate of 0.1 to 30 g/10 min and (ii) olefinic polymers having at least one functional group capable of reacting with an epoxy group; and (B) an epoxy compound having at least two epoxy groups in the molecule and having a number average molecular weight of 3000 or less, wherein the ratio of the component (B) to the total weight of the components (A) and (B) is 0.01 to 5% by weight, and a laminate of (a) a layer composed of the above-mentioned adhesive resin composition and a substrate contacted therewith.
-
公开(公告)号：DE69228302D1
公开(公告)日：1999-03-11
申请号：DE69228302
申请日：1992-11-02
Applicant: SHOWA DENKO KK
-
公开(公告)号：DE69514902T2
公开(公告)日：2000-10-05
申请号：DE69514902
申请日：1995-09-26
Applicant: SHOWA DENKO KK
Inventor： ITO KOICHI , KASAHARA HIROSHI , MARUYAMA SATOSHI , UENO MASAHIRO , MINORIKAWA NAOKI
IPC: C08L23/06 , C08L23/08 , C08L23/12 , C08L51/06 , C08L63/00 , C08L91/00 , C08L101/00 , C09J123/02 , C09J123/06 , C09J123/08 , C09J123/10 , C09J123/12
Abstract: An adhesive resin composition comprising: (A) At least one component selected from the group consisting of (i) polyolefins having a melt flow rate of 0.1 to 30 g/10 min and (ii) olefinic polymers having at least one functional group capable of reacting with an epoxy group; and (B) an epoxy compound having at least two epoxy groups in the molecule and having a number average molecular weight of 3000 or less, wherein the ratio of the component (B) to the total weight of the components (A) and (B) is 0.01 to 5% by weight, and a laminate of (a) a layer composed of the above-mentioned adhesive resin composition and a substrate contacted therewith.
-
Patent Agency Ranking
公开(公告)号：EP0565734A4
公开(公告)日：1995-01-25
申请号：EP92922659
申请日：1992-11-02
Applicant: SHOWA DENKO KK
Inventor： TAGOSHI HIROTAKA SHOWA DENKO K , MIKAWA YASUHIRO SHOWA DENKO K , UENO MASAHIRO , INAZAWA SHINTARO SHOWA DENKO K , TSUTSUMI KATSUAKI SHOWA DENKO , HAGI HIROYUKI SHOWA DENKO K K , OKAMOTO YUKIO SHOWA DENKO K K
IPC: C08K5/05 , C08K5/06 , C08L23/08 , C08L71/02 , C08K5/09 , C08K5/10 , C08K5/15 , C08K5/17 , C08L23/26 , C08L29/04 , C08L33/14
CPC classification number: C08K5/06 , C08K5/05 , C08L23/0869 , C08L23/0876 , C08L71/02 , C08L2205/03 , C08L2312/00 , C08L23/08 , C08L2666/06 , C08L2666/02 , C08L2666/04
Abstract: A resin composition comprising a specified ethylenic copolymer, a polyhydric alcohol and a reaction promoter, and a thermally reversibly cross-linking molding produced therefrom. Because both the composition and the molding have a high cross-linkage dissociating velocity when heated and a high cross-linkage forming velocity when cooled, they can be utilized in various applications including melt molding as substantially practicable, thermally reversibly cross-linking composition and molding.
-
公开(公告)号：JPH05286037A
公开(公告)日：1993-11-02
申请号：JP11531292
申请日：1992-04-08
Applicant: SHOWA DENKO KK
Inventor： UENO MASAHIRO , TSUTSUMI KATSUAKI , TERASAWA TAKEO , TAKOSHI HIROTAKA , IWASAKI KUNIO , NAGAOKA KOJI
IPC: B29C65/48 , B29L9/00 , B32B21/08 , C09J5/06 , C09J7/00 , C09J7/02 , C09J123/02 , C09J123/08 , C09J133/02 , C09J133/04
Abstract: PURPOSE:To simplify a bonding process in the production of plywood and to develop high bonding strength immediately after bonding by using a resin compsn. based on an ethylenic copolymer composed of a radical polymerizable comonomer as an adhesive material. CONSTITUTION:In the production of plywood an ethylenic copolymer consisting of ethylene and a radical polymerizable acid anhydride or a radical polymerizable comonomer other than said anhydride or a resin compsn. based on the ethylenic copolymer is used as the extrusion coating layer formed on a plate material as a film with a thickness of 10-100mum. The powder of the copolymer or the resin compsn. based on the copolymer is uniformly scattered between plate materials in a ratio of 5-50g/m to be held between the plate materials and thermally bonded to the plate material by a heating press or high frequency induction heating.
-
公开(公告)号：JPH0948881A
公开(公告)日：1997-02-18
申请号：JP19876595
申请日：1995-08-03
Applicant: SHOWA DENKO KK
Inventor： MINORIKAWA NAOKI , UENO MASAHIRO , OKAMOTO KOJI
Abstract: PROBLEM TO BE SOLVED: To obtain the subject composition excellent in low neck-in properties without causing molding trouble such as thickening of both film selvedges or the film caught by rolls and further a resin loss due to the cutting of both the selvedges by blending a specific polyolefin-based resin mixture with an inorganic filler. SOLUTION: This resin composition for laminating is obtained by blending (A) 100 pts.wt. polyolefin-based resin mixture comprising (A1 ) a polyolefin-based resin containing functional groups such as an ethylene-maleic anhydride copolymer or an ethylene-(meth)acrylic acid (metallic salt) copolymer and (A2 ) a polyolefin-based resin such as polyethylene or polypropylene at 0-80wt.% mixing ratio of the component (A2 ) with (B) 0.01-4 pts.wt. inorganic filler such as talc or clay.
-
公开(公告)号：JPH0657062A
公开(公告)日：1994-03-01
申请号：JP20984792
申请日：1992-08-06
Applicant: SHOWA DENKO KK
Inventor： MIKAWA YASUHIRO , UENO MASAHIRO , TAKOSHI HIROTAKA , NAGAOKA KOJI , INASAWA SHINTARO
Abstract: PURPOSE:To provide a heat reversible crosslinkable resin composition having an extremely high crosslinking formation reaction rate and crosslinking dissociation reaction rate and a molded article using the same composition. CONSTITUTION:A resin composition comprises (a) a modified polyolefin which is a modified polyolefin onto which at least one unsaturated carboxylic anhydride is grafted wherein the component concentration of an unsaturated carboxylic anhydride group in the modified polyolefin is 0.1-20wt.%, (b) a polyhydric alcohol compound containing at least two hydroxyl groups in the molecule and (c) a reaction promoter wherein the molar ratio of the hydroxyl group unit in the polyhydric alcohol compound to the unit derived from the unsaturated carboxylic anhydride in the modified polyolefin is 0.01-10 and the amount of the reaction promoter is 0.001-20 pts.wt. based on 100 pts.wt of the modified polyolefin.
-
公开(公告)号：JPH08193148A
公开(公告)日：1996-07-30
申请号：JP658995
申请日：1995-01-19
Applicant: SHOWA DENKO KK
Inventor： ITO KOICHI , KASAHARA HIROSHI , MARUYAMA SATOSHI , UENO MASAHIRO , MINORIKAWA NAOKI
IPC: B32B27/00 , B32B27/08 , C08K5/15 , C08K5/1515 , C08L23/00 , C08L23/26 , C08L63/00 , C09J123/26
Abstract: PURPOSE: To provide a resin compsn. having excellent adhesion to a polyester and a laminate thereof. CONSTITUTION: This resin compsn. comprises: (A) a polyolefin resin having at least one functional group selected from an acid anhydride group, a carboxyl group, and a metal salt of a carboxylic acid; and (B) an epoxy compd. having two or more epoxy groups and a molecular weight of not more than 3000. The content of the component (B) in the compsn. is 0.01 to 5wt.% based on 100 pts.wt. component (A).
-
-
-
-
-
-
-
-
-
Search Results
10
records
(took 0.026 seconds)
