Abstract:
The invention relates to a relay connector comprising a three-dimensional base body consisting of insulating material, the upper side of said body having a bearing surface for the component in addition to internal contacts for electrically connecting to subassembly connections, and the underside having studs formed from insulating material for forming external contacts. The internal contacts are connected to the external contacts on the underside by means of printed conductors and plated holes. Said plated holes are created by vias in a plated hole region, preferably by means of laser drilling, whereby the wall thickness of the base body in the plated hole region is reduced by a recess. The invention enables the vias and the entire relay connector to be produced rapidly and cost-effectively by means of laser machining.
Abstract:
The connection housing comprises a base body (1) with lateral walls (2), which extend around the base body on the top and which enclose the component (6) to be inserted as well as inner contacts (8) that are arranged between the component and at least one lateral wall. Polymer protuberances (3) for forming outer contacts (4) are shaped onto the underside. The connection between the inner contacts (8) of the top and the outer contacts (4) of the underside is effected by micro-boreholes (11) that are located underneath the component (6) in the middle area of the base body (1). This results in the provision of a housing, which requires little space on a printed circuit board and which can be economically produced preferably while using laser structuring.
Abstract:
In order to seal the mould cavity between two mould parts (1, 2) of an injection mould, a sealing lip (8) consisting of an elastic plastic, which remains stable at the working temperature of said injection mould, is located in the border region between the mould cavity (6) and the sealing gap between the two mould parts (1, 2). This enables the mould to be sealed in a cost-effective manner, without exposing highly sensitive electronic inserts to the risk of crushing.