RELAY CONNECTOR FOR AN ELECTRONIC COMPONENT AND A METHOD FOR PRODUCING THE SAME
    1.
    发明申请
    RELAY CONNECTOR FOR AN ELECTRONIC COMPONENT AND A METHOD FOR PRODUCING THE SAME 审中-公开
    连接支持欲了解的电子元件和方法

    公开(公告)号:WO02089205A3

    公开(公告)日:2003-08-07

    申请号:PCT/DE0201279

    申请日:2002-04-08

    Abstract: The invention relates to a relay connector comprising a three-dimensional base body consisting of insulating material, the upper side of said body having a bearing surface for the component in addition to internal contacts for electrically connecting to subassembly connections, and the underside having studs formed from insulating material for forming external contacts. The internal contacts are connected to the external contacts on the underside by means of printed conductors and plated holes. Said plated holes are created by vias in a plated hole region, preferably by means of laser drilling, whereby the wall thickness of the base body in the plated hole region is reduced by a recess. The invention enables the vias and the entire relay connector to be produced rapidly and cost-effectively by means of laser machining.

    Abstract translation: 终端载体具有绝缘具有在其上侧的装置的支撑面的基体以及内部触点用于与部件端子和它的绝缘材料的下侧一体地模制凸块电连接以形成外部接触的三维地形成。 内部的接点经由互连和通路与底部上的外部触点连接。 通孔优选地通过在微孔通过与激光钻孔产生的连接,其特征在于,通过在基体的壁厚连接所述由凹部减小。 以这种方式,快速和经济的生产微孔的和整个连接载体通过激光加工的手段是可能的。

    CONNECTION HOUSING FOR AN ELECTRONIC COMPONENT
    2.
    发明申请
    CONNECTION HOUSING FOR AN ELECTRONIC COMPONENT 审中-公开
    连接壳体用于电子元件

    公开(公告)号:WO02089257A3

    公开(公告)日:2003-01-03

    申请号:PCT/DE0201280

    申请日:2002-04-08

    Inventor: STRIEBEL DIRK

    Abstract: The connection housing comprises a base body (1) with lateral walls (2), which extend around the base body on the top and which enclose the component (6) to be inserted as well as inner contacts (8) that are arranged between the component and at least one lateral wall. Polymer protuberances (3) for forming outer contacts (4) are shaped onto the underside. The connection between the inner contacts (8) of the top and the outer contacts (4) of the underside is effected by micro-boreholes (11) that are located underneath the component (6) in the middle area of the base body (1). This results in the provision of a housing, which requires little space on a printed circuit board and which can be economically produced preferably while using laser structuring.

    Abstract translation: 端子壳体具有一基体(1)与所述上侧运行周围侧壁(2),其围绕要被插入的部件(6)和布置在所述部件和所述至少一个侧壁之间的接触内(8)。 上模塑的聚合物螺栓(3),用于外部触点(4)的形成的下侧一体地形成。 顶表面的内部触点(8)和外部触头之间的连接(4),通过该被布置在基体的中心区域的微孔(11)的底部(1)的组件的下方(6)。 以这种方式,具有小足迹在电路板上,这是在以经济的方式,优选地使用激光图案化,壳体来生产。

    METHOD AND MOULD FOR ENCAPSULATING ELECTRONIC CIRCUIT CARRIERS BY INJECTION MOULDING
    3.
    发明申请
    METHOD AND MOULD FOR ENCAPSULATING ELECTRONIC CIRCUIT CARRIERS BY INJECTION MOULDING 审中-公开
    方法和模具电子线路封装货船

    公开(公告)号:WO0184618A3

    公开(公告)日:2002-02-07

    申请号:PCT/DE0101644

    申请日:2001-04-30

    Abstract: In order to seal the mould cavity between two mould parts (1, 2) of an injection mould, a sealing lip (8) consisting of an elastic plastic, which remains stable at the working temperature of said injection mould, is located in the border region between the mould cavity (6) and the sealing gap between the two mould parts (1, 2). This enables the mould to be sealed in a cost-effective manner, without exposing highly sensitive electronic inserts to the risk of crushing.

    Abstract translation: 为了密封两个模具部件(1,2)的注塑模具之间的模腔内,是在模腔(6)和两个模具部分之间的闭合间隙(1,2)抗性之间的边界区域中的密封唇(8)由弹性的,在注射模具的工作温度 塑料布置。 从而廉价的形式密封的结果而不高度敏感的电子嵌入件的破碎的风险。

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