公开(公告)号：EP3189541A4

公开(公告)日：2018-05-02

申请号：EP15837255

申请日：2015-09-02

Applicant: SKORPIOS TECH INC

Inventor： LAMBERT DAMIEN ,  SPANN JOHN ,  KRASULICK STEPHEN

IPC: H01L21/60 ,  H01L21/683 ,  H01L23/00

CPC classification number: H01L21/6835 ,  G02B6/4201 ,  H01L21/0274 ,  H01L21/2007 ,  H01L21/683 ,  H01L21/76254 ,  H01L24/03 ,  H01L24/27 ,  H01L24/75 ,  H01L24/83 ,  H01L24/89 ,  H01L24/94 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68318 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/0362 ,  H01L2224/75305 ,  H01L2224/75315 ,  H01L2224/80201 ,  H01L2224/83001 ,  H01L2224/83203 ,  H01L2225/06593 ,  H01L2924/01014 ,  H01L2924/1032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/15738

Abstract: A transfer substrate with a compliant resin is used to bond one or more chips to a target wafer. An implant region is formed in a transfer substrate. A portion of the transfer substrate is etched to form a riser. Compliant material is applied to the transfer substrate. A chip is secured to the compliant material, wherein the chip is secured to the compliant material above the riser. The chip is bonded to a target wafer while the chip is secured to the compliant material. The transfer substrate and compliant material are removed from the chip. The transfer substrate is opaque to UV light.