公开(公告)号：EP2489106A4

公开(公告)日：2018-01-17

申请号：EP10823920

申请日：2010-10-12

Applicant: SKORPIOS TECH INC

Inventor： DALLESASSE JOHN M ,  KRASULICK STEPHEN B ,  KOZLOVSKY WILLIAM

IPC: H01S3/10 ,  H01S5/02 ,  H01S5/022 ,  H01S5/024 ,  H01S5/10 ,  H01S5/14

CPC classification number: H01S5/021 ,  H01S3/10053 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/02446 ,  H01S5/1003 ,  H01S5/1032 ,  H01S5/141 ,  H01S5/142 ,  H01S2301/14

Abstract: A tunable laser includes a substrate comprising a silicon material and a gain medium coupled to the substrate. The gain medium includes a compound semiconductor material. The tunable laser also includes a waveguide disposed in the substrate and optically coupled to the gain medium, a first wavelength selective element characterized by a first reflectance spectrum and disposed in the substrate, and a second wavelength selective element characterized by a second reflectance spectrum and disposed in the substrate. The tunable laser further includes an optical coupler disposed in the substrate and joining the first wavelength selective element, the second wavelength selective element, and the waveguide and an output mirror.

公开(公告)号：EP3189541A4

公开(公告)日：2018-05-02

申请号：EP15837255

申请日：2015-09-02

Applicant: SKORPIOS TECH INC

Inventor： LAMBERT DAMIEN ,  SPANN JOHN ,  KRASULICK STEPHEN

IPC: H01L21/60 ,  H01L21/683 ,  H01L23/00

CPC classification number: H01L21/6835 ,  G02B6/4201 ,  H01L21/0274 ,  H01L21/2007 ,  H01L21/683 ,  H01L21/76254 ,  H01L24/03 ,  H01L24/27 ,  H01L24/75 ,  H01L24/83 ,  H01L24/89 ,  H01L24/94 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68318 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/0362 ,  H01L2224/75305 ,  H01L2224/75315 ,  H01L2224/80201 ,  H01L2224/83001 ,  H01L2224/83203 ,  H01L2225/06593 ,  H01L2924/01014 ,  H01L2924/1032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/15738

Abstract: A transfer substrate with a compliant resin is used to bond one or more chips to a target wafer. An implant region is formed in a transfer substrate. A portion of the transfer substrate is etched to form a riser. Compliant material is applied to the transfer substrate. A chip is secured to the compliant material, wherein the chip is secured to the compliant material above the riser. The chip is bonded to a target wafer while the chip is secured to the compliant material. The transfer substrate and compliant material are removed from the chip. The transfer substrate is opaque to UV light.

公开(公告)号：EP3286587A1

公开(公告)日：2018-02-28

申请号：EP16783759

申请日：2016-04-20

Applicant: SKORPIOS TECH INC

Inventor： LAMBERT DAMIEN

IPC: G02B6/14 ,  G02B6/122 ,  G02B6/136

CPC classification number: G02B6/125 ,  G02B6/132 ,  G02B6/136 ,  G02B2006/12061 ,  G02B2006/12097 ,  G02B2006/12104 ,  G02B2006/12147 ,  G02B2006/12169

Abstract: A method forms a vertical output coupler for a waveguide that propagates light along a horizontal propagation direction, through a waveguide material that overlies a buried oxide layer. The method includes etching the waveguide to remove a portion of the waveguide. The etching forms at least a first plane that is at an edge of the waveguide, is adjacent to the removed portion of the waveguide, and is tilted at a vertical angle between 20 degrees and 70 degrees with respect to the propagation direction. The method further includes coating the first tilted plane with a reflective metal to form a mirror, such that the mirror reflects the light into a direction having a vertical component.

公开(公告)号：EP3149522A4

公开(公告)日：2018-02-21

申请号：EP15800295

申请日：2015-05-27

Applicant: SKORPIOS TECH INC

Inventor： LAMBERT DAMIEN ,  KUMAR NIKHIL ,  MARCHENA ELTON ,  LIU DAMING ,  LI GUOLIANG ,  ZYSKIND JOHN

IPC: G02B6/12

CPC classification number: G02B6/14 ,  G02B6/1228 ,  G02B6/132 ,  G02B6/136 ,  G02B6/305 ,  G02B2006/12038 ,  G02B2006/12061 ,  G02B2006/12097 ,  G02B2006/12147 ,  G02B2006/12152

Abstract: A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder and a ridge. In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages having different widths at a given cross section.

公开(公告)号：EP3114515A4

公开(公告)日：2017-11-29

申请号：EP15759247

申请日：2015-03-09

Applicant: SKORPIOS TECH INC

Inventor： LI GUOLIANG ,  KUMAR NIKHIL ,  CHAOUCH HACENE

IPC: G02B6/36 ,  G02B6/122 ,  H01S5/02

CPC classification number: H01S5/12 ,  G02B6/1228 ,  G02B6/125 ,  G02B2006/12097 ,  G02B2006/12147 ,  H01S3/0315 ,  H01S3/063 ,  H01S3/0635 ,  H01S3/0675 ,  H01S3/08009 ,  H01S3/1003 ,  H01S3/1055 ,  H01S5/021 ,  H01S5/0612 ,  H01S5/0683 ,  H01S5/1032 ,  H01S5/1218 ,  H01S5/1234 ,  H01S5/141 ,  H01S5/3013

Abstract: An optical, directional coupler has a first input, a second input, a first output, and a second output. The coupler is made with a shoulder disposed on a substrate and a first ridge and a second ridge disposed on the shoulder. The first ridge extends from the first input to the first output. The second ridge extends from the second input to the second output. The shoulder, the first ridge, and the second ridge taper to provide coupling and are modified to select a coupling ratio.

公开(公告)号：EP3055879A4

公开(公告)日：2017-08-09

申请号：EP14851684

申请日：2014-10-09

Applicant: SKORPIOS TECH INC

Inventor： KRASULICK STEPHEN B ,  DALLESASSE JOHN ,  MIZRAHI AMIT ,  CREAZZO TIMOTHY ,  MARCHENA ELTON ,  SPANN JOHN Y

IPC: H01L23/13 ,  G02B6/42 ,  H01L23/28 ,  H01S5/02 ,  H01S5/022 ,  H01S5/024 ,  H01S5/026

CPC classification number: H01L31/02327 ,  G02B6/423 ,  H01S5/0207 ,  H01S5/021 ,  H01S5/0217 ,  H01S5/0218 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02252 ,  H01S5/02268 ,  H01S5/02272 ,  H01S5/02469 ,  H01S5/026 ,  H01S5/3013 ,  H01S2301/176

Abstract: A method for fabricating a composite device comprises providing a platform, providing a chip, and bonding the chip to the platform. The platform has a base layer and a device layer above the base layer. An opening in the device layer exposes a portion of the base layer. The chip is bonded to the portion of the base layer exposed by the opening in the device layer. A portion of the chip extends above the platform and is removed.

Abstract translation: 用于制造复合器件的方法包括提供平台，提供芯片以及将芯片结合到平台。 该平台在基础层之上具有基础层和设备层。 器件层中的开口暴露基础层的一部分。 芯片粘合到由器件层中的开口暴露的基层的部分。 芯片的一部分在平台上方延伸并被移除。