公开(公告)号：EP3189541A4

公开(公告)日：2018-05-02

申请号：EP15837255

申请日：2015-09-02

Applicant: SKORPIOS TECH INC

Inventor： LAMBERT DAMIEN ,  SPANN JOHN ,  KRASULICK STEPHEN

IPC: H01L21/60 ,  H01L21/683 ,  H01L23/00

CPC classification number: H01L21/6835 ,  G02B6/4201 ,  H01L21/0274 ,  H01L21/2007 ,  H01L21/683 ,  H01L21/76254 ,  H01L24/03 ,  H01L24/27 ,  H01L24/75 ,  H01L24/83 ,  H01L24/89 ,  H01L24/94 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68318 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/0362 ,  H01L2224/75305 ,  H01L2224/75315 ,  H01L2224/80201 ,  H01L2224/83001 ,  H01L2224/83203 ,  H01L2225/06593 ,  H01L2924/01014 ,  H01L2924/1032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/15738

Abstract: A transfer substrate with a compliant resin is used to bond one or more chips to a target wafer. An implant region is formed in a transfer substrate. A portion of the transfer substrate is etched to form a riser. Compliant material is applied to the transfer substrate. A chip is secured to the compliant material, wherein the chip is secured to the compliant material above the riser. The chip is bonded to a target wafer while the chip is secured to the compliant material. The transfer substrate and compliant material are removed from the chip. The transfer substrate is opaque to UV light.

公开(公告)号：EP3286587A1

公开(公告)日：2018-02-28

申请号：EP16783759

申请日：2016-04-20

Applicant: SKORPIOS TECH INC

Inventor： LAMBERT DAMIEN

IPC: G02B6/14 ,  G02B6/122 ,  G02B6/136

CPC classification number: G02B6/125 ,  G02B6/132 ,  G02B6/136 ,  G02B2006/12061 ,  G02B2006/12097 ,  G02B2006/12104 ,  G02B2006/12147 ,  G02B2006/12169

Abstract: A method forms a vertical output coupler for a waveguide that propagates light along a horizontal propagation direction, through a waveguide material that overlies a buried oxide layer. The method includes etching the waveguide to remove a portion of the waveguide. The etching forms at least a first plane that is at an edge of the waveguide, is adjacent to the removed portion of the waveguide, and is tilted at a vertical angle between 20 degrees and 70 degrees with respect to the propagation direction. The method further includes coating the first tilted plane with a reflective metal to form a mirror, such that the mirror reflects the light into a direction having a vertical component.

公开(公告)号：EP3149522A4

公开(公告)日：2018-02-21

申请号：EP15800295

申请日：2015-05-27

Applicant: SKORPIOS TECH INC

Inventor： LAMBERT DAMIEN ,  KUMAR NIKHIL ,  MARCHENA ELTON ,  LIU DAMING ,  LI GUOLIANG ,  ZYSKIND JOHN

IPC: G02B6/12

CPC classification number: G02B6/14 ,  G02B6/1228 ,  G02B6/132 ,  G02B6/136 ,  G02B6/305 ,  G02B2006/12038 ,  G02B2006/12061 ,  G02B2006/12097 ,  G02B2006/12147 ,  G02B2006/12152

Abstract: A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder and a ridge. In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages having different widths at a given cross section.