公开(公告)号：EP2489106A4

公开(公告)日：2018-01-17

申请号：EP10823920

申请日：2010-10-12

Applicant: SKORPIOS TECH INC

Inventor： DALLESASSE JOHN M ,  KRASULICK STEPHEN B ,  KOZLOVSKY WILLIAM

IPC: H01S3/10 ,  H01S5/02 ,  H01S5/022 ,  H01S5/024 ,  H01S5/10 ,  H01S5/14

CPC classification number: H01S5/021 ,  H01S3/10053 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/02446 ,  H01S5/1003 ,  H01S5/1032 ,  H01S5/141 ,  H01S5/142 ,  H01S2301/14

Abstract: A tunable laser includes a substrate comprising a silicon material and a gain medium coupled to the substrate. The gain medium includes a compound semiconductor material. The tunable laser also includes a waveguide disposed in the substrate and optically coupled to the gain medium, a first wavelength selective element characterized by a first reflectance spectrum and disposed in the substrate, and a second wavelength selective element characterized by a second reflectance spectrum and disposed in the substrate. The tunable laser further includes an optical coupler disposed in the substrate and joining the first wavelength selective element, the second wavelength selective element, and the waveguide and an output mirror.

公开(公告)号：EP3055879A4

公开(公告)日：2017-08-09

申请号：EP14851684

申请日：2014-10-09

Applicant: SKORPIOS TECH INC

Inventor： KRASULICK STEPHEN B ,  DALLESASSE JOHN ,  MIZRAHI AMIT ,  CREAZZO TIMOTHY ,  MARCHENA ELTON ,  SPANN JOHN Y

IPC: H01L23/13 ,  G02B6/42 ,  H01L23/28 ,  H01S5/02 ,  H01S5/022 ,  H01S5/024 ,  H01S5/026

CPC classification number: H01L31/02327 ,  G02B6/423 ,  H01S5/0207 ,  H01S5/021 ,  H01S5/0217 ,  H01S5/0218 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02252 ,  H01S5/02268 ,  H01S5/02272 ,  H01S5/02469 ,  H01S5/026 ,  H01S5/3013 ,  H01S2301/176

Abstract: A method for fabricating a composite device comprises providing a platform, providing a chip, and bonding the chip to the platform. The platform has a base layer and a device layer above the base layer. An opening in the device layer exposes a portion of the base layer. The chip is bonded to the portion of the base layer exposed by the opening in the device layer. A portion of the chip extends above the platform and is removed.

Abstract translation: 用于制造复合器件的方法包括提供平台，提供芯片以及将芯片结合到平台。 该平台在基础层之上具有基础层和设备层。 器件层中的开口暴露基础层的一部分。 芯片粘合到由器件层中的开口暴露的基层的部分。 芯片的一部分在平台上方延伸并被移除。