公开(公告)号：EP3149522A4

公开(公告)日：2018-02-21

申请号：EP15800295

申请日：2015-05-27

Applicant: SKORPIOS TECH INC

Inventor： LAMBERT DAMIEN ,  KUMAR NIKHIL ,  MARCHENA ELTON ,  LIU DAMING ,  LI GUOLIANG ,  ZYSKIND JOHN

IPC: G02B6/12

CPC classification number: G02B6/14 ,  G02B6/1228 ,  G02B6/132 ,  G02B6/136 ,  G02B6/305 ,  G02B2006/12038 ,  G02B2006/12061 ,  G02B2006/12097 ,  G02B2006/12147 ,  G02B2006/12152

Abstract: A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder and a ridge. In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages having different widths at a given cross section.

公开(公告)号：EP3055879A4

公开(公告)日：2017-08-09

申请号：EP14851684

申请日：2014-10-09

Applicant: SKORPIOS TECH INC

Inventor： KRASULICK STEPHEN B ,  DALLESASSE JOHN ,  MIZRAHI AMIT ,  CREAZZO TIMOTHY ,  MARCHENA ELTON ,  SPANN JOHN Y

IPC: H01L23/13 ,  G02B6/42 ,  H01L23/28 ,  H01S5/02 ,  H01S5/022 ,  H01S5/024 ,  H01S5/026

CPC classification number: H01L31/02327 ,  G02B6/423 ,  H01S5/0207 ,  H01S5/021 ,  H01S5/0217 ,  H01S5/0218 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02252 ,  H01S5/02268 ,  H01S5/02272 ,  H01S5/02469 ,  H01S5/026 ,  H01S5/3013 ,  H01S2301/176

Abstract: A method for fabricating a composite device comprises providing a platform, providing a chip, and bonding the chip to the platform. The platform has a base layer and a device layer above the base layer. An opening in the device layer exposes a portion of the base layer. The chip is bonded to the portion of the base layer exposed by the opening in the device layer. A portion of the chip extends above the platform and is removed.

Abstract translation: 用于制造复合器件的方法包括提供平台，提供芯片以及将芯片结合到平台。 该平台在基础层之上具有基础层和设备层。 器件层中的开口暴露基础层的一部分。 芯片粘合到由器件层中的开口暴露的基层的部分。 芯片的一部分在平台上方延伸并被移除。