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公开(公告)号：SG11201602314WA
公开(公告)日：2016-04-28
申请号：SG11201602314W
申请日：2014-10-09
Applicant: SKORPIOS TECHNOLOGIES INC
Inventor： KRASULICK STEPHEN B , DALLESASSE JOHN , MIZRAHI AMIT , CREAZZO TIMOTHY , MARCHENA ELTON , SPANN JOHN Y
Abstract: A method for fabricating a photonic composite device for splitting functionality across materials comprises providing a composite device having a platform and a chip bonded in the platform. The chip is processed comprising patterning, etching, deposition, and/or other processing steps while the chip is bonded to the platform. The chip is used as a gain medium and the platform is at least partially made of silicon.
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