公开(公告)号：SG10201509551PA

公开(公告)日：2015-12-30

申请号：SG10201509551P

申请日：2013-01-18

Applicant: SKORPIOS TECHNOLOGIES INC

Inventor： DALLESASSE JOHN ,  KRASULICK STEPHEN B ,  CREAZZO TIMOTHY ,  MARCHENA ELTON

Abstract: A method of fabricating a composite semiconductor structure includes providing an SOI substrate including a plurality of silicon-based devices, providing a compound semiconductor substrate including a plurality of photonic devices, and dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method also includes providing an assembly substrate having a base layer and a device layer including a plurality of CMOS devices, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, and aligning the SOI substrate and the assembly substrate. The method further includes joining the SOI substrate and the assembly substrate to form a composite substrate structure and removing at least the base layer of the assembly substrate from the composite substrate structure.

公开(公告)号：SG11201403688RA

公开(公告)日：2014-10-30

申请号：SG11201403688R

申请日：2013-01-18

Applicant: SKORPIOS TECHNOLOGIES INC

Inventor： DALLESASSE JOHN ,  KRASULICK STEPHEN B ,  CREAZZO TIMOTHY ,  MARCHENA ELTON ,  DALLESASSE JOHN ,  KRASULICK STEPHEN B ,  CREAZZO TIMOTHY ,  MARCHENA ELTON

IPC: H01L21/762 ,  H01L27/12 ,  H01L27/146

Abstract: A method of fabricating a composite semiconductor structure includes providing an SOI substrate including a plurality of silicon-based devices, providing a compound semiconductor substrate including a plurality of photonic devices, and dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method also includes providing an assembly substrate having a base layer and a device layer including a plurality of CMOS devices, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, and aligning the SOI substrate and the assembly substrate. The method further includes joining the SOI substrate and the assembly substrate to form a composite substrate structure and removing at least the base layer of the assembly substrate from the composite substrate structure.

公开(公告)号：SG11201602314WA

公开(公告)日：2016-04-28

申请号：SG11201602314W

申请日：2014-10-09

Applicant: SKORPIOS TECHNOLOGIES INC

Inventor： KRASULICK STEPHEN B ,  DALLESASSE JOHN ,  MIZRAHI AMIT ,  CREAZZO TIMOTHY ,  MARCHENA ELTON ,  SPANN JOHN Y

IPC: H01L23/13 ,  H01L23/28

Abstract: A method for fabricating a photonic composite device for splitting functionality across materials comprises providing a composite device having a platform and a chip bonded in the platform. The chip is processed comprising patterning, etching, deposition, and/or other processing steps while the chip is bonded to the platform. The chip is used as a gain medium and the platform is at least partially made of silicon.

公开(公告)号：TWI569548B

公开(公告)日：2017-02-01

申请号：TW099134939

申请日：2010-10-13

Applicant: 思科皮爾斯科技公司 ,  SKORPIOS TECHNOLOGIES, INC.

Inventor： 戴利薩希約翰M ,  DALLESASSE, JOHN M. ,  克拉蘇力克史蒂芬B ,  KRASULICK, STEPHEN B. ,  克勞夫斯基威廉 ,  KOZLOVSKY, WILLIAM

IPC: H01S5/14 ,  H01S5/02

CPC classification number: H01S5/021 ,  H01S3/10053 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/02446 ,  H01S5/1003 ,  H01S5/1032 ,  H01S5/141 ,  H01S5/142 ,  H01S2301/14

公开(公告)号：TW201640165A

公开(公告)日：2016-11-16

申请号：TW105108695

申请日：2016-03-21

Applicant: 思科皮爾斯科技公司 ,  SKORPIOS TECHNOLOGIES, INC.

Inventor： 劉大明 ,  LIU DA MING ,  朱斯坎約翰 ,  ZYSKIND, JOHN

IPC: G02B6/24 ,  G02B6/12

CPC classification number: G02B6/4243 ,  G02B6/30 ,  G02B6/3636 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/4202 ,  G02B6/4214 ,  G02B6/4225 ,  G02B6/4226 ,  G02B6/4239

Abstract: v型槽組件用以將透鏡狀光纖(舉例而言，由二氧化矽所製成的光纖)與光子晶片中的波導邊緣耦接。v型槽組件是由熔融二氧化矽所製成。使用熔融二氧化矽，使得在將透鏡狀光纖接合至v型槽組件及/或將v型槽組件接合至光子晶片中所使用的黏合劑(舉例而言，環氧樹脂)可藉由光被固化，至少部分地被固化。

Abstract in simplified Chinese: v型槽组件用以将透镜状光纤(举例而言，由二氧化硅所制成的光纤)与光子芯片中的波导边缘耦接。v型槽组件是由熔融二氧化硅所制成。使用熔融二氧化硅，使得在将透镜状光纤接合至v型槽组件及/或将v型槽组件接合至光子芯片中所使用的黏合剂(举例而言，环氧树脂)可借由光被固化，至少部分地被固化。

公开(公告)号：TWI671562B

公开(公告)日：2019-09-11

申请号：TW105108695

申请日：2016-03-21

Applicant: 美商思科皮爾斯科技公司 ,  SKORPIOS TECHNOLOGIES, INC.

Inventor： 劉大明 ,  LIU DA MING ,  朱斯坎約翰 ,  ZYSKIND, JOHN

IPC: G02B6/24 ,  G02B6/12

公开(公告)号：TW201707319A

公开(公告)日：2017-02-16

申请号：TW105134037

申请日：2010-10-13

Applicant: 思科皮爾斯科技公司 ,  SKORPIOS TECHNOLOGIES, INC.

Inventor： 戴利薩希約翰M ,  DALLESASSE,JOHN M. ,  克拉蘇力克史蒂芬B ,  KRASULICK,STEPHEN B. ,  克勞夫斯基威廉 ,  KOZLOVSKY,WILLIAM

IPC: H01S5/14 ,  H01S5/02

CPC classification number: H01S5/021 ,  H01S3/10053 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/02446 ,  H01S5/1003 ,  H01S5/1032 ,  H01S5/141 ,  H01S5/142 ,  H01S2301/14

Abstract: 本案係一可調式雷射包含一基材，係包含一矽材料，及耦接至基材的一增益介質。增益介質包含一化合物半導體材料。可調式雷射亦包含設於基材內並光學耦接至增益介質的一波導，一第一波長選擇元件其特徵為一第一反射光譜且設於基材內，以及一第二波長選擇元件其特徵為一第二反射光譜且設於基材內。可調式雷射進一步包含設於基材內且結合第一波長選擇元件的一光耦合器、第二波長選擇元件、以及波導與一輸出反射鏡。

Abstract in simplified Chinese: 本案系一可调式激光包含一基材，系包含一硅材料，及耦接至基材的一增益介质。增益介质包含一化合物半导体材料。可调式激光亦包含设于基材内并光学耦接至增益介质的一波导，一第一波长选择组件其特征为一第一反射光谱且设于基材内，以及一第二波长选择组件其特征为一第二反射光谱且设于基材内。可调式激光进一步包含设于基材内且结合第一波长选择组件的一光耦合器、第二波长选择组件、以及波导与一输出反射镜。

公开(公告)号：WO2018017943A1

公开(公告)日：2018-01-25

申请号：PCT/US2017/043265

申请日：2017-07-21

Applicant: SKORPIOS TECHNOLOGIES, INC.

Inventor： BONTHRON, Andrew ,  NGUYEN, Phuoc ,  NOVOZHILOV, Viktor ,  NILSSON, Michael ,  KUO, Wei-Min

IPC: H04L25/49

Abstract: A PAM (Pulse Amplitude Modulation) modulator driver is configured to receive a PAM input signal having N input amplitude levels and provide a PAM output signal having N output amplitude levels, where N is an integer. The PAM modulator driver circuit configured to electrically adjust amplitude levels in the PAM output signal.

Abstract translation: PAM（脉冲幅度调制）调制器驱动器被配置为接收具有N个输入幅度电平的PAM输入信号并提供具有N个输出幅度电平的PAM输出信号，其中N是整数。 PAM调制器驱动器电路被配置为电调节PAM输出信号中的幅度水平。

公开(公告)号：WO2015134968A1

公开(公告)日：2015-09-11

申请号：PCT/US2015/019430

申请日：2015-03-09

Applicant: SKORPIOS TECHNOLOGIES, INC.

Inventor： KUMAR, Nikhil ,  LI, Guoliang

IPC: G02B5/20 ,  G02B6/12

CPC classification number: G02B6/122 ,  G02B5/20 ,  G02B6/14 ,  G02B2006/12109 ,  G02F1/3501 ,  G02F1/365 ,  G02F2001/3509

Abstract: A high-order-mode (HOM) filter for thick silicon waveguides has a shoulder slab, a waveguide ridge, a first filter ridge, and a second filter ridge. The first filter ridge and the second filter ridge help attenuate higher-order modes from the waveguide ridge while the waveguide ridge guides a fundamental mode.

Abstract translation: 用于厚硅波导的高阶模（HOM）滤波器具有肩板，波导脊，第一滤光片和第二滤光片。 第一滤波器脊和第二滤波器脊有助于衰减来自波导脊的高阶模，而波导脊引导基模。

公开(公告)号：WO2013036955A1

公开(公告)日：2013-03-14

申请号：PCT/US2012/054505

申请日：2012-09-10

Applicant: SKORPIOS TECHNOLOGIES, INC. ,  VAN ORDEN, Derek ,  MIZRAHI, Amit ,  CREAZZO, Timothy ,  KRASULICK, Stephen, B.

Inventor： VAN ORDEN, Derek ,  MIZRAHI, Amit ,  CREAZZO, Timothy ,  KRASULICK, Stephen, B.

IPC: G02B6/26

CPC classification number: G02B6/125 ,  G02B6/12007 ,  G02B6/26 ,  G02B6/29337 ,  G02B6/29359 ,  G02B2006/12104 ,  G02B2006/1215 ,  G02F1/011 ,  G02F1/0147 ,  G02F1/225 ,  G02F2001/213 ,  H01S3/0637 ,  H01S3/08027 ,  H01S5/4068

Abstract: A reflective structure includes an input/output port and an optical splitter coupled to the input/output port. The optical splitter has a first branch and a second branch. The reflective structure also includes a first resonant cavity optically coupled to the first branch of the optical splitter. The first resonant cavity comprises a first set of reflectors and a first waveguide region disposed between the first set of reflectors. The reflective structures further includes a second resonant cavity optically coupled to the second branch of the optical splitter. The second resonant cavity comprises a second set of reflectors and a second waveguide region disposed between the second set of reflectors.

Abstract translation: 反射结构包括输入/​​输出端口和耦合到输入/输出端口的光分路器。 光分路器具有第一分支和第二分支。 反射结构还包括光学耦合到光分路器的第一分支的第一谐振腔。 第一谐振腔包括第一组反射器和设置在第一组反射器之间的第一波导区域。 反射结构还包括光耦合到光分路器的第二分支的第二谐振腔。 第二谐振腔包括第二组反射器和设置在第二组反射器之间的第二波导区域。