Abstract:
It is intended to provide a ferroelectric that exhibits superior ferroelectricity. A ferroelectric provided is an oxide having a layered crystal structure that is composed of Bi, a first element Me, a second element R, and O. The first element Me is at least one element selected from the group consisting of Na, K, Ca, Ba, Sr, Pb, and Bi. The second element R is at least one element selected from the group consisting of Fe, Ti, Nb, Ta, and W. Ninety-eight percent or more of the entire body of the ferroelectric exhibits ferroelectricity. After an oxide having a layered crystal structure has been grown by a vapor-phase method (crystal growth step), electrodes are attached to the oxide having a layered crystal structure and a voltage is applied thereto (voltage application step). As a result, strains of crystal lattices are corrected at least partially, whereby portions that did not exhibit ferroelectricity at all or did not exhibit superior ferroelectricity due to such large strains that the symmetry of crystal lattices is lost are changed so as to exhibit superior ferroelectricity.
Abstract:
It is intended to provide a ferroelectric that exhibits superior ferroelectricity. A ferroelectric provided is an oxide having a layered crystal structure that is composed of Bi, a first element Me, a second element R, and O. The first element Me is at least one element selected from the group consisting of Na, K, Ca, Ba, Sr, Pb, and Bi. The second element R is at least one element selected from the group consisting of Fe, Ti, Nb, Ta, and W. Ninety-eight percent or more of the entire body of the ferroelectric exhibits ferroelectricity. After an oxide having a layered crystal structure has been grown by a vapor-phase method (crystal growth step), electrodes are attached to the oxide having a layered crystal structure and a voltage is applied thereto (voltage application step). As a result, strains of crystal lattices are corrected at least partially, whereby portions that did not exhibit ferroelectricity at all or did not exhibit superior ferroelectricity due to such large strains that the symmetry of crystal lattices is lost are changed so as to exhibit superior ferroelectricity.
Abstract:
The formation of an electrically conductive phase in an dielectric or ferroelectric composed of a bismuth compound is inhibited. Described is a process for producing a bismuth compound, which comprises introducing a gas of starting materials in an atmosphere under a pressure of 0.01 to 50 torr, depositing a precursor of a bismuth compound on a substrate, and thermally treating it in an oxidizing atmosphere.
Abstract:
The formation of an electrically conductive phase in an dielectric or ferroelectric composed of a bismuth compound is inhibited. Described is a process for producing a bismuth compound, which comprises introducing a gas of starting materials in an atmosphere under a pressure of 0.01 to 50 torr, depositing a precursor of a bismuth compound on a substrate, and thermally treating it in an oxidizing atmosphere.
Abstract:
PROBLEM TO BE SOLVED: To provide a light-emitting diode which emits light efficiently and which can be manufactured at low costs by a single epitaxial growth, and to provide a manufacturing method of the same. SOLUTION: A substrate 11 having a plurality of protrusions 12 is formed on one main surface of the substrate 11 such as a sapphire substrate wherein the protrusion 12 is made of a material different in type from that of the substrate, an SiO 2 film e.g., and a first nitride-based group III-V compound semiconductor layer 15 is grown on each recess 13 between the protrusions 12 until making a triangle in section wherein a bottom surface of the recess becomes a base of the triangle. Thereafter, a second nitride-based group III-V compound semiconductor layer 15 is laterally grown on the substrate from the first nitride-based group III-V compound semiconductor layer 15. The protrusions 12 are triangular or trapezoidal e.g. in section. On the second nitride-based group III-V compound semiconductor layer 15, a third nitride-based group III-V compound semiconductor layer 15 including an active layer and a nitride-based group III-V compound semiconductor layer 15 are formed. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing light emitting element by which the yield of a light emitting element can be improved by reducing the influence of the warping of a substrate caused by epitaxial growth. SOLUTION: The method of manufacturing the light emitting element includes an epitaxial growth step of adhering a film to the surface of the substrate through epitaxial growth, a flattening step of flattening the rear surface of the substrate by grinding after the epitaxial growth step, and a substrate treating step of performing prescribed treatment to the surface of the substrate after the flattening step. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a nitride semiconductor element by which a low-resistance p-type nitride semiconductor layer can be obtained without diffusing a p-type dopant and thereby such a nitride semiconductor element can be fabricated that has good characteristics with a very precisely controlled dopant concentration profile in the depthwise direction. SOLUTION: All of a p-type cap layer 6, a p-type clad layer 7, a p - -type contact layer 8, and a p + -type contact layer 9 which consist of a crystalline nitride semiconductor, already contain a p-type dopant, and are formed in this order. By irradiating laser light (ν) on these p-type nitride semiconductor layers 6-9, the p-type dopants contained therein are activated. The laser light (ν) has a photon energy higher than a binding energy between the p-type dopants contained in the nitride semiconductor layers 6-9 and hydrogen. It is preferred that the laser light (ν) is irradiated at a pulse width of 1 μsec or less. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To realize an epitaxial rare earth oxide (110)/silicon (001) structure by well epitaxially growing a rare earth oxide such as cerium oxide of the (110) face orientation on a silicon substrate of the (001) face orientation at a lower growth temperature than that of a conventional method. SOLUTION: The surface of an Si substrate 1 of the (001) face orientation is converted into a dimer structure by surface reconstruction of 2×1 and 1×2 and a raw material comprising at least one or more kinds of rare earth elements is used in an atmosphere containing an oxidizing gas to epitaxially grow a cubic or a tetragonal rare earth oxide, e.g. a CeO2 membrane 2 of the (110) face orientation. At the time of the growth, the feed of the oxidizing gas to the surface of the Si substrate 1 is started and the feed of the raw material comprising at least the one or more kinds of the rate earth elements is then carried out.
Abstract:
PROBLEM TO BE SOLVED: To obtain a dielectric capacitor of good characteristics even when an area of a dielectric capacitor is reduced when manufacturing a dielectric capacitor, wherein the dielectric film of a perovskite type crystal structure is used or a semiconductor memory with such a dielectric capacitor. SOLUTION: When a dielectric capacitor wherein an SBT film is used as a dielectric film is manufactured, an IrO2 film 2 and an Ir film 3 as a lower electrode, an amorphous film 4 as the precursor film of an SBT film, and a Pt film 5 as an upper electrode are formed on an Si substrate 1 one by one. After the Pt film 5, the amorphous film 4, the Ir film 3 and the IrO2 film 2 are subjected to patterning into a shape of a dielectric capacitor and the amorphous film 4 is subjected to heat treatment. Thereby, an SBT film 6 is obtained by making phase change for an amorphous phase in the amorphous film 4 into a crystal phase of a perovskite type crystal structure.
Abstract:
PURPOSE:To obtain an oxide material having largely varying electrical resistance at low temperature according to the applied voltage by using Sr, Ca, Ba, Cu and O as essential components of the oxide. CONSTITUTION:SrCO3, CuO and, as necessary. CaO and BaCO3 are mixed in a ball mill, calcined at about 900 deg.C in an oxidizing atmosphere, crushed, formed and calcined at about 980 deg.C for about 15hr in an oxidizing atmosphere to obtain an oxide material of formula (0