公开(公告)号：EP2327997A4

公开(公告)日：2014-02-12

申请号：EP09816076

申请日：2009-09-15

Applicant: SONY CORP

Inventor： KAWAMURA HIROFUMI ,  OKADA YASUHIRO

IPC: G01S7/285 ,  G01S13/93 ,  H01P3/16 ,  H01Q9/04

CPC classification number: H01P3/16 ,  G01S7/032 ,  G01S2013/9371 ,  H01P5/02 ,  H01Q9/0407 ,  H01Q9/045 ,  H04B1/3822 ,  H04B10/00 ,  H04B10/501 ,  H04B10/5161 ,  H04B10/556 ,  Y10T29/49016

公开(公告)号：BR112012002717A2

公开(公告)日：2016-05-03

申请号：BR112012002717

申请日：2010-08-09

Applicant: SONY CORP

Inventor： KAWAMURA HIROFUMI ,  NAKAMURA NAOTO ,  MIHOTA NORIHITO ,  OKADA YASUHIRO ,  AKIYAMA YOSHIYUKI

IPC: H04B1/40 ,  H04B5/02

公开(公告)号：EP2375444A4

公开(公告)日：2013-10-02

申请号：EP09837549

申请日：2009-12-08

Applicant: SONY CORP

Inventor： KAWAMURA HIROFUMI ,  OKADA YASUHIRO

IPC: H01L23/12 ,  H01L23/48 ,  H01L23/66 ,  H01L25/065 ,  H01L25/10 ,  H01P3/12

CPC classification number: H01Q21/00 ,  H01L23/48 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01042 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1903 ,  H01L2924/19104 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01P3/121 ,  H01P3/122 ,  H01Q9/0407 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: Provided is an in-millimeter-wave dielectric transmission device. The in-millimeter-wave dielectric transmission device includes a semiconductor chip provided on one interposer substrate and capable of in-millimeter-wave dielectric transmission, an antenna structure connected to the semiconductor chip, two semiconductor packages including a molded resin configured to cover the semiconductor chip and the antenna structure, and a dielectric transmission path provided between the two semiconductor packages to transmit a millimeter wave signal. The semiconductor packages are mounted such that the antenna structures thereof are arranged with the dielectric transmission path interposed therebetween.

Abstract translation: 本发明提供一种在毫米波介电体内传输装置。 中毫米波介电体内传输装置包括：设置在一个内插基板和能够在毫米波介电体内传输到连接到半导体芯片天线结构的半导体芯片，两个半导体封装包括被构造为覆盖所述半导体的模制树脂 芯片和天线结构，并且两个半导体封装之间的电介质传输路径来传输毫米波信号。 安装检查的半导体封装并的天线结构及其与之间插入有介电体传输路径布置。

公开(公告)号：EP2330683A4

公开(公告)日：2012-09-05

申请号：EP09816075

申请日：2009-09-15

Applicant: SONY CORP

Inventor： KAWAMURA HIROFUMI ,  OKADA YASUHIRO

IPC: H01P5/107 ,  H01P1/04 ,  H01P5/02 ,  H04B3/52 ,  H05K1/14

CPC classification number: H01P5/107 ,  H01P1/047 ,  H01P5/028 ,  H04B3/52 ,  H05K1/0237 ,  H05K1/144 ,  H05K2201/037 ,  H05K2201/042 ,  H05K2201/10303 ,  Y10T29/49016

公开(公告)号：BRPI0918164A2

公开(公告)日：2015-12-01

申请号：BRPI0918164

申请日：2009-09-15

Applicant: SONY CORP E SONY ELECTRONICS INC

Inventor： KAWAMURA HIROFUMI ,  OKADA YASUHIRO

IPC: H01P3/16 ,  H01P5/08 ,  H01P5/107 ,  H04B3/52

公开(公告)号：SG66308A1

公开(公告)日：1999-07-20

申请号：SG1996009721

申请日：1996-05-04

Applicant: SONY CORP

Inventor： OKADA YASUHIRO ,  FUKUZAWA KEIJI

IPC: H01Q19/09 ,  H01Q1/40 ,  H01Q1/42 ,  H01Q13/02

Abstract: A feedome is disposed on the side of an opening of a radiator main body, and comprises a dielectric board having a thickness sufficiently smaller than the wavelength of radio wave, and a dielectric protrusion fixedly mounted to the dielectric board substantially in the center of the inner side thereof, and having a height approximately equal to integral number times (+E,fra 1/2+EE )x lambda where the wavelength of radio wave is lambda , and a diameter approximately equal to the height of the dielectric protrusion.

公开(公告)号：BRPI0918163A2

公开(公告)日：2015-12-01

申请号：BRPI0918163

申请日：2009-09-15

Applicant: SONY CORP

Inventor： KAWAMURA HIROFUMI ,  OKADA YASUHIRO

IPC: G01S13/93 ,  G01S7/285 ,  H01P3/16

公开(公告)号：BRPI0923803A2

公开(公告)日：2015-07-21

申请号：BRPI0923803

申请日：2009-12-08

Applicant: SONY CORP

Inventor： KAWAMURA HIROFUMI ,  OKADA YASUHIRO

IPC: H01L23/12 ,  H01L25/11

公开(公告)号：BRPI1003155A2

公开(公告)日：2012-04-10

申请号：BRPI1003155

申请日：2010-08-06

Applicant: SONY CORP

Inventor： MIHOTA NORIHITO ,  KAWAMURA HIROFUMI ,  OKADA YASUHIRO

IPC: H04B1/38 ,  H04B1/40 ,  H04B5/02 ,  H04B7/26

Abstract: Disclosed herein is a wireless transmission system, including: a plurality of systems of millimeter wave signal transmission lines capable of individually transmitting information in a millimeter waveband independently of each other; a sending section disposed on one end side of each of the plural systems of millimeter wave signal transmission lines; and a reception section disposed on the other end side of each of the plural systems of millimeter wave signal transmission lines. The sending section is adapted to convert a signal of an object of transmission into a millimeter wave signal and supply the millimeter wave signal to the millimeter signal transmission line. The reception section is adapted to receive the millimeter wave signal transmitted thereto through the millimeter wave signal transmission line and convert the received millimeter wave signal into the signal of the object of transmission.

公开(公告)号：JP2011041078A

公开(公告)日：2011-02-24

申请号：JP2009187711

申请日：2009-08-13

Applicant: Sony Corp ,  ソニー株式会社

Inventor： MIHOTA NORIHITO ,  KAWAMURA TAKUSHI ,  OKADA YASUHIRO

IPC: H04B5/02 ,  H04B1/40

CPC classification number: H04B3/52 ,  H01L23/48 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/105 ,  H01L27/0248 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2225/1023 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/3011 ,  H04L12/40013 ,  H05K1/0239 ,  H05K1/144 ,  H05K2201/09618 ,  H01L2224/45099 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To simultaneously transmit a plurality of signals at a high speed, and with large capacity by wireless among signal transmission devices and inside a device. SOLUTION: A first communication device 100A converts a base band signal into millimeter waves by a signal generating unit 107 and couples the millimeter waves to a millimeter-wave signal transmission line 9 by a transmission line coupling part 108. A second communication device 200A receives the millimeter-waves transmitted via the millimeter-wave signal transmission line 9 by a transmission line coupling part 208, coupled to the millimeter wave signal transmission line 9, and returns the millimeter waves to the base band signal by a signal generation part 207. The millimeter-wave signal transmission line 9 prepares a plurality of systems. When the millimeter-wave signal transmission line 9 has N systems to N types of base band signals, what is required is merely to apply time division multiplex and frequency division multiplex, regarding transmission/reception for performing bidirectional transmission/reception. When there are N types of signals for communication in a millimeter-wave band, they can also be transmitted by each millimeter-wave signal transmission line 9 of 2N systems, even if multiplexing, such as the time division multiplex, frequency division multiplex and code division multiplexing is not performed. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：在信号传输设备之间和设备内部以高速，大容量的无线同时发送多个信号。 解决方案：第一通信设备100A通过信号产生单元107将基带信号转换成毫米波，并通过传输线耦合部分108将毫米波耦合到毫米波信号传输线9.第二通信设备 200A通过耦合到毫米波信号传输线9的传输线耦合部分208接收经由毫米波信号传输线路9传输的毫米波，并且通过信号产生部分207将毫米波返回到基带信号 毫米波信号传输线9准备多个系统。 当毫米波信号传输线9具有N个系统到N种类型的基带信号时，仅需要对于执行双向发送/接收的发送/接收来应用时分复用和频分复用。 当在毫米波段中存在N种用于通信的信号时，也可以由2N系统的每毫米波信号传输线9发送，即使多路复用，如时分复用，频分复用和码 不进行分割复用。 版权所有（C）2011，JPO＆INPIT