MANUFACTURING METHOD FOR THIN-FILM TRANSISTOR

    公开(公告)号:JP2001196593A

    公开(公告)日:2001-07-19

    申请号:JP2000005996

    申请日:2000-01-07

    Applicant: SONY CORP

    Abstract: PROBLEM TO BE SOLVED: To evaluate the state of a polysilicon film which is formed by excimer laser annealing an amorphous silicon film. SOLUTION: Related to the manufacturing process for an bottom-gate TFT, a polysilicon film is formed, and then its quality is decided. At formation of the polysilicon film by annealing an amorphous silicon film, linearity and periodicity appear in the spatial structure in the film surface of formed polysilicon film, according to the energy giving to the amorphous silicon at annealing. After the linearity and periodicity are image-processed, the linearity and periodicity of the image are made into numerical values utilizing an auto-correlating function. Then, the auto-correlating value of the surface image of polysilicon film in an S/D region as well as that on a gate electrode are acquired, and both numerical results is utilized to decide the quality of the polysilicon film.

    WORK POSITIONING DEVICE AND WORK POSITIONING METHOD

    公开(公告)号:JP2000176791A

    公开(公告)日:2000-06-27

    申请号:JP35180798

    申请日:1998-12-10

    Applicant: SONY CORP

    Inventor: OOSHIMA AKIFUMI

    Abstract: PROBLEM TO BE SOLVED: To perform work positioning high in accuracy without damaging a work, and easily cope with the change of a work radius. SOLUTION: A work is held at a work holding stage 20, the work holding stage 20 is rotated by a specified angle work holding stage rotation motor 30. The distance from a specified position to the end of the work is measured by an optical length measurement sensor 70. The distance is repeatedly measured with an angle altered, based on the results obtained, slippage representing the quantity of eccentricity and the direction of eccentricity, between the center of the work and the specified position where the work is supposed to be, is thereby computed. A direct moving stage 40 is thereby moved by a direct moving stage driving motor 50 in response to the quantity computed of eccentricity, and the work holding stage 20 is rotated using the work holding stage rotation motor 30 while being adapted to the direction of eccentricity, so that the center position of the work is thereby straightened.

    INSPECTING METHOD FOR TRANSPARENT RESIN

    公开(公告)号:JPH05223745A

    公开(公告)日:1993-08-31

    申请号:JP5937192

    申请日:1992-02-12

    Applicant: SONY CORP

    Inventor: OOSHIMA AKIFUMI

    Abstract: PURPOSE:To obtain a transparent resin inspecting method which can inspect a transparent resin highly accurately even if it is coating a transparent substrate. CONSTITUTION:Light is emitted from a ring-shaped light source 3 which is provided so that it encircles a skew upper part of a transparent resin 2 toward the side of a transparent substrate and a reflected light at the periphery part of the transparent resin 2 is highlighted. Then, the reflected light from the transparent resin 2 and that from the transparent substrate 1 are read by an optical reader 4 and then an image 51 which is read by the optical reader 4 is processed, thus enabling the reflected light at the periphery part of the transparent resin 2 to be extracted.

    Apparatus and method for laser beam machining
    8.
    发明专利
    Apparatus and method for laser beam machining 审中-公开
    激光束加工的装置和方法

    公开(公告)号:JP2006315031A

    公开(公告)日:2006-11-24

    申请号:JP2005139987

    申请日:2005-05-12

    Abstract: PROBLEM TO BE SOLVED: To provide an apparatus and a method for laser beam machining, by which apparatus and method, a dividing operation can be performed by exactly setting a dividing position without leaving machined traces on the surface of a workpiece and without causing fusion on the surface of the workpiece and cracks deviated from a planned cut-off line. SOLUTION: The apparatus and the method for laser beam machining are configured such that a reformed portion 18 to be divided is formed inside the vicinity of the surface of the workpiece 12 on the side irradiated by a laser beam L1 by performing a power adjustment of the laser beam L radiated from a laser beam source 1 and by radiating the pulse laser beam L1 via a condenser lens 8 for converging the pulse laser beam L1 along a planned dividing portion 17 on the workpiece 12, which is fixed to workpiece fixing means 13, 14, 15, 16 and transmits the laser beam L1. The workpiece fixing means 14 is provided with a distance measuring device 11 for measuring the distance between the condenser lens 8 and the workpiece 12. The posture of the workpiece 12 is measured by means of the distance measuring device. The reformed portion is formed by making the light converged point of the condenser lens 8 coincide with a required position based on the measured information. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题:为了提供一种用于激光束加工的装置和方法,通过该装置和方法,可以通过精确地设定分割位置来进行分割操作,而不会在工件的表面上没有加工的迹线而没有 导致工件表面的熔融和偏离计划的切断线的裂纹。 解决方案:激光束加工的装置和方法被构造成使得被分割的重整部分18形成在工件12的由激光束L1照射的一侧的表面附近,通过执行功率 调整从激光束源1照射的激光束L,并且通过聚光透镜8照射脉冲激光束L1,以使脉冲激光束L1沿着工件12上的计划分割部17会聚,固定到工件固定 装置13,14,15,16,并透射激光束L1。 工件固定装置14设置有用于测量聚光透镜8与工件12之间的距离的距离测量装置11.工件12的姿势通过距离测量装置测量。 通过使聚光透镜8的聚光点基于所测量的信息与所需位置一致而形成重整部分。 版权所有(C)2007,JPO&INPIT

    Appearance inspection device
    9.
    发明专利
    Appearance inspection device 审中-公开
    外观检查设备

    公开(公告)号:JP2003036118A

    公开(公告)日:2003-02-07

    申请号:JP2001225001

    申请日:2001-07-25

    Inventor: OOSHIMA AKIFUMI

    Abstract: PROBLEM TO BE SOLVED: To provide an appearance inspection device which can perform focusing operation fast and shorten a tact time for capturing the enlarged image of a substrate to be inspected. SOLUTION: The device is equipped with an optical unit 30 equipped with an objective 43 for observing the object to be inspected with specific magnification and a stage 20 for inspection which supports the object to be inspected and can control the position of the object to be inspected about the objective 43 with a specific movement quantity, and the optical unit 30 has a piezoelectric element 46 which can control the position of the objective 43 about the object to be inspected with a movement quantity smaller than the movement quantity by a Z stage 23 of the stage 20 for inspection.

    Abstract translation: 要解决的问题:提供一种能够快速进行聚焦操作的外观检查装置,并缩短拍摄待检查基板的放大图像的拍照时间。 解决方案:设备装备有一个光学单元30,该光学单元配备有用于以特定放大率观察被检查物体的物镜43和用于检查的阶段20,该阶段支持被检查物体并且可以控制被检查物体的位置 关于物镜43具有特定的移动量,并且光学单元30具有压电元件46,该压电元件46可以通过Z阶段23的移动量来控制物体43围绕待检查对象的位置的移动量 第20阶段进行检查。

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