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公开(公告)号：JPH09124092A
公开(公告)日：1997-05-13
申请号：JP30837595
申请日：1995-10-31
Inventor： SAKURAI TERUYASU
Abstract: PROBLEM TO BE SOLVED: To enable preventing solder bumps, which are formed on the bottom of a package of an electronic component, from being damaged or stained. SOLUTION: An electronic component carrier 1 consists of a sheet or film in the form of a tape in which a plurality of holding vessels 3 for electronic components are formed at prescribed intervals. On the bottom surface of the holding vessel 3, which bottom surface when an electronic component is deposited faces the bottom of the electronic component, protruding ribs are formed at a height greater than the vertical distance between the bottom surface of the electronic component and the vertices of the terminals consisting of solder bumps; the ribs are so positioned as to intervene between the terminals. By supporting the bottom of the electronic component on the protruding ribs the terminals are kept from direct contact with the bottom of the holding vessel.
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公开(公告)号：JP2580716B2
公开(公告)日：1997-02-12
申请号：JP14085788
申请日：1988-06-08
Applicant: SONY CORP
Inventor： NAGASHIMA SHINICHI , SAKURAI TERUYASU
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公开(公告)号：JPH0669684A
公开(公告)日：1994-03-11
申请号：JP24013492
申请日：1992-08-18
Applicant: SONY CORP
Inventor： SAKURAI TERUYASU
Abstract: PURPOSE:To improve the yield of the production of a printed board by providing an electronic part feeder with a positioning mechanism. CONSTITUTION:A reference pin 4 and a follower pin 76 are provided at the base 4 of an electronic part feeder 2, and out of the positioning pins made on the topside of a shifting table, the reference pin 75 and the follower pin 76 are fit in a reference hole and a slot 75 in a pair so as to mount them, and then the follower pin 76 is rotated, whereupon the base 4 of the electronic part feeder 2 rotates right and left centering on the reference pin 75 fit in the reference hole. So, if the follower pin 76 is fixed in the optional position, the center of a chip-type electronic part 8 fronting from a part takeout window 72 is positioned right below a suction chuck 71. Moreover, the center of the chip-type electronic part 8 is positioned right below the suction chuck 71 simply and easily by providing a tape guide 72 and a guide member 73 so that they may not deviate in width direction at the right and left of an exfoliating means for exfoliating the top tape 54 from the carrier tape 53 of an accommodation tape 9.
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公开(公告)号：JPH0313393A
公开(公告)日：1991-01-22
申请号：JP14861189
申请日：1989-06-12
Applicant: SONY CORP
Inventor： TAKAYAMA KINJIRO , SUWA HISASHI , TANIGUCHI YOSHIKUNI , MISHIMA AKIO , SAKURAI TERUYASU
Abstract: PURPOSE:To print cream solder on a printed circuit board so that the peripheral surface thereof becomes vertical and to smooth the running to a squeeze surface by providing recessed parts to the squeeze of a screen substrate on both sides thereof to form thin wall parts thereunder and forming the step surface of the inner periphery of each recessed part into an inclined surface. CONSTITUTION:The inner peripheral step surface 9 of a recessed part 4 is formed into a inverted cone-shaped inclined surface reduced in its diameter as approaching the squeeze surface of a thin wall part 5 from the squeeze surface of a non-thin wall part 6 and the edge part 10 of this inverted cone- shaped step surface 9 on the upper opening end thereof is formed into a curved surface. The inner peripheral surfaces of cream solder filling holes 7, 8 are made vertical to a screen substrate and the edge parts 11 of the opening ends of the cream solder filling holes 7, 8 on the squeeze surface side thereof are also formed into curved surfaces. The recessed part 4, the step surface 9, the edge part 10 and the edge parts 11 are formed by powder beam etching.
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Patent Agency Ranking
公开(公告)号：JPH07297516A
公开(公告)日：1995-11-10
申请号：JP11398994
申请日：1994-04-27
Applicant: SONY CORP
Inventor： SAKURAI TERUYASU , YAMANOI HIROSHI
Abstract: PURPOSE:To prevent a junction part from peeling in a conductive adhesion structure body wherein a circuit and a mounted part on a flexible board are joined by conductive adhesive. CONSTITUTION:In a conductive adhesion structure body wherein a circuit 2 and terminal 4 of a mounted part (LED3) formed on a flexible board 1 are joined by a conductive adhesive layer 5, the conductive adhesive layer 5 is comprised of at least two layers of a first conductive adhesive layer 5a arranged at a flexible board side and a second conductive adhesive layer 5b arranged at a terminal side of the mounted part, and folding endurance of the first conductive adhesive layer 5a is smaller than folding endurance of the second conductive adhesive layer 5b. In this case, folding endurance is a measure of flexibility and supports both end parts of a strip-like sample. It is defined as a load when the sample is broken when a point loading is applied to a central part, and the smaller folding endurance is, the larger flexibility is.
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公开(公告)号：JPH07245469A
公开(公告)日：1995-09-19
申请号：JP5993894
申请日：1994-03-03
Applicant: SONY CORP
Inventor： YAMANOI HIROSHI , SAKURAI TERUYASU
Abstract: PURPOSE:To prevent a circuit located on a flexible board from deteriorating in reliability of electrical connection due to potting when a conductive adhesive agent that electrically connects the circuits provided onto the surface of the board is potted. CONSTITUTION:A potting method is carried out through such a manner that a circuit 2 and a mounted part 3 (LED) both formed on a flexible board 1 are electrically connected together with conductive adhesive agent 5, and potting material 6 is applied onto the conductive adhesive agent 5 and cured, wherein thermosetting or heat.UV curing potting material.is used as the potting material 6. It is preferable that heat.UV curing potting material is used as the potting material 6, and the patting material 6 is cured through such a manner that it is pre-cured by irradiation with UV rays and then cured by heating.
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公开(公告)号：JPH06204636A
公开(公告)日：1994-07-22
申请号：JP34816392
申请日：1992-12-28
Applicant: SONY CORP
Inventor： SAKURAI TERUYASU , KOYAMA ETSURO
Abstract: PURPOSE:To prevent the occurrence of peeling and cracks at a tip part in tip of each connecting pattern for connection with a contact from the center of the tip part, and forming the tip part. CONSTITUTION:A connecting pattern 3 is arranged on a base film 2 in a connector terminal part 1. The connecting end part of the connecting pattern 3 is made to remain, and the other part is covered with a cover film 4 for protection of the other part. Each tip of the connecting pattern 3 is made thin and formed as a deformed part 3a, which is shifted from the center of the connecting pattern 3 in the longitudinal direction and curved or bent. The tip part of the deformed part 3a reaches an edge 5 of the connector terminal 1. A contact piece 8 is located at the approximately central part of each connecting pattern 3 in the longitudinal direction. Even if the position is slightly deviated at the time of the connection of the connector terminal, the contact piece 8 is guided into the direction toward the center at the curved part based on the curving of the deformed part 3a.
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公开(公告)号：JPH06152077A
公开(公告)日：1994-05-31
申请号：JP30403192
申请日：1992-11-13
Applicant: SONY CORP
Inventor： SAKURAI TERUYASU , KATSUMOTO TORU , KUMAGAI ATSUHIRO , JINBO HIDETO , MAMIYA TOSHIO
Abstract: PURPOSE:To obtain a flexible board to prevent breaking of a conductor pattern due to a bending stress of the flexible board in a reinforcing plate end part of a flexible board terminal part by a simple constitution. CONSTITUTION:An opening hole 13 is formed on the rear end side of a reinforcing plate 9 as a means for not concentrating stress to be imposed on a conductor pattern and a base film of a flexible board 1 near the rear end part of the reinforcing plate 9 for lowering stiffness of the rear end part of the reinforcing plate 9 so as to enable bending and deformation.
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公开(公告)号：JPH03257836A
公开(公告)日：1991-11-18
申请号：JP5596590
申请日：1990-03-07
Applicant: ROHM CO LTD , SONY CORP
Inventor： MAEDA MASAHIDE , TANIGUCHI YOSHIKUNI , UTENA HISASHI , SAKURAI TERUYASU
Abstract: PURPOSE:To maintain highly dimensionally accurate values by permitting the size of an open edge corresponding to the mating face of a cavity to be almost equal to the maximum shaking size between both molding metal dies and a lead frame when the open edge is positioned inner than the inner circumferential plane of a through hole. CONSTITUTION:When forming the mold 14 of an electronic component 11, the through hole 15 of a lead frame 19 is provided as a short hole having the width W1 and the length L1, the open edge 18a of a cavity 18 is positioned inner than the inner circumferential plane 15a of the through hole 15 by a suitable size A and around the mold 14 of the electronic component 11, a flange 21 having a projecting height A is integrally created as a part of the mold 14. In such a case, the width W1 and the length L1 of the short through hole 15 are permitted to be equal to the width W and the length L of the mold 14 of the electronic component 11 and the flange 21 constitutes the prescribed width W and the length L of the mold 14.
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