Abstract:
When a semiconductor chip is mounted on a mounting board by bonding bumps to each other, failure of bonding occurs due to mutual positional shift of the bumps. Before a semiconductor chip having a plurality of bumps formed thereon is mounted on a mounting board (3) having a plurality of bumps (4) formed thereon by flip-chip system, a resist layer (5) is formed thicker than the bump (4) on the mounting board (3) on which bumps are formed and then patterned to form a protrusion guide (5A) of semicircular cross-section protruding from the bump (4) forming face in the vicinity of the bump (4) and having a guide face (curved surface) directing toward the bump (4) side on the mounting board (3).
Abstract:
PROBLEM TO BE SOLVED: To solve the problem which cannot freely regulate the angle of the optical axis of the lens of a camera part in a conventional imaging device and which cannot photograph an object by a desired screen arrangement since a determination whether or not the set angle is directed at the optical axis of the lens toward the object is not performed even if the angle can be regulated. SOLUTION: An imaging apparatus includes a camera part 3 for photographing the object, and an apparatus body 2 having a liquid crystal display 11 for displaying the subject image supplied from this camera part 3 to rotatably support the camera part. The imaging device also includes a camera rotating means 23 for rotating the camera part 3 by an electric motor, a gravity sensing means 24 for sensing the direction of gravity to output its signal, and a camera control means 25 for driving the camera rotating means based on the signal from the gravity sensing means to direct the camera part toward a predetermined angle to the gravity direction. The camera part 3 is directed to a predetermined angle to the gravity direction in the state that the monitoring angle of the liquid crystal display 11 is arbitrary. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a chip electronic component easily with high reproducibility while surely realizing the stability of thickness, the size and the flatness of a substance, e.g. resin, for protecting the chip. SOLUTION: Under a state where a plurality or a plurality of kinds of acceptable bare chips 3 are secured onto a substrate 1 while directing the electrode plane 8 (device plane) downward and then a frame 6 coated with a mold releasing agent 38 at least the inner circumferential part 42 of an opening 36 is secured onto the substrate 1 through an adhesive substance 2, resin 4 is poured into the frame 6 to bury the acceptable bare chip 3 and then cured. The acceptable bare chip 3 buried in the resin 4 and secured in place is separated from the substrate 1, and then separated from the frame 6. Furthermore, the resin 4 is cut between the acceptable bare chips 3 and an acceptable bare chip 76 is separated thus producing an artificial wafer 75 and an acceptable chip component 76.
Abstract:
PROBLEM TO BE SOLVED: To attain photographing regardless of a residual memory amount by simultaneously operating the charging of a camera 100 and the backup of data. SOLUTION: When a camera 100 is mounted on a cradle 200, the image data of an image photographed by a camera module 110 of the camera 100 are directly transferred and recorded in an HDD 220 of the cradle 200, and the image data already recorded in a flash memory 133 of the camera 100 are backed up to the HDD 220 of the cradle 200. Also, the battery of the camera 100 is charged by a charging circuit 204 by using a power supplied through an AC code 280 to the cradle 200. Also, the cradle 200 is provided with tripod holes 280 so as to be fixed to a tripod so that photographing can be attained. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an input device which can be made low in profile, is superior in layout performance and design, and informs the user of an input received, by providing an appropriate touch sensation to the user, and to provide an electronic device. SOLUTION: The contact of the finger 4 of the user is detected by the sensor 2 of a capacitance sensor, etc., and a signal is inputted. When the sensor 2 detects the contact and the signal input is received, a drive signal is supplied to an actuator 3, such as a piezoelectric actuator, and thus the contact part of the finger 4 is vibrated and the vibration is transmitted to the user. Consequently, the user recognizes that input has been accepted. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To solve the problem that, when a semiconductor chip is mounted on a substrate by bonding their bumps to each other, defective joining occurs due to the positional deviation between the bumps. SOLUTION: Before the semiconductor chip having a plurality of bumps is mounted on a substrate 3 having a plurality of bumps 4 by flip chip bonding, a resist layer 5 is formed on the mounting substrate 3 having the formed bumps 4 so that the thickness of the layer 5 may become thicker than those of the bumps 4. Then projecting guides 5A which are protruded from the bump forming surface of the substrate 3 and have guiding surfaces (curved surfaces) directed to the bumps 4 and semicircular cross sections are formed in the vicinities of the bumps 4 on the mounting substrate 3 by patterning the resist layer 5. COPYRIGHT: (C)2004,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To correct an inclined photographed image which is photographed in the state of inclining a camera body, approximately into a horizontal state by correcting the image just by the inclination angle. SOLUTION: The imaging apparatus comprises: a CCD 42 for outputting a photographed image of an object inputted through a lens device 4; a gravity sensor 50 which is attached on a camera body, detects the direction of gravity and outputs a detection signal thereof; an inclination angle calculating means for calculating an inclination angle of the camera body according to the detection signal from the sensor and outputting an inclination angle signal; an image storage means storing the inclination angle of the camera body in association with the image photographed at that time and outputting stored information as an image signal; and an image processing means for correcting the image corrected approximately into the horizontal state by inclining the image reversely just at the inclination angle. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To improve the reliability in wiring formation or device characteristics by effectively preventing a void or a weld from being generated on a plate of a protecting material, reducing a step between a chip component and the protecting material, and preventing the protecting material from invading an electrode surface. SOLUTION: On a wafer 1, a plurality of or a plurality of kinds of semiconductor chips 3, 3' are fixed while turning their electrode surfaces downwards, lateral sides 39 of the chip components 3, 3' are coated with a resin 38 as a isolator to surround an electrode pad 5, a plate 4 of the protecting material is mounted approximately all over the surface including a gap of the semiconductor chips around the resin 38, and a pseudo wafer 49 formed by mounting the plate 4 continuously between the semiconductor chips and over their rear surfaces is released from a wafer 1. Further, after the step of releasing the pseudo wafer 49, the pseudo wafer 49 is cut between the plurality of or the plurality of kinds of semiconductor chips to separate the chip-like electronic components 46. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a chip-type electronic component, such as a semiconductor chip utilizing the characteristic of package treatment of a wafer, and to provide a manufacturing method of a dummy wafer for the manufacturing of the component. SOLUTION: The dummy wafer is manufactured through a process of bonding an adhesive means 102 onto a substrate 101, a process of fixing a plurality of pieces or a plurality of kinds of semiconductor chip 103 to the adhesive means, while facing the surface of an electrode downward, a process of degassing the adhesive surface of the semiconductor chip 103 and the adhesive means 102, a process of adhering a protective substance 107 over the whole surface, including the same between a plurality of pieces or kinds of the semiconductor chips 103 and a process of separating the dummy wafer 129, to which the semiconductor chip is adhered, by the protective substance 197. Air, pinched between the adhering surfaces, is removed to improve an adhesiveness between the chip 103 and the adhering means 102 to obtain the dummy wafer, which is high in the positioning accuracy of the chip 103, while being reduced in defects and high in the quality of the same, then, the chip-type electronic component 126 is manufactured at a low cost with superior reliability and a high yield, by cutting the dummy wafer into pieces to obtain the individual pieces of the same. COPYRIGHT: (C)2003,JPO