Imaging device
    3.
    发明专利
    Imaging device 审中-公开
    成像装置

    公开(公告)号:JP2005311895A

    公开(公告)日:2005-11-04

    申请号:JP2004128751

    申请日:2004-04-23

    Abstract: PROBLEM TO BE SOLVED: To solve the problem which cannot freely regulate the angle of the optical axis of the lens of a camera part in a conventional imaging device and which cannot photograph an object by a desired screen arrangement since a determination whether or not the set angle is directed at the optical axis of the lens toward the object is not performed even if the angle can be regulated.
    SOLUTION: An imaging apparatus includes a camera part 3 for photographing the object, and an apparatus body 2 having a liquid crystal display 11 for displaying the subject image supplied from this camera part 3 to rotatably support the camera part. The imaging device also includes a camera rotating means 23 for rotating the camera part 3 by an electric motor, a gravity sensing means 24 for sensing the direction of gravity to output its signal, and a camera control means 25 for driving the camera rotating means based on the signal from the gravity sensing means to direct the camera part toward a predetermined angle to the gravity direction. The camera part 3 is directed to a predetermined angle to the gravity direction in the state that the monitoring angle of the liquid crystal display 11 is arbitrary.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 解决的问题:为了解决常规成像装置中不能自由调节相机部件的透镜的角度的问题,并且不能由所需的屏幕布置来拍摄对象,因为确定是否 即使可以调节角度,也不会使透镜朝向物体的光轴的设定角度不被执行。 解决方案:一种成像设备包括用于拍摄物体的相机部分3和具有用于显示从该照相机部分3提供的被摄体图像以可旋转地支撑相机部分的液晶显示器11的装置主体2。 成像装置还包括用于通过电动机旋转照相机部分3的相机旋转装置23,用于感测重力方向输出其信号的重力感测装置24,以及用于驱动照相机旋转装置的照相机控制装置 来自重力感测装置的信号,以将照相机部分朝向与重力方向成预定角度。 在液晶显示器11的监视角度是任意的状态下,照相机部分3被引向与重力方向成预定的角度。 版权所有(C)2006,JPO&NCIPI

    METHOD FOR MANUFACTURING CHIP ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING ARTIFICIAL WAFER FOR USE THEREIN

    公开(公告)号:JP2003152134A

    公开(公告)日:2003-05-23

    申请号:JP2001353233

    申请日:2001-11-19

    Applicant: SONY CORP

    Inventor: SENDA AYUMI

    Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a chip electronic component easily with high reproducibility while surely realizing the stability of thickness, the size and the flatness of a substance, e.g. resin, for protecting the chip. SOLUTION: Under a state where a plurality or a plurality of kinds of acceptable bare chips 3 are secured onto a substrate 1 while directing the electrode plane 8 (device plane) downward and then a frame 6 coated with a mold releasing agent 38 at least the inner circumferential part 42 of an opening 36 is secured onto the substrate 1 through an adhesive substance 2, resin 4 is poured into the frame 6 to bury the acceptable bare chip 3 and then cured. The acceptable bare chip 3 buried in the resin 4 and secured in place is separated from the substrate 1, and then separated from the frame 6. Furthermore, the resin 4 is cut between the acceptable bare chips 3 and an acceptable bare chip 76 is separated thus producing an artificial wafer 75 and an acceptable chip component 76.

    Image pickup device
    5.
    发明专利
    Image pickup device 审中-公开
    图像拾取器件

    公开(公告)号:JP2006165851A

    公开(公告)日:2006-06-22

    申请号:JP2004352581

    申请日:2004-12-06

    Inventor: SENDA AYUMI

    Abstract: PROBLEM TO BE SOLVED: To attain photographing regardless of a residual memory amount by simultaneously operating the charging of a camera 100 and the backup of data. SOLUTION: When a camera 100 is mounted on a cradle 200, the image data of an image photographed by a camera module 110 of the camera 100 are directly transferred and recorded in an HDD 220 of the cradle 200, and the image data already recorded in a flash memory 133 of the camera 100 are backed up to the HDD 220 of the cradle 200. Also, the battery of the camera 100 is charged by a charging circuit 204 by using a power supplied through an AC code 280 to the cradle 200. Also, the cradle 200 is provided with tripod holes 280 so as to be fixed to a tripod so that photographing can be attained. COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题:通过同时操作照相机100的充电和数据的备份来实现无论剩余存储量如何的拍摄。 解决方案:当照相机100安装在支架200上时,照相机100的照相机模块110拍摄的图像的图像数据被直接传送并记录在托架200的HDD 220中,并且图像数据 已经记录在相机100的闪速存储器133中的数据被备份到支架200的HDD220。而且,通过使用通过AC代码280提供的电力向相机100充电照相机100的电池给 此外,托架200设置有三脚架孔280,以便固定到三脚架,从而可以获得拍摄。 版权所有(C)2006,JPO&NCIPI

    Input device, and electronic device
    6.
    发明专利
    Input device, and electronic device 有权
    输入设备和电子设备

    公开(公告)号:JP2005339298A

    公开(公告)日:2005-12-08

    申请号:JP2004158620

    申请日:2004-05-28

    Abstract: PROBLEM TO BE SOLVED: To provide an input device which can be made low in profile, is superior in layout performance and design, and informs the user of an input received, by providing an appropriate touch sensation to the user, and to provide an electronic device.
    SOLUTION: The contact of the finger 4 of the user is detected by the sensor 2 of a capacitance sensor, etc., and a signal is inputted. When the sensor 2 detects the contact and the signal input is received, a drive signal is supplied to an actuator 3, such as a piezoelectric actuator, and thus the contact part of the finger 4 is vibrated and the vibration is transmitted to the user. Consequently, the user recognizes that input has been accepted.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题:为了提供一种可以使轮廓较低的输入装置,在布局性能和设计方面是优越的,并且通过向用户提供适当的触感来通知用户所接收的输入,并且 提供电子设备。 解决方案:用户的手指4的接触由电容传感器等的传感器2检测,并输入信号。 当传感器2检测到接触并且接收到信号输入时,驱动信号被提供给诸如压电致动器的致动器3,因此手指4的接触部分被振动并且振动被传送给使用者。 因此,用户认识到输入已被接受。 版权所有(C)2006,JPO&NCIPI

    Imaging apparatus
    8.
    发明专利
    Imaging apparatus 审中-公开
    成像设备

    公开(公告)号:JP2006129391A

    公开(公告)日:2006-05-18

    申请号:JP2004318465

    申请日:2004-11-01

    Abstract: PROBLEM TO BE SOLVED: To correct an inclined photographed image which is photographed in the state of inclining a camera body, approximately into a horizontal state by correcting the image just by the inclination angle.
    SOLUTION: The imaging apparatus comprises: a CCD 42 for outputting a photographed image of an object inputted through a lens device 4; a gravity sensor 50 which is attached on a camera body, detects the direction of gravity and outputs a detection signal thereof; an inclination angle calculating means for calculating an inclination angle of the camera body according to the detection signal from the sensor and outputting an inclination angle signal; an image storage means storing the inclination angle of the camera body in association with the image photographed at that time and outputting stored information as an image signal; and an image processing means for correcting the image corrected approximately into the horizontal state by inclining the image reversely just at the inclination angle.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题:通过利用倾斜角校正图像,来校正在照相机机身倾斜的状态下拍摄的倾斜的拍摄图像,大致进入水平状态。 解决方案:成像装置包括:CCD 42,用于输出通过透镜装置4输入的物体的拍摄图像; 安装在照相机主体上的重力传感器50检测重力方向并输出其检测信号; 倾斜角度计算装置,用于根据来自传感器的检测信号计算照相机主体的倾斜角度并输出倾斜角度信号; 图像存储装置,存储与当时拍摄的图像相关联的照相机主体的倾斜角度,并输出存储的信息作为图像信号; 以及图像处理装置,用于通过相反地倾斜图像来校正大致修正为水平状态的图像。 版权所有(C)2006,JPO&NCIPI

    MANUFACTURING METHOD OF CHIP-TYPE ELECTRONIC COMPONENT, AND MANUFACTURING METHOD OF DUMMY WAFER EMPLOYED FOR MANUFACTURING THE COMPONENT

    公开(公告)号:JP2003203938A

    公开(公告)日:2003-07-18

    申请号:JP2002003463

    申请日:2002-01-10

    Applicant: SONY CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a chip-type electronic component, such as a semiconductor chip utilizing the characteristic of package treatment of a wafer, and to provide a manufacturing method of a dummy wafer for the manufacturing of the component. SOLUTION: The dummy wafer is manufactured through a process of bonding an adhesive means 102 onto a substrate 101, a process of fixing a plurality of pieces or a plurality of kinds of semiconductor chip 103 to the adhesive means, while facing the surface of an electrode downward, a process of degassing the adhesive surface of the semiconductor chip 103 and the adhesive means 102, a process of adhering a protective substance 107 over the whole surface, including the same between a plurality of pieces or kinds of the semiconductor chips 103 and a process of separating the dummy wafer 129, to which the semiconductor chip is adhered, by the protective substance 197. Air, pinched between the adhering surfaces, is removed to improve an adhesiveness between the chip 103 and the adhering means 102 to obtain the dummy wafer, which is high in the positioning accuracy of the chip 103, while being reduced in defects and high in the quality of the same, then, the chip-type electronic component 126 is manufactured at a low cost with superior reliability and a high yield, by cutting the dummy wafer into pieces to obtain the individual pieces of the same. COPYRIGHT: (C)2003,JPO

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