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公开(公告)号：DE60123856T2
公开(公告)日：2007-06-14
申请号：DE60123856
申请日：2001-02-06
Applicant: SONY CORP
Inventor： TOYODA JUNICHI , OKAYAMA KATSUMI , IWASHITA SAKAN
Abstract: There is provided an electromagnetic wave absorber in which uniformity, reproducibility and productivity are raised by forming a metal soft magnetic material flat plate, the surface of which is smoothed, of a regular shape disk or elliptical shape easily, at low cost, stably and certainly. In the electromagnetic wave absorber composed of a mixture of a magnetic material particle 21 and an organic binding material, the magnetic material particle 21 is constituted by a nucleus 22 made of organic material and a magnetic material film 23 formed on its surface.
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公开(公告)号：DE60224957T2
公开(公告)日：2009-02-12
申请号：DE60224957
申请日：2002-05-29
Applicant: NITTO DENKO CORP , SONY CORP
Inventor： TOYODA JUNICHI , OKAYAMA KATSUMI , IGARASHI KAZUMASA
Abstract: A resin component for encapsulating a semiconductor includes magnetic powder and silica powder whose average particle diameter is smaller than the average particle diameter of the magnetic powder. Thus, the curing body of the resin component for encapsulating a semiconductor has an electromagnetic wave shielding function by the magnetic powder. Since the spaces of the magnetic powder are filled with the silica powder whose average particle diameter is small, the moldability of the curing body is improved and the insulating characteristics thereof are enhanced. Such a resin component for encapsulating a semiconductor is employed, there can be produced a preferably formed and encapsulated semiconductor device having the electromagnetic wave shielding function and having no malfunction generated due to leakage current from a semiconductor element.
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公开(公告)号：AU2002357518A1
公开(公告)日：2003-07-24
申请号：AU2002357518
申请日：2002-12-26
Applicant: SONY CORP
Inventor： TOYODA JUNICHI , NAGASAWA NAOMI , SUZUKI MASAYUKI
IPC: A41G3/00 , A61L27/60 , B82Y20/00 , B82Y30/00 , C01F7/16 , C08K3/22 , C08L101/00 , C09D5/22 , C09D7/12 , C09D11/00 , C09D201/00 , C09K11/00 , C09K11/02 , C09K11/08 , C09K11/64 , C09K11/77 , G09F9/30 , C08K3/00 , H05B33/14
Abstract: A first composite material comprising a fluorescent substance such as SrAl2O4 :Eu and an elastic material such as a polyester resin, wherein the content of the fluorescent substance is 30 wt % or more; a stress luminescent material comprising the composite material formed into a sheet having a thickness of 1 mm or less; an artificial skin, a luminescent system, a display system and the like using the stress luminescent material; a second composite material comprising a fluorescent substance such as SrAl2O4 :Eu and a piezoelectric material; and a luminescent element using the second composite material, which can be controlled through an electric signal from the outside.
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公开(公告)号：DE60130605D1
公开(公告)日：2007-11-08
申请号：DE60130605
申请日：2001-06-06
Applicant: SONY CORP
Inventor： TOYODA JUNICHI , KATSUMI OKAYAMA , IWASHITA SAKAN , KANAYAMA YOSHIKI , ITO HIROKI
Abstract: A portable telephone having an antenna for transmitting and/or receiving a wireless signal, a microphone for generating a sound signal corresponding to an input sound, a transmitting and receiving circuit for generating a wireless signal corresponding to the sound signal generated by the microphone to transmit the wireless signal through the antenna and generating a sound signal corresponding to the wireless signal received by the antenna, a receiver for outputting sound corresponding to the sound signal generated by the transmitting and receiving circuit, a shield case for surrounding and housing all or part of the transmitting and receiving circuit and being conductive, an electric wave absorber with one face in contact with a predetermined area of the shield case for absorbing an electric wave, and a conductive layer formed on another face of the electric wave absorber and electrically connected to the shield case.
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公开(公告)号：DE60201850D1
公开(公告)日：2004-12-16
申请号：DE60201850
申请日：2002-02-15
Applicant: SUMITOMO ELECTRIC INDUSTRIES , SONY CORP
Inventor： HOSOE AKIHISA , NITTA KOJI , INAZAWA SHINJI , OKAYAMA KATSUMI , TOYODA JUNICHI
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Patent Agency Ranking
公开(公告)号：DE60130605T2
公开(公告)日：2008-06-26
申请号：DE60130605
申请日：2001-06-06
Applicant: SONY CORP
Inventor： TOYODA JUNICHI , KATSUMI OKAYAMA , IWASHITA SAKAN , KANAYAMA YOSHIKI , ITO HIROKI
Abstract: A portable telephone having an antenna for transmitting and/or receiving a wireless signal, a microphone for generating a sound signal corresponding to an input sound, a transmitting and receiving circuit for generating a wireless signal corresponding to the sound signal generated by the microphone to transmit the wireless signal through the antenna and generating a sound signal corresponding to the wireless signal received by the antenna, a receiver for outputting sound corresponding to the sound signal generated by the transmitting and receiving circuit, a shield case for surrounding and housing all or part of the transmitting and receiving circuit and being conductive, an electric wave absorber with one face in contact with a predetermined area of the shield case for absorbing an electric wave, and a conductive layer formed on another face of the electric wave absorber and electrically connected to the shield case.
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公开(公告)号：DE60224957D1
公开(公告)日：2008-03-27
申请号：DE60224957
申请日：2002-05-29
Applicant: NITTO DENKO CORP , SONY CORP
Inventor： TOYODA JUNICHI , OKAYAMA KATSUMI , IGARASHI KAZUMASA
Abstract: A resin component for encapsulating a semiconductor includes magnetic powder and silica powder whose average particle diameter is smaller than the average particle diameter of the magnetic powder. Thus, the curing body of the resin component for encapsulating a semiconductor has an electromagnetic wave shielding function by the magnetic powder. Since the spaces of the magnetic powder are filled with the silica powder whose average particle diameter is small, the moldability of the curing body is improved and the insulating characteristics thereof are enhanced. Such a resin component for encapsulating a semiconductor is employed, there can be produced a preferably formed and encapsulated semiconductor device having the electromagnetic wave shielding function and having no malfunction generated due to leakage current from a semiconductor element.
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公开(公告)号：DE60123856D1
公开(公告)日：2006-11-30
申请号：DE60123856
申请日：2001-02-06
Applicant: SONY CORP
Inventor： TOYODA JUNICHI , OKAYAMA KATSUMI , IWASHITA SAKAN
Abstract: There is provided an electromagnetic wave absorber in which uniformity, reproducibility and productivity are raised by forming a metal soft magnetic material flat plate, the surface of which is smoothed, of a regular shape disk or elliptical shape easily, at low cost, stably and certainly. In the electromagnetic wave absorber composed of a mixture of a magnetic material particle 21 and an organic binding material, the magnetic material particle 21 is constituted by a nucleus 22 made of organic material and a magnetic material film 23 formed on its surface.
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公开(公告)号：DE60200279T2
公开(公告)日：2004-08-12
申请号：DE60200279
申请日：2002-06-12
Applicant: NITTO DENKO CORP , SONY CORP
Inventor： IGARASHI KAZUMASA , TOYODA JUNICHI , OKAYAMA KATSUMI
Abstract: A semiconductor element is mounted on a wiring circuit board in which a circuit has been formed. This semiconductor element is resin-encapsulated with a first encapsulating resin layer. Then, a second encapsulating resin layer is formed, on the outer circumference of the first encapsulating resin layer, from an epoxy resin composition containing the following components (A) to (D): (A)epoxy resin; (B)phenolic resin; (C)curing accelerator; and (D)at least one of the following particles (d1) and (d2): (d1) conductive particles whose surfaces are subjected to coating treatment with an insulating inorganic material; and (d2) magnetic particles whose surfaces are subjected to coating treatment with an insulating inorganic material.
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公开(公告)号：DE60201850T2
公开(公告)日：2005-10-27
申请号：DE60201850
申请日：2002-02-15
Applicant: SUMITOMO ELECTRIC INDUSTRIES , SONY CORP
Inventor： HOSOE AKIHISA , NITTA KOJI , INAZAWA SHINJI , OKAYAMA KATSUMI , TOYODA JUNICHI
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