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公开(公告)号：US3585713A
公开(公告)日：1971-06-22
申请号：US3585713D
申请日：1969-03-24
Applicant: SONY CORP
Inventor： KANEDA YOSHIYUKI , IWASHITA SAKAN , HISHIKAWA SHINICHI
IPC: H01L21/00 , H01L23/485 , B01J17/00 , H01L5/00
CPC classification number: H01L21/00 , H01L23/485 , H01L2924/0002 , H01L2924/00
Abstract: A SEMICONDUCTOR DEVICE HAVING OHMIC CONTACTS APPLIED TO A SEMICONDUCTOR WAFER THROUGH WINDOWS IN A GLASS OR OTHER INSULATING LAYER ON A SURFACE OF THE WAFER IS PROVIDED WITH METAL BUMPS OR PROTUBERANCES FOR CONNECTING THE CONTACTS WITH CORRESPONDING CONDUCTORS OF A HEADER OR PRINTED CIRCUIT BY COVERING THE ENTIRE WAFER SURFACE WITH A LAYER OF TIN OR OTHER METAL HAVING NO AFINITY FOR THE INSULATING LAYER AND STRONG AFFINITY FOR THE CONTACTS, SELECTIVELY DEPOSITING ON REGIONS OF THE TIN LAYER WHICH CORRESPOND TO AT LEAST PORTIONS OF THE CONTACTS METAL, SUCH AS LEAD OR AN ALLOY THEREOF, FOR FORMING THE DESIRED PROTUBERANCES OR BUMPS AND FOR WHICH THE TIN LAYER HAS A STRONG AFFINITY, AND THEN HEATING THE RESULTING STRUCTURE SO THAT THE TIN LAYER IS AGGREGATED ON THE OHMIC CONTACTS AS A RESULT OF ITS SURFACE TENSION AND CAUSES A CORRESPONDING AGGREGATION OF THE BUMP OR PROTUBERANCE FORMING METAL.
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公开(公告)号：DE1915148A1
公开(公告)日：1969-11-27
申请号：DE1915148
申请日：1969-03-25
Applicant: SONY CORP
Inventor： KANEDA YOSHIYUKI , HISHIKAWA SHINICHI , IWASHITA SAKAN
IPC: H01L21/00 , H01L23/485 , B01J17/00
Abstract: 1,217,293. Semi-conductor devices. SONY CORP. 25 March, 1969 [25 March, 1968], No. 15549/69. Heading H1K. A contact bump on a semi-conductor device is produced by securing a metal electrode to a surface of the device, forming a metal layer over the surface and over the electrode, the metal of the layer having an affinity for the metal electrode but not for the surface, forming a metal bump over the electrode, and heating to a temperature at which the metal layer fuses and is aggregated into the bump. As shown, a region 12 of a silicon IC is contacted by depositing a glass layer on an existing glass or silicon dioxide coating to form an insulating layer 13, photoetching to form a window 13a and depositing an electrode 14 comprising a layer 14a of aluminium coated with a layer 14b of titanium and a layer 14c of nickel, Fig. 2A. A layer 15 of tin is deposited over the surface of glass layer 13 and electrode 14, Fig. 2B. A metal mask is placed on the surface and lead is vapour deposited to form a contact bump 17 1 which is provided with a surface layer 18 of silver if desired, Fig. 2C. The mask is then removed and the arrangement is heated to melt layer 15 which aggregates into the contact bump 17 due to surface tension, Fig. 2D. The excess lead portions 17a 1 (Fig. 2C) which form round the contact bump due to the gap G between the mask and the device are simultaneously aggregated into the contact bump. Any excess tin remaining on the surface may be removed by coating with a flux, e.g. resin, and heating. The electrode 14 may comprise a single layer of A1.
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公开(公告)号：DE60130605D1
公开(公告)日：2007-11-08
申请号：DE60130605
申请日：2001-06-06
Applicant: SONY CORP
Inventor： TOYODA JUNICHI , KATSUMI OKAYAMA , IWASHITA SAKAN , KANAYAMA YOSHIKI , ITO HIROKI
Abstract: A portable telephone having an antenna for transmitting and/or receiving a wireless signal, a microphone for generating a sound signal corresponding to an input sound, a transmitting and receiving circuit for generating a wireless signal corresponding to the sound signal generated by the microphone to transmit the wireless signal through the antenna and generating a sound signal corresponding to the wireless signal received by the antenna, a receiver for outputting sound corresponding to the sound signal generated by the transmitting and receiving circuit, a shield case for surrounding and housing all or part of the transmitting and receiving circuit and being conductive, an electric wave absorber with one face in contact with a predetermined area of the shield case for absorbing an electric wave, and a conductive layer formed on another face of the electric wave absorber and electrically connected to the shield case.
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公开(公告)号：DE60123856T2
公开(公告)日：2007-06-14
申请号：DE60123856
申请日：2001-02-06
Applicant: SONY CORP
Inventor： TOYODA JUNICHI , OKAYAMA KATSUMI , IWASHITA SAKAN
Abstract: There is provided an electromagnetic wave absorber in which uniformity, reproducibility and productivity are raised by forming a metal soft magnetic material flat plate, the surface of which is smoothed, of a regular shape disk or elliptical shape easily, at low cost, stably and certainly. In the electromagnetic wave absorber composed of a mixture of a magnetic material particle 21 and an organic binding material, the magnetic material particle 21 is constituted by a nucleus 22 made of organic material and a magnetic material film 23 formed on its surface.
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公开(公告)号：CA2267819A1
公开(公告)日：1999-10-06
申请号：CA2267819
申请日：1999-03-31
Applicant: SONY CORP
Inventor： IWASHITA SAKAN , KITAGAWA KOJI
IPC: G02F1/1333 , G02F1/137 , G09F9/35
Abstract: The present invention provides an image display apparatus enabling to easily handle the thin glass plate and easily assemble the apparatus, thus increasing the production yield. The image display apparatus includes: a plasma cell having a plurality of discharge electrodes arranged at a predetermined interval and parallel to one another on one main surface of a first substrate, a dielectric thin plate arranged at a predetermined distance from the first substrate, and a seal portion for sealing the space between the first substrate and the dielectric thin plate; an electro-optical material layer; and a second substrate having on its opposing surface electrodes formed to extend approximately in the direction vertical to the discharge electrodes, the second substrate being placed via the electro-optical material layer over the dielectric thin plate. The dielectric thin plate is a layered body having at least a thin glass plate and a high-molecule polymer film which are bonded to each other. The layered body may further include an ultraviolet-ray shading film.
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Patent Agency Ranking
公开(公告)号：DE60012462T2
公开(公告)日：2005-07-28
申请号：DE60012462
申请日：2000-12-07
Applicant: SONY CORP
Inventor： TOYODA JUNICHI , IWASHITA SAKAN , OKAYAMA KATSUMI
Abstract: A radio wave absorbent capable of absorbing radiowaves in a space saving and efficient manner and capable of coping with up to high frequency bands, as well as a manufacturing method thereof are provided. In a radio wave absorbent in which magnetic particles comprising a soft magnetic metal material are mixed with a matrix of a polymeric material or ceramics, the magnetic particles are formed into elliptic plate particles.
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公开(公告)号：DE60012462D1
公开(公告)日：2004-09-02
申请号：DE60012462
申请日：2000-12-07
Applicant: SONY CORP
Inventor： TOYODA JUNICHI , IWASHITA SAKAN , OKAYAMA KATSUMI
Abstract: A radio wave absorbent capable of absorbing radiowaves in a space saving and efficient manner and capable of coping with up to high frequency bands, as well as a manufacturing method thereof are provided. In a radio wave absorbent in which magnetic particles comprising a soft magnetic metal material are mixed with a matrix of a polymeric material or ceramics, the magnetic particles are formed into elliptic plate particles.
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公开(公告)号：CA893386A
公开(公告)日：1972-02-15
申请号：CA893386D
Applicant: SONY CORP
Inventor： KANEDA YOSHIYUKI , IWASHITA SAKAN , HISHIKAWA SHINICHI
IPC: H01L21/00 , H01L23/485
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公开(公告)号：DE60130605T2
公开(公告)日：2008-06-26
申请号：DE60130605
申请日：2001-06-06
Applicant: SONY CORP
Inventor： TOYODA JUNICHI , KATSUMI OKAYAMA , IWASHITA SAKAN , KANAYAMA YOSHIKI , ITO HIROKI
Abstract: A portable telephone having an antenna for transmitting and/or receiving a wireless signal, a microphone for generating a sound signal corresponding to an input sound, a transmitting and receiving circuit for generating a wireless signal corresponding to the sound signal generated by the microphone to transmit the wireless signal through the antenna and generating a sound signal corresponding to the wireless signal received by the antenna, a receiver for outputting sound corresponding to the sound signal generated by the transmitting and receiving circuit, a shield case for surrounding and housing all or part of the transmitting and receiving circuit and being conductive, an electric wave absorber with one face in contact with a predetermined area of the shield case for absorbing an electric wave, and a conductive layer formed on another face of the electric wave absorber and electrically connected to the shield case.
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公开(公告)号：DE60123856D1
公开(公告)日：2006-11-30
申请号：DE60123856
申请日：2001-02-06
Applicant: SONY CORP
Inventor： TOYODA JUNICHI , OKAYAMA KATSUMI , IWASHITA SAKAN
Abstract: There is provided an electromagnetic wave absorber in which uniformity, reproducibility and productivity are raised by forming a metal soft magnetic material flat plate, the surface of which is smoothed, of a regular shape disk or elliptical shape easily, at low cost, stably and certainly. In the electromagnetic wave absorber composed of a mixture of a magnetic material particle 21 and an organic binding material, the magnetic material particle 21 is constituted by a nucleus 22 made of organic material and a magnetic material film 23 formed on its surface.
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