公开(公告)号：SG159444A1

公开(公告)日：2010-03-30

申请号：SG2009048653

申请日：2009-07-17

Applicant: SONY CORP

Inventor： HASHIMOTO MITSUO ,  YAZAWA KAZUAKI ,  ISHIDA YUICHI ,  RYOSON HIROYUKI

Abstract: According to an embodiment of the present invention, there is provided a heat spreader including an evaporation portion, a first condenser portion, a working fluid, and a first flow path. The evaporation portion is arranged in a first position. The first condenser portion is arranged in a second position, the second position being one of higher than and apart from the first position. The working fluid evaporates from a liquid phase to a gas phase in the evaporation portion, and condenses from the gas phase to the liquid phase in the first condenser portion. The first flow path is made of a nanomaterial, has hydrophobicity on a surface, and causes the working fluid condensed to the liquid phase in the first condenser portion to flow to the evaporation portion.

公开(公告)号：JP2011080679A

公开(公告)日：2011-04-21

申请号：JP2009232991

申请日：2009-10-07

Applicant: Sony Corp ,  ソニー株式会社

Inventor： YAZAWA KAZUAKI ,  HASHIMOTO MITSUO

IPC: F28D15/02 ,  H01L23/427

CPC classification number: F28D15/0233 ,  F28D15/046 ,  F28F13/187 ,  F28F2255/20

Abstract: PROBLEM TO BE SOLVED: To provide a heat transfer device enabling stable heat transfer and electronic equipment including the heat transfer device. SOLUTION: An evaporation part 7 constituted of a plurality of evaporation structures 71 is provided in the heat receiving part 4 of a heat spreader 1 filled with a refrigerant. The evaporation structure 71 includes a lateral face 72 facing a flowing part 6 and a plurality of recesses 74 having openings 73 at a plurality of positions different from each other in the Z-axis direction of the lateral face 72, respectively. The recess 74 includes an inclination part 78 inclined to the direction containing components of the Z-axis direction. The inclination part 78 is provided at a portion closer to the heat receiving part 4 on the inner face of the recess 74 so as to form a V groove 61 between the two evaporation structures 71 adjacent to each other sandwiching the flowing part 6. Thus, at various height of a liquid level of a liquid refrigerant, a meniscus face having an efficient shape to evaporate and flow the liquid refrigerant can be formed. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种能够稳定传热的传热装置和包括传热装置的电子设备。 解决方案：在填充有制冷剂的散热器1的受热部4中设置由多个蒸发结构71构成的蒸发部7。 蒸发结构71包括分别面向流动部分6的侧面72和具有在侧面72的Z轴方向上彼此不同的多个位置的开口73的多个凹部74。 凹部74包括与包含Z轴方向的部件的方向倾斜的倾斜部78。 倾斜部78设置在靠近凹部74的内表面上的受热部4的部分，以便在两个彼此相邻的蒸发结构71之间形成夹持流动部6的V形槽61。 在液体制冷剂的液面的高度不同的地方，可以形成具有蒸发和流动液体制冷剂的有效形状的弯月面。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2010243036A

公开(公告)日：2010-10-28

申请号：JP2009091216

申请日：2009-04-03

Applicant: Sony Corp ,  ソニー株式会社

Inventor： ISHIDA YUICHI ,  HASHIMOTO MITSUO ,  YAZAWA KAZUAKI ,  YOSHITAKA HIROYUKI ,  SHIGEMOTO TATSUHIKO

IPC: F28D15/02 ,  H01L23/427 ,  H05K7/20

CPC classification number: H05K7/203 ,  F28D15/02 ,  F28D15/046 ,  F28F23/00 ,  G06F1/20 ,  G06F2200/201 ,  Y10T29/4935

Abstract: PROBLEM TO BE SOLVED: To provide a heat transport device capable of efficiently performing heat transport. SOLUTION: The heat transport device includes a working fluid, an evaporation portion, a condensation portion, and a flow path portion. The heat transport device further includes a region provided on at least one of the evaporation portion, the condensation portion and the flow path portion and made of a carbon material. The working fluid is constituted by adding an organic compound having a hydroxyl group to pure water. The evaporation portion causes the working fluid to evaporate from a liquid phase to a gas phase. The condensation portion is communicated with the evaporation portion, and causes the working fluid to condense from the gas phase to the liquid phase. The flow path portion causes the working fluid condensed in the condensation portion to the liquid phase to flow to the evaporation portion. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供能够有效地进行热传输的热输送装置。 解决方案：传热装置包括工作流体，蒸发部分，冷凝部分和流路部分。 热传输装置还包括设置在蒸发部分，冷凝部分和流路部分中的至少一个上并由碳材料制成的区域。 工作流体通过向纯水中加入具有羟基的有机化合物构成。 蒸发部分使工作流体从液相蒸发成气相。 冷凝部与蒸发部连通，使工作流体从气相冷凝至液相。 流路部使冷凝部中冷凝的液相流向蒸发部。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2009200220A

公开(公告)日：2009-09-03

申请号：JP2008039830

申请日：2008-02-21

Applicant: Sony Corp ,  ソニー株式会社

Inventor： ISHIDA YUICHI ,  YAZAWA KAZUAKI ,  NAKAYAMA NORIKAZU

IPC: H01L33/02 ,  H01L33/06 ,  H01L33/32 ,  H01L33/62 ,  H01S5/343

CPC classification number: H01L33/645 ,  H01L33/0079 ,  H01S5/0224 ,  H01S5/02415 ,  H01S5/0261 ,  H01S5/32341 ,  H01S2301/173

Abstract: PROBLEM TO BE SOLVED: To provide a light-emitting device which can use power for driving the device itself to diffuse the heat of a light-emitting part effectively, an electronic instrument loading this, and a method for manufacturing the light-emitting device.
SOLUTION: The light-emitting device 1 comprises: an EL (Electro-Luminescence) layer 6 which has a first conductive type first semiconductor layer 5 which is of either an n type or a p type, a second conductive type second semiconductor layer 3 opposite to the first conductive type, and an active layer 4 formed between the two layers concerned; and a first conductive type heat-dissipating layer 2 jointed to a side close to the second semiconductor layer 3 of an EL layer 6. In the heat-dissipating layer 2, since heat transportation by heat conduction and a Peltier effect is generated in a direction of leaving from the active layer 4, it is possible to dissipate the heat effectively. Thus, damage caused by the heat of the active layer 4 is suppressed, thus contributing to high brightness and a high output of the light-emitting device 1.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 解决问题的方案为了提供一种发光装置，其能够利用电力来驱动装置本身以有效地扩散发光部件的热量，装载该发光装置的电子仪器，以及制造发光部件的方法， 发光装置。 解决方案：发光装置1包括：EL（电致发光）层6，其具有n型或ap型的第一导电型第一半导体层5，第二导电型第二半导体层 3与第一导电类型相对，以及形成在所涉及的两层之间的有源层4; 以及与EL层6的第二半导体层3靠近的一侧接合的第一导电型散热层2.在散热层2中，由于通过热传导和珀耳帖效应产生沿着方向 从有源层4离开，可以有效地散发热量。 因此，有源层4的热量引起的损伤被抑制，因此有助于发光装置1的高亮度和高输出。版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2001221523A

公开(公告)日：2001-08-17

申请号：JP2000029302

申请日：2000-02-07

Applicant: SONY CORP

Inventor： YAZAWA KAZUAKI

IPC: G06F1/20 ,  F25B9/14 ,  H01L23/36

Abstract: PROBLEM TO BE SOLVED: To efficiently cool a heating part included in an electronic apparatus with a low power. SOLUTION: The cooler comprises a first rotor 14 rotatably disposed in a first circular chamber 10 to conduct heat from a specified heating part to form a plurality of closed spaces 15, 16, 17 which rotate their positions with rotation of the first rotor 14, a second rotor 22 having a heat dissipation part disposed rotatably in a second circular chamber 20 in a close vicinity and rotated in interlocked relation with the first rotor 14 to form a plurality of hermetic spaces 23, 24, 25 which rotate their positions with rotation of the rotor 22, with a specified phase difference from the closed spaces at the first rotor, a plurality of connecting means 41, 42, 43 for connecting between the first circular chamber interior and the second circular chamber interior respectively through regenerative heat exchangers 44, 45, 46 at every specified angle and starting means 30 for starting the first and second rotors.

公开(公告)号：JP2001075681A

公开(公告)日：2001-03-23

申请号：JP24576799

申请日：1999-08-31

Applicant: SONY CORP

Inventor： YAZAWA KAZUAKI

IPC: G06F1/26 ,  H01L35/28 ,  H02J9/06

Abstract: PROBLEM TO BE SOLVED: To securely protect data in information processing equipment and to put the information processing equipment back normally into the original state when the power supply recovers by obtaining electric power by using the heat energy radiated by a heat generating body inside the information processing equipment. SOLUTION: A CPU 5 mounted on a circuit board 11 in a personal computer main body 2 is a heat generating body which generates heat when driven. In this case, the heat radiated by the CPU 5 is transduced by a thermoelectric transducing element 12 into electricity, whose electric power is supplied as auxiliary electric power needed in case of a power failure (or a standby state entered by intentionally turning off the power source). The thermoelectric transducing element 12 is interposed between the CPU 5 and a heat radiating means (heat sink, etc.), 13 for cooling the CPU 5 by radiating its heat into the air, and an electromotive force is generated by the temperature difference between the CPU 5 and the heat radiating means 13. Then the electric power outputted by this thermoelectric transducing element 12 is accumulated in a storage means 14.

公开(公告)号：JP2001044678A

公开(公告)日：2001-02-16

申请号：JP21736599

申请日：1999-07-30

Applicant: SONY CORP

Inventor： YAZAWA KAZUAKI

IPC: H05K7/20 ,  H01L23/427

Abstract: PROBLEM TO BE SOLVED: To obtain a cooling device which can sufficiently cool a heating element, such as the CPU, etc., even though the element generates a large quantity of heat. SOLUTION: A cooling device is constituted in such a structure that the heat generated from a heating element 6 is transferred to a heat radiating means 11 through a circulating pipe 14 and radiated from the means 11. At the same time, the electric power generated from a thermoelectric element 12 by the heat from the heating element 6 is utilized to efficiently transfer the heat from the heating element 6 to the heat radiating means 11, by making a heat conductive fluid in the circulating pipe 14 to flow.

公开(公告)号：JP2001044339A

公开(公告)日：2001-02-16

申请号：JP21736299

申请日：1999-07-30

Applicant: SONY CORP

Inventor： YAZAWA KAZUAKI

IPC: H01L23/34

Abstract: PROBLEM TO BE SOLVED: To sufficiently cool even semiconductor chips having large calorific values by forming fine asperities on the surface of a semiconductor substrate and causing such a surface to be used as a heat sink. SOLUTION: In order to cool a semiconductor chip 13 effectively, fine asperities made of a countless columnar projections 17 are formed on the surface of a semiconductor substrate 14. Furthermore, a piezoelectric film 18 as fluidizing means for fluidizing the air along the asperities-formed surface is provided. The film 18 is supported above the substrate 14 by some base means with a prescribed gap(g) maintained with respect to the substrate 14. By producing a traveling wave through vibration of the film 18 into a wavy form, the air is fluidized in one direction along the asperities-formed surface. As a result, the asperities on the surface of the substrate 14 function as a heat sink. Additionally, the air is fluidized along the asperities-formed surface, whereby the heat from the chip 13 can be radiated more efficiently.

公开(公告)号：JP2000286579A

公开(公告)日：2000-10-13

申请号：JP8906499

申请日：1999-03-30

Applicant: SONY CORP

Inventor： YAZAWA KAZUAKI ,  TOYODA JUNICHI

IPC: G06F1/20 ,  F25D1/00 ,  H05K7/20

Abstract: PROBLEM TO BE SOLVED: To efficiently cool a specific heat generation part with cooling mechanism that electronic equipment has. SOLUTION: In this cooling device, a jet-generating device 1 for jetting out cooling fluid in response to the heat generation surface side of a heat-generating device 11 is arranged, a piezoelectric element 12 is glued and fixed to the heat- generating device 11, voltage changing with a frequency lower than the audible frequency band is supplied from a voltage supply circuit 13 for driving, to achieve vibration with a frequency lower than the audible frequency band, and the heat-generating device 11 is vibrated with a frequency lower than the audible frequency band, and at the same time a specific heat generating part is cooled by cooling fluid being jetted out of the jet-generating device 1.

公开(公告)号：JP2000252401A

公开(公告)日：2000-09-14

申请号：JP5161899

申请日：1999-02-26

Applicant: SONY CORP

Inventor： YAZAWA KAZUAKI

IPC: H01L23/467

Abstract: PROBLEM TO BE SOLVED: To improve the cooling efficiency of the heat sink of a heat generating member. SOLUTION: The cooling apparatus 1 of a heat sink is provided with a forcedly air-cooling section 3 which forcedly cools the whole body of a heat sink member 2 with air and forcedly air-cooling sections 6 and 7 which forcedly cool part of the heat sink with air. Since the sections 6 and 7 suppress the formation of a boundary layer which prevents the heat absorbing action of a cooling wind flowing along the heat radiating fin sections 2B and 2C of the heat sink 2 when the heat sink 2 is forcedly cooled by means of the air-cooling section 3, the cooling efficiency of the heat sink 2 is improved.