公开(公告)号：IT1400576B1

公开(公告)日：2013-06-14

申请号：ITMI20101092

申请日：2010-06-17

Applicant: ST MICROELECTRONICS GRENOBLE 2 ,  ST MICROELECTRONICS SRL

Inventor： PONTAROLLO SERGE ,  RICCA MARIO ,  CAMIOLO JEAN ,  VAIANA MICHELE ,  BRUNO GIUSEPPE

IPC: G05F1/46

公开(公告)号：ITMI20101092A1

公开(公告)日：2011-12-18

申请号：ITMI20101092

申请日：2010-06-17

Applicant: ST MICROELECTRONICS GRENOBLE 2 ,  ST MICROELECTRONICS SRL

Inventor： BRUNO GIUSEPPE ,  CAMIOLO JEAN ,  PONTAROLLO SERGE ,  RICCA MARIO ,  VAIANA MICHELE

公开(公告)号：ITMI20111177A1

公开(公告)日：2012-12-29

申请号：ITMI20111177

申请日：2011-06-28

Applicant: ST MICROELECTRONICS SRL

Inventor： BIANCOLILLO PASQUALE ,  BRUNO GIUSEPPE ,  RECCHIA ANGELO ,  ROSSI STEFANO

公开(公告)号：DE60030417D1

公开(公告)日：2006-10-12

申请号：DE60030417

申请日：2000-05-08

Applicant: ST MICROELECTRONICS SRL

Inventor： LO VERDE DOMENICO ,  BRUNO GIUSEPPE

IPC: H01L23/58

Abstract: On a semiconductor material body (15) housing an electronic device (3) a peripheral region (22) of semiconductor material and at least one pad (20, 21) are initially formed. The peripheral region (22) is connected to a first terminal of the electronic device (3) and extends on at least one peripheral portion of the semiconductor material body (15). The pad (20, 21) is insulated from the semiconductor material body and is electrically connected to a second terminal of the electronic device (3). The semiconductor material body (15) is fixed to a support body (10) formed by a blank (5) belonging to a reel (1). The pad (20, 21) is connected by a wire (24) to an electrode (11, 12) formed by the blank (5). Next, a connection region (25a) is formed on the peripheral region (22) and surrounds, at least partially, the semiconductor material body (15) and the support body (10). The connection region (25a) is advantageously obtained by galvanic growth.