公开(公告)号：JP2000196025A

公开(公告)日：2000-07-14

申请号：JP36067199

申请日：1999-12-20

Applicant: ST MICROELECTRONICS INC

Inventor： ARNAUD EVE LUPERT ,  DANIEL A THOMAS ,  ANTONIO DOOBENTO-BIEIRA

IPC: H01L27/04 ,  A61B5/117 ,  G01B7/28 ,  G01B7/34 ,  G06K9/00 ,  G06T1/00 ,  H01L21/822

Abstract: PROBLEM TO BE SOLVED: To realize an integrated circuit, equipped with a contact between a pad and conductive layers for making electrostatic charges escape in a sensor, and a method for forming the contact. SOLUTION: A pad 38 and composite insulating layers 16 are formed between and on conductive plates on a substrate. The insulating layers 16 can separate the conductive plates and the pad 38 and protect them from damages, and the insulating layers 16 are provided with dielectric regions which are present at the lower side of a conductive layer. Passivation layers 32 are formed on at least one part of the insulating layers 16, and a photoresist is pattern-formed on at least one part of the passivation layers 32. An opening 36 is etching- formed so as to be put through the passivation layers 32 and the insulating layers 16, and the photoresist and the conductive layer are used as a mask, in this case. Then, conductive materials are adhered in the opening 36, and an electric contact between the pad 38 and the conductive layer is formed.

公开(公告)号：JP2000196024A

公开(公告)日：2000-07-14

申请号：JP36057799

申请日：1999-12-20

Applicant: ST MICROELECTRONICS INC

Inventor： ARNAUD EVE LUPERT ,  DANIEL A THOMAS ,  ANTONIO DOOBENTO-BIEIRA

IPC: H01L27/04 ,  A61B5/117 ,  G01B7/28 ,  G01B7/34 ,  G06K9/00 ,  G06T1/00 ,  H01L21/822

Abstract: PROBLEM TO BE SOLVED: To scatter electrostatic charge so as to improve a sensor array in electrostatic discharge protection, by a method wherein a conductive plate is separated off, a dielectric layer is provided to protect the conductive plate against damage, and furthermore an insulating layer is provided on the conductive plate. SOLUTION: Cells 3a and 3b are possessed of a first conductive plate 10 and a second conductive plate 12 supported on a semiconductor substrate respectively. An insulating layer 16 is provided on the top surface of the semiconductor substrate. A conductive layer is formed on the insulating layer 16 to protect the semiconductor substrate against damage caused by electrostatic discharge induced by an electrostatic potential carried by an object such as fingers or the like. Dielectric layers 29a and 29b are each provided on the conductive plates 10 and 12 so as to separate them from one another. Conductive pads are each formed on the dielectric layers 29a and 29b. A passivation film 34 is deposited on the conductive layer.