ELECTROSTATIC CHARGE DISSIPATING PAD FOR SENSOR

    公开(公告)号:JP2000205812A

    公开(公告)日:2000-07-28

    申请号:JP35691899

    申请日:1999-12-16

    Abstract: PROBLEM TO BE SOLVED: To improve protection of a fingerprint sensor from electrostatic discharge by forming a composite insulating layer with dielectric regions between and on a plurality of conductive plates to isolate the conductive plates and protecting them from damage. SOLUTION: The conductive plates 10 and 12 of a single capacitance coupling sensor cell 3 have approximately the same surface area. The inside plate 12 acts as a half of one electrode of the sensor 3, and the outside plate 10 acts as an opposing capacitor electrode as a complementary half of the same and one capacitor electrode to interact with an object 22 such as a finger. Insulating layers 16 with dielectric regions are provided between the plates 10 and 12 and a discharging pad 40 provided on their surfaces. The degree of conductivity of the discharging pad 40 is sufficient for transferring electrostatic charge which occurs on the surfaces of the sensor cell 3 in the insulating layers 16 and the discharging pad 40 for protecting the electronic components of the sensor cell 3.

    ELECTROSTATIC DISCHARGE PROTECTION FOR SENSOR

    公开(公告)号:JP2000196026A

    公开(公告)日:2000-07-14

    申请号:JP36093299

    申请日:1999-12-20

    Abstract: PROBLEM TO BE SOLVED: To enhance a sensor in electrostatic discharge protection by a method wherein a composite insulating layer is formed between conductive plates and above them to isolate the conductive plates, and the conductive plates are protected against damage. SOLUTION: Pixels are formed on a silicon substrate 13. A dielectric layer 30 is formed on the conductive plates 10 and 12 and the substrate 13 through a plasma enhancement vapor growth method so as to be thick enough to electrically isolate the conductive plates 10 and 12 and the substrate 13. The dielectric layer 30 is a composite layer composed of a first dielectric layer 30' and a second dielectric layer 32 which are each formed of suitable dielectric material that has a required dielectric constant. A conductive layer 32 is provided on a part of the dielectric layer 30. The thickness of the dielectric layer 30 is properly determined depending on the resistivity level of dielectric material to a conductive material in a layer 16 so as to ensure the dielectric layer 30 of an electric charge carrying capacity and a damage protection properties.

    DEVICE AND METHOD FOR BRINGING CONDUCTIVE LAYER INTO CONTACT

    公开(公告)号:JP2000196025A

    公开(公告)日:2000-07-14

    申请号:JP36067199

    申请日:1999-12-20

    Abstract: PROBLEM TO BE SOLVED: To realize an integrated circuit, equipped with a contact between a pad and conductive layers for making electrostatic charges escape in a sensor, and a method for forming the contact. SOLUTION: A pad 38 and composite insulating layers 16 are formed between and on conductive plates on a substrate. The insulating layers 16 can separate the conductive plates and the pad 38 and protect them from damages, and the insulating layers 16 are provided with dielectric regions which are present at the lower side of a conductive layer. Passivation layers 32 are formed on at least one part of the insulating layers 16, and a photoresist is pattern-formed on at least one part of the passivation layers 32. An opening 36 is etching- formed so as to be put through the passivation layers 32 and the insulating layers 16, and the photoresist and the conductive layer are used as a mask, in this case. Then, conductive materials are adhered in the opening 36, and an electric contact between the pad 38 and the conductive layer is formed.

    DEVICE AND METHOD OF CONTACTING SENSOR CONDUCTIVE LAYER

    公开(公告)号:JP2000196024A

    公开(公告)日:2000-07-14

    申请号:JP36057799

    申请日:1999-12-20

    Abstract: PROBLEM TO BE SOLVED: To scatter electrostatic charge so as to improve a sensor array in electrostatic discharge protection, by a method wherein a conductive plate is separated off, a dielectric layer is provided to protect the conductive plate against damage, and furthermore an insulating layer is provided on the conductive plate. SOLUTION: Cells 3a and 3b are possessed of a first conductive plate 10 and a second conductive plate 12 supported on a semiconductor substrate respectively. An insulating layer 16 is provided on the top surface of the semiconductor substrate. A conductive layer is formed on the insulating layer 16 to protect the semiconductor substrate against damage caused by electrostatic discharge induced by an electrostatic potential carried by an object such as fingers or the like. Dielectric layers 29a and 29b are each provided on the conductive plates 10 and 12 so as to separate them from one another. Conductive pads are each formed on the dielectric layers 29a and 29b. A passivation film 34 is deposited on the conductive layer.

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