公开(公告)号：FR2826509A1

公开(公告)日：2002-12-27

申请号：FR0108427

申请日：2001-06-26

Applicant: ST MICROELECTRONICS SA

Inventor： FOURNEL RICHARD ,  CANDELIER PHILIPPE ,  COLOMBET NORBERT

IPC: H01L23/367 ,  H01L23/525 ,  H01L23/552

Abstract: The multilayer semiconductor device (1) of integrated electronic components comprises at least one electrical connection strip constituting a strip-fuse (2) in at least one layer, laid out so that it can be severed and whose extremity is connected to at least one integrated electronic component (4), and intermediate elements (5) for electrical connection and thermal dissipation. The intermediate elements (5) comprise at least one electrical connection strip extending in the form of a streamer (11), which is connected to the strip-fuse (2), through the thermal dissipation elements (6). The device also comprises a thermal screen (13) which is electrically insulated and placed in the immediate neighborhood of the strip-fuse (2), between the strip-fuse and the integrated electronic component. The intermediate elements (5) comprise the thermal dissipation strips (7) extending in different layers and connected by feedthroughs (8), in particular in a direction parallel to the strip-fuse. The screen (13) extends between the strip-fuse (2) and the intermediate elements (5), and the intermediate elements extensions (9) cross the screen (13). The screen (13) comprises strips spaced one from another and extended in different layers, placed one above another and connected by feedthroughs (15); this strip-screen extends perpendicular to the strip-fuse (2). The device comprises at least one protection diode (16) connected to the intermediate elements for electrical connection. The strip-fuse (2) can be severed by a laser beam directed to the bottom of a cavity (18).