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157 records (took 0.069 seconds)

    1.
    发明专利
    未知

    公开(公告)号：DE602004023457D1

    公开(公告)日：2009-11-19

    申请号：DE602004023457

    申请日：2004-06-29

    Applicant: ST MICROELECTRONICS SA ,  COMMISSARIAT ENERGIE ATOMIQUE

    Inventor： ROBERT PHILIPPE ,  ANCEY PASCAL ,  CARUYER GREGORY

    IPC: H03H3/04 ,  H03H9/17

    Abstract: The resonator has a piezoelectric layer (3) placed between two electrodes (1, 2). An electrical heating resistor (9) is placed in thermal contact with the electrode (1). The temporary heating of the electrode (1) permits to partially evaporate a material constituting the electrode (1) to make the electrode (1) thinner for adjusting resonance frequency. An independent claim is also included for a method of producing a thin film bulk acoustic resonator or a solidly mounted resonator.

    2.
    发明专利
    未知

    公开(公告)号：FR2857785A1

    公开(公告)日：2005-01-21

    申请号：FR0308715

    申请日：2003-07-17

    Applicant: COMMISSARIAT ENERGIE ATOMIQUE ,  ST MICROELECTRONICS SA

    Inventor： ROBERT PHILIPPE ,  ANCEY PASCAL ,  CARUYER GREGORY

    IPC: H03H3/04 ,  H03H9/17 ,  H01L41/047

    Abstract: The resonator has a piezoelectric layer (3) placed between two electrodes (1, 2). An electrical heating resistor (9) is placed in thermal contact with the electrode (1). The temporary heating of the electrode (1) permits to partially evaporate a material constituting the electrode (1) to make the electrode (1) thinner for adjusting resonance frequency. An independent claim is also included for a method of producing a thin film bulk acoustic resonator or a solidly mounted resonator.

    4.
    发明专利
    未知

    公开(公告)号：AT445259T

    公开(公告)日：2009-10-15

    申请号：AT04354025

    申请日：2004-06-29

    Applicant: COMMISSARIAT ENERGIE ATOMIQUE ,  ST MICROELECTRONICS SA

    Inventor： ROBERT PHILIPPE ,  ANCEY PASCAL ,  CARUYER GREGORY

    IPC: H03H3/04 ,  H03H9/17

    Abstract: The resonator has a piezoelectric layer (3) placed between two electrodes (1, 2). An electrical heating resistor (9) is placed in thermal contact with the electrode (1). The temporary heating of the electrode (1) permits to partially evaporate a material constituting the electrode (1) to make the electrode (1) thinner for adjusting resonance frequency. An independent claim is also included for a method of producing a thin film bulk acoustic resonator or a solidly mounted resonator.

    5.
    发明专利
    未知

    公开(公告)号：FR2857785B1

    公开(公告)日：2005-10-21

    申请号：FR0308715

    申请日：2003-07-17

    Applicant: COMMISSARIAT ENERGIE ATOMIQUE ,  ST MICROELECTRONICS SA

    Inventor： ROBERT PHILIPPE ,  ANCEY PASCAL ,  CARUYER GREGORY

    IPC: H03H3/04 ,  H03H9/17 ,  H01L41/047

    Abstract: The resonator has a piezoelectric layer (3) placed between two electrodes (1, 2). An electrical heating resistor (9) is placed in thermal contact with the electrode (1). The temporary heating of the electrode (1) permits to partially evaporate a material constituting the electrode (1) to make the electrode (1) thinner for adjusting resonance frequency. An independent claim is also included for a method of producing a thin film bulk acoustic resonator or a solidly mounted resonator.

    LOW CONSUMPTION AND LOW ACTUATION VOLTAGE MICROSWITCH
    6.
    发明申请
    LOW CONSUMPTION AND LOW ACTUATION VOLTAGE MICROSWITCH 审中-公开
    低消耗和低电压电压微波

    公开(公告)号：WO2005101434A3

    公开(公告)日：2006-01-12

    申请号：PCT/FR2005000815

    申请日：2005-04-04

    Applicant: COMMISSARIAT ENERGIE ATOMIQUE ,  ROBERT PHILIPPE

    Inventor： ROBERT PHILIPPE

    IPC: H01H59/00 ,  B81B3/00 ,  H01H61/01 ,  H01P1/12

    CPC classification number: H01H59/0009 ,  H01H61/0107 ,  H01H2001/0063 ,  H01H2001/0084

    Abstract: A microswitch comprises a deformable membrane (12) including two substantially parallel flexure arms (13), attached to a substrate via at least one end thereof and comprising thermal actuating means (4). An elongated contact arm (14), substantially parallel with the flexure arms (13), is arranged therebetween and attached thereto at the high deformation areas thereof. The contact arm (14) moves in a direction substantially parallel to the substrate upon actuation of the microswitch, and comprises electrostatic holding electrodes (15) and a conducting pad (6).

    Abstract translation: 微型开关包括可变形膜（12），其包括两个基本上平行的挠曲臂（13），其经由其至少一端附接到基板并且包括热致动装置（4）。 基本上平行于弯曲臂（13）的细长的接触臂（14）被布置在它们之间并且在其高变形区域处附接到其上。 接触臂（14）在微型开关致动时沿基本上平行于基板的方向移动，并且包括静电保持电极（15）和导电垫（6）。

    METHOD FOR MAKING A PLANAR SUSPENDED MICROSTRUCTURE, USING A SACRIFICIAL LAYER OF POLYMER MATERIAL AND RESULTING COMPONENT
    7.
    发明申请
    METHOD FOR MAKING A PLANAR SUSPENDED MICROSTRUCTURE, USING A SACRIFICIAL LAYER OF POLYMER MATERIAL AND RESULTING COMPONENT 审中-公开
    使用聚合物材料的牺牲层和导致组分制备平面悬挂微结构的方法

    公开(公告)号：WO2004056698A3

    公开(公告)日：2004-11-11

    申请号：PCT/FR0303789

    申请日：2003-12-18

    Applicant: COMMISSARIAT ENERGIE ATOMIQUE ,  ROBERT PHILIPPE ,  MICHEL FRANCE ,  MAEDER-PACHURKA CATHERINE ,  SILLON NICOLAS

    Inventor： ROBERT PHILIPPE ,  MICHEL FRANCE ,  MAEDER-PACHURKA CATHERINE ,  SILLON NICOLAS

    IPC: B81B3/00 ,  B81C1/00

    CPC classification number: B81C1/00611 ,  B81C2201/0108 ,  B81C2201/0125 ,  H01L2924/01082

    Abstract: The invention concerns a method which consists in successively depositing a polymeric sacrificial layer (2), depositing, on at least part of the substrate (1) and the front surface of the sacrificial layer (2), an embedding layer (6), with a thickness greater than that of the sacrificial layer (2) and performing planarization such that the front surfaces of the sacrificial layer (2) and of the embedding layer (6) form a common planar surface. A forming layer (3) of a suspended structure (5) is deposited on the front face of the common planar surface. The planarization can include chemical mechanical polishing and etching the embedding layer (6). Etching the sacrificial layer (2) can be performed by means of a mask, formed on the front surface of a polymer material layer, removed during the planarization step.

    Abstract translation: 本发明涉及一种方法，其包括连续地沉积聚合物牺牲层（2），在基底（1）的至少一部分和牺牲层（2）的前表面上沉积嵌入层（6），其中 厚度大于所述牺牲层（2）的厚度并且执行平坦化，使得所述牺牲层（2）和所述嵌入层（6）的所述前表面形成共同的平坦表面。 悬浮结构（5）的形成层（3）沉积在共同平面的正面上。 平面化可以包括化学机械抛光和蚀刻嵌入层（6）。 蚀刻牺牲层（2）可以通过在平坦化步骤期间去除的聚合物材料层的前表面上形成的掩模来执行。

    PROCEDE DE REALISATION D'UNE CAVITE ETANCHE A COUCHE MINCE
    10.
    发明专利
    PROCEDE DE REALISATION D'UNE CAVITE ETANCHE A COUCHE MINCE 未知

    公开(公告)号：FR3074358A1

    公开(公告)日：2019-05-31

    申请号：FR1761274

    申请日：2017-11-28

    Applicant: COMMISSARIAT ENERGIE ATOMIQUE

    Inventor： ROBERT PHILIPPE ,  GIROUD SOPHIE

    IPC: H01L21/02 ,  H01L21/98 ,  H01L21/56

    Abstract: Procédé de réalisation d'un système d'encapsulation comportant : - la fabrication d'un premier élément comprenant, à partir d'un premier substrat, les étapes de formation d'une zone fragilisée de sorte définir une couche mince et une couche support, - l'assemblage du premier élément avec un deuxième élément de sorte que la couche mince soit disposée entre le deuxième élément et la couche support, - le retrait de la couche support par séparation de la couche support et de la couche mince au niveau de la zone fragilisée.

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