公开(公告)号：IT201900000929A1

公开(公告)日：2020-07-22

申请号：IT201900000929

申请日：2019-01-22

Applicant: ST MICROELECTRONICS SRL

Inventor： ARRIGONI ALBERTO ,  GRAZIOSI GIOVANNI ,  SANNA AURORA

IPC: H01L20060101

公开(公告)号：ITUA20162740A1

公开(公告)日：2017-10-20

申请号：ITUA20162740

申请日：2016-04-20

Applicant: ST MICROELECTRONICS SRL

Inventor： ARRIGONI ALBERTO

IPC: H01L23/495

公开(公告)号：ITUB20155696A1

公开(公告)日：2017-05-18

申请号：ITUB20155696

申请日：2015-11-18

Applicant: ST MICROELECTRONICS SRL

Inventor： ARRIGONI ALBERTO ,  DA DALT ALBERTO

IPC: H01L23/495

Abstract: A semiconductor device includes a quadrilateral package with a first pair of opposed sides and a second pair of opposed sides. Both sides of the first pair of opposed sides are provided with electrical contact leads. Only one side of the second pair of opposed sides is provided with electrical contact leads. The side of the second pair of opposed sides without electrical contact leads is a leadless side. That side is not a molded side of the package, but rather is defined by a cut surface.

公开(公告)号：IT201900009585A1

公开(公告)日：2020-12-20

申请号：IT201900009585

申请日：2019-06-20

Applicant: ST MICROELECTRONICS SRL

Inventor： ARRIGONI ALBERTO

IPC: H01L20060101

公开(公告)号：ITUB20155111A1

公开(公告)日：2017-05-04

申请号：ITUB20155111

申请日：2015-11-04

Applicant: ST MICROELECTRONICS SRL

Inventor： MAGNI PIERANGELO ,  ARRIGONI ALBERTO

IPC: H01L23/485 ,  H01L21/60 ,  H01L21/66

Abstract: In an embodiment, a semiconductor device includes: a mounting substrate having electrically conductive formations thereon, a semiconductor die coupled with the mounting substrate, the semiconductor die with electrical contact pillars facing towards the mounting substrate, an anisotropic conductive membrane between the semiconductor die and the mounting substrate, the membrane compressed between the electrical contact pillars and the mounting substrate to provide electrical contact between the electrical contact pillars of the semiconductor die and the electrically conductive formations on the mounting substrate.