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    METHOD FOR FORMING PROTECTIVE PACKAGE AND MOLD FOR FORMING PROTECTIVE PACKAGE
    1.
    发明专利
    METHOD FOR FORMING PROTECTIVE PACKAGE AND MOLD FOR FORMING PROTECTIVE PACKAGE 审中-公开

    公开(公告)号：JP2002261108A

    公开(公告)日：2002-09-13

    申请号：JP2001401896

    申请日：2001-12-28

    Applicant: ST MICROELECTRONICS SRL

    Inventor： MAGNI PIERANGELO ,  CIGADA ANDREA

    IPC: G01L19/14 ,  H01L21/56 ,  H01L23/02

    Abstract: PROBLEM TO BE SOLVED: To provide a protective package for an electronic device where yield is improved without damaging an electronic device stored therein. SOLUTION: A method for forming the protective package comprises a step of using a mold 10, the mold comprising a half mold 15 that has a lug directing toward the inside of the mold, the lug being capable of elastic deformation and comprising one end having an element 17 that comes into contact with at least a part of an electronic circuit 13 by pressurizing contact, and a step of injecting resin into the mold so that the protective package has a hole part aligned with at least the part of the electronic circuit.

    CHIP PACKAGE FOR CIRCUIT AND MANUFACTURE THEREOF
    2.
    发明专利
    CHIP PACKAGE FOR CIRCUIT AND MANUFACTURE THEREOF 失效

    公开(公告)号：JPH07169885A

    公开(公告)日：1995-07-04

    申请号：JP26730294

    申请日：1994-10-31

    Applicant: ST MICROELECTRONICS SRL

    Inventor： CELLAI MARINO ,  MAGNI PIERANGELO

    IPC: H01L23/34 ,  H01L21/56 ,  H01L23/433

    Abstract: PURPOSE: To provide an improved chip package which can have improved reliability and extended effective life-time and also can have structural and functional characteristics which is superior than those of a known prior art which have bent proposed thus far. CONSTITUTION: In a chip package, a thermally dissipating device is arranged separately to the both sides of a circuit chip 3 and a support frame 4. In a preferred embodiment, the thermally dissipating device has at least two thermally dissipating elements 15 and 16, which are structurally independent from each other and make contact with each other. The two thermally dissipating elements 15 and 16 are arranged on the support frame 4, symmetrically with respect to the left and right the frame 4.

    ASSEMBLY OF A MICROFLUIDIC DEVICE FOR ANALYSIS OF BIOLOGICAL MATERIAL
    3.
    发明申请
    ASSEMBLY OF A MICROFLUIDIC DEVICE FOR ANALYSIS OF BIOLOGICAL MATERIAL 审中-公开
    用于分析生物材料的微流体装置的组装

    公开(公告)号：WO2007148358A8

    公开(公告)日：2008-06-19

    申请号：PCT/IT2006000485

    申请日：2006-06-23

    Applicant: ST MICROELECTRONICS SRL ,  BRIOSCHI ROBERTO ,  MAGNI PIERANGELO

    Inventor： BRIOSCHI ROBERTO ,  MAGNI PIERANGELO

    IPC: B01L3/00

    CPC classification number: B01L3/502707 ,  B01L2200/027 ,  B01L2200/10 ,  B01L2300/043 ,  B01L2300/0609 ,  B01L2300/0867 ,  B01L2300/123 ,  B01L2300/1805 ,  B01L2400/0481 ,  B01L2400/0622 ,  B01L2400/0638 ,  B01L2400/0644 ,  Y10T436/25 ,  Y10T436/2575

    Abstract: In a microfluidic assembly (20), a microfluidic device (1') is provided with a body (4) in which at least a first inlet (7) for loading a fluid to analyse and a buried area (8) in fluidic communication with the first inlet (7) are defined. An analysis chamber (10') is in fluidic communication with the buried area (8) and an interface cover (23) is coupled in a fluid-tight manner above the microfluidic device (1'). The interface cover (23) is provided with a sealing portion (35) in correspondence to the analysis chamber (10'), adapted to assume a first configuration, at rest, in which it leaves the analysis chamber (10') open, and a second configuration, as a consequence of a stress, in which it closes in a fluid-tight manner the same analysis chamber.

    Abstract translation: 在微流体组件（20）中，微流体装置（1'）设置有主体（4），其中至少第一入口（7）用于装载要分析的流体和与该流体相通的埋入区域（8） 第一入口（7）被定义。 分析室（10'）与埋藏区域（8）流体连通，并且界面盖（23）以流体密封的方式联接在微流体装置（1'）上方。 界面盖（23）设置有与分析室（10'）相对应的密封部分（35），适于呈现静止状态的第一构造，其中离开分析室（10'）打开，并且 作为应力的结果的第二构造，其以不流体密封的方式封闭相同的分析室。

    4.
    发明专利
    未知

    公开(公告)号：DE69330249T2

    公开(公告)日：2001-12-06

    申请号：DE69330249

    申请日：1993-10-29

    Applicant: ST MICROELECTRONICS SRL

    Inventor： CELLAI MARINO ,  MAGNI PIERANGELO

    IPC: H01L23/34 ,  H01L21/56 ,  H01L23/433

    Abstract: A chip package of the type incorporating in a body shell of synthetic plastic material (2) at least one integrated electronic circuit and semiconductor chip (3) mounted on a chip support frame (4) and a heat dissipating device (5) in contact with said chip (3) provides that the heat dissipating device (5) have at least two structurally independent heat dissipating elements (15,16) in mutual contact. The two heat dissipating elements (15,16) are located on opposite sides of said support frame (4) and arranged symmetrically in relation to said frame (4). In addition, said heat dissipating elements (15,16) are interconnected in a separable manner by self-centring spacing posts (12,13).

    5.
    发明专利
    未知

    公开(公告)号：ITUB20155111A1

    公开(公告)日：2017-05-04

    申请号：ITUB20155111

    申请日：2015-11-04

    Applicant: ST MICROELECTRONICS SRL

    Inventor： MAGNI PIERANGELO ,  ARRIGONI ALBERTO

    IPC: H01L23/485 ,  H01L21/60 ,  H01L21/66

    Abstract: In an embodiment, a semiconductor device includes: a mounting substrate having electrically conductive formations thereon, a semiconductor die coupled with the mounting substrate, the semiconductor die with electrical contact pillars facing towards the mounting substrate, an anisotropic conductive membrane between the semiconductor die and the mounting substrate, the membrane compressed between the electrical contact pillars and the mounting substrate to provide electrical contact between the electrical contact pillars of the semiconductor die and the electrically conductive formations on the mounting substrate.

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