公开(公告)号：JPH07169885A

公开(公告)日：1995-07-04

申请号：JP26730294

申请日：1994-10-31

Applicant: ST MICROELECTRONICS SRL

Inventor： CELLAI MARINO ,  MAGNI PIERANGELO

IPC: H01L23/34 ,  H01L21/56 ,  H01L23/433

Abstract: PURPOSE: To provide an improved chip package which can have improved reliability and extended effective life-time and also can have structural and functional characteristics which is superior than those of a known prior art which have bent proposed thus far. CONSTITUTION: In a chip package, a thermally dissipating device is arranged separately to the both sides of a circuit chip 3 and a support frame 4. In a preferred embodiment, the thermally dissipating device has at least two thermally dissipating elements 15 and 16, which are structurally independent from each other and make contact with each other. The two thermally dissipating elements 15 and 16 are arranged on the support frame 4, symmetrically with respect to the left and right the frame 4.

公开(公告)号：DE69330249D1

公开(公告)日：2001-06-28

申请号：DE69330249

申请日：1993-10-29

Applicant: ST MICROELECTRONICS SRL

Inventor： CELLAI MARINO ,  MAGNI PIERANGELO

IPC: H01L23/34 ,  H01L21/56 ,  H01L23/433

Abstract: A chip package of the type incorporating in a body shell of synthetic plastic material (2) at least one integrated electronic circuit and semiconductor chip (3) mounted on a chip support frame (4) and a heat dissipating device (5) in contact with said chip (3) provides that the heat dissipating device (5) have at least two structurally independent heat dissipating elements (15,16) in mutual contact. The two heat dissipating elements (15,16) are located on opposite sides of said support frame (4) and arranged symmetrically in relation to said frame (4). In addition, said heat dissipating elements (15,16) are interconnected in a separable manner by self-centring spacing posts (12,13).

公开(公告)号：DE69330249T2

公开(公告)日：2001-12-06

申请号：DE69330249

申请日：1993-10-29

Applicant: ST MICROELECTRONICS SRL

Inventor： CELLAI MARINO ,  MAGNI PIERANGELO

IPC: H01L23/34 ,  H01L21/56 ,  H01L23/433

Abstract: A chip package of the type incorporating in a body shell of synthetic plastic material (2) at least one integrated electronic circuit and semiconductor chip (3) mounted on a chip support frame (4) and a heat dissipating device (5) in contact with said chip (3) provides that the heat dissipating device (5) have at least two structurally independent heat dissipating elements (15,16) in mutual contact. The two heat dissipating elements (15,16) are located on opposite sides of said support frame (4) and arranged symmetrically in relation to said frame (4). In addition, said heat dissipating elements (15,16) are interconnected in a separable manner by self-centring spacing posts (12,13).