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    BALL ALIGNING SYSTEM FOR BGA DEVICE
    1.
    发明专利
    BALL ALIGNING SYSTEM FOR BGA DEVICE 失效

    公开(公告)号：JPH11150210A

    公开(公告)日：1999-06-02

    申请号：JP25481698

    申请日：1998-09-09

    Applicant: ST MICROELECTRONICS SRL

    Inventor： TONDELLI FULVIO SILVIO ,  CIGADA ANDREA GIOVANNI

    IPC: B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H01L23/12 ,  H01L23/498 ,  H05K3/34

    Abstract: PROBLEM TO BE SOLVED: To provide a ball aligning system which is capable of realizing a complete array alignment, when balls are dropped from an aligning grid, taking advantage not of vacuum but of free fall. SOLUTION: This system includes first and second plates 1 and 2 moving relative to each other and a filling means 4 movable along the top surface of the plate 1 with the bottom surface of the means 4 contacted with the top surface of the plate 1. The plates 1 and 2 have holed regions 1a and 2a having a ball array corresponding to a ball aligned state on a ball grid array(BGA) device respectively. Since balls in the respective holed regions 1a and 2a are mutually shifted, the balls received in the holes of the plate 1 can be moved through the holes of the plate 2 for falling. The filling means 4 is a container which stocks therein a large number of balls, and which can be moved between the holed region 1a of the plate 1 and a region thereof, other than the holed region 1a. When the means is moved up to the holed region 1a, the means supplies the balls into the respective holes of the holed regions.

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