公开(公告)号：DE602004010905D1

公开(公告)日：2008-02-07

申请号：DE602004010905

申请日：2004-08-31

Applicant: ST MICROELECTRONICS SRL

Inventor： TIZIANI ROBERTO ,  FREZZA GIOVANNI

IPC: G06K19/077 ,  G06K19/04

Abstract: The present invention relates to a method for manufacturing a fully moulded Multi Media Card package (5) obtained by laser cutting wherein at least some edges and the corners around the package have rounded profile and a sufficient smoothness for a safe handling. The method is defined by the following steps: providing a rounded groove (4) on a substrate (2) back side (8) of the package, all around the package profile; cutting the edges of said package (5) by a laser cutting line (9) passing through said groove (4). This new technique permits to use all the 24.0 mm width of the MMC package for the substrate 2, thus increasing the surface available for electronic components.

公开(公告)号：DE60126291D1

公开(公告)日：2007-03-15

申请号：DE60126291

申请日：2001-11-16

Applicant: ST MICROELECTRONICS SRL

Inventor： SASSOLINI SIMONE ,  DEL SARTO MARCO ,  FREZZA GIOVANNI ,  BALDO LORENZO

IPC: B81C1/00 ,  B81B7/00

公开(公告)号：DE60105375T2

公开(公告)日：2005-09-22

申请号：DE60105375

申请日：2001-11-29

Applicant: ST MICROELECTRONICS SRL

Inventor： FREZZA GIOVANNI

IPC: H01L21/56

公开(公告)号：ITMI20011965A1

公开(公告)日：2003-03-21

申请号：ITMI20011965

申请日：2001-09-21

Applicant: ST MICROELECTRONICS SRL

Inventor： TIZIANI ROBERTO ,  FREZZA GIOVANNI

IPC: H01L23/31 ,  H01L23/495 ,  H05K3/34

Abstract: The present invention relates to leads of a No-Lead type package which includes a chip having an active surface and a rear surface opposite the active surface. The active surface has a plurality of connection points with a plurality of leads arranged around the perimeter of the chip and a first and a second surface orthogonal to said first surface. A plurality of connection wires connect electrically the bonding pads of the chip to the first surface of the leads respectively. The package also includes a welding compound suitable for encapsulating the chip, the first surface of the leads and the bonding pads. The leads possess at least one hole in the second surface of the leads.

公开(公告)号：DE60126291T2

公开(公告)日：2007-10-18

申请号：DE60126291

申请日：2001-11-16

Applicant: ST MICROELECTRONICS SRL

Inventor： SASSOLINI SIMONE ,  DEL SARTO MARCO ,  FREZZA GIOVANNI ,  BALDO LORENZO

IPC: B81C1/00 ,  B81B7/00

公开(公告)号：DE60105375D1

公开(公告)日：2004-10-14

申请号：DE60105375

申请日：2001-11-29

Applicant: ST MICROELECTRONICS SRL

Inventor： FREZZA GIOVANNI

IPC: H01L21/56

公开(公告)号：ITMI20022767A1

公开(公告)日：2004-06-25

申请号：ITMI20022767

申请日：2002-12-24

Applicant: ST MICROELECTRONICS SRL

Inventor： FREZZA GIOVANNI

IPC: H01L20060101 ,  H01L21/98 ,  H01L25/065

公开(公告)号：ITMI20011965D0

公开(公告)日：2001-09-21

申请号：ITMI20011965

申请日：2001-09-21

Applicant: ST MICROELECTRONICS SRL

Inventor： TIZIANI ROBERTO ,  FREZZA GIOVANNI

IPC: H01L23/31 ,  H01L23/495 ,  H05K3/34

Abstract: The present invention relates to leads of a No-Lead type package which includes a chip having an active surface and a rear surface opposite the active surface. The active surface has a plurality of connection points with a plurality of leads arranged around the perimeter of the chip and a first and a second surface orthogonal to said first surface. A plurality of connection wires connect electrically the bonding pads of the chip to the first surface of the leads respectively. The package also includes a welding compound suitable for encapsulating the chip, the first surface of the leads and the bonding pads. The leads possess at least one hole in the second surface of the leads.